CA2597058C - Embedded toroidal inductor - Google Patents

Embedded toroidal inductor Download PDF

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Publication number
CA2597058C
CA2597058C CA2597058A CA2597058A CA2597058C CA 2597058 C CA2597058 C CA 2597058C CA 2597058 A CA2597058 A CA 2597058A CA 2597058 A CA2597058 A CA 2597058A CA 2597058 C CA2597058 C CA 2597058C
Authority
CA
Canada
Prior art keywords
substrate
conductive
toroidal
conductive traces
define
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA2597058A
Other languages
English (en)
French (fr)
Other versions
CA2597058A1 (en
Inventor
Michael Pleskach
Andrew J. Thomson
Bayardo A. Payan
Terry Provo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harris Corp
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Publication of CA2597058A1 publication Critical patent/CA2597058A1/en
Application granted granted Critical
Publication of CA2597058C publication Critical patent/CA2597058C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2814—Printed windings with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
CA2597058A 2005-02-10 2006-02-06 Embedded toroidal inductor Expired - Fee Related CA2597058C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/055,154 2005-02-10
US11/055,154 US7158005B2 (en) 2005-02-10 2005-02-10 Embedded toroidal inductor
PCT/US2006/003989 WO2006086260A1 (en) 2005-02-10 2006-02-06 Embedded toroidal inductor

Publications (2)

Publication Number Publication Date
CA2597058A1 CA2597058A1 (en) 2006-08-17
CA2597058C true CA2597058C (en) 2011-10-25

Family

ID=36779363

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2597058A Expired - Fee Related CA2597058C (en) 2005-02-10 2006-02-06 Embedded toroidal inductor

Country Status (8)

Country Link
US (1) US7158005B2 (zh)
EP (1) EP1854110A1 (zh)
JP (1) JP4865732B2 (zh)
KR (1) KR100942337B1 (zh)
CN (1) CN101156223B (zh)
CA (1) CA2597058C (zh)
TW (1) TWI321327B (zh)
WO (1) WO2006086260A1 (zh)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101553890A (zh) 2006-11-14 2009-10-07 美商·帕斯脉冲工程有限公司 无线感应装置及其制造方法
US9070509B2 (en) 2007-01-11 2015-06-30 Tyco Electronics Corporation Method for manufacturing a planar electronic device having a magnetic component
US7375611B1 (en) 2007-04-19 2008-05-20 Harris Corporation Embedded step-up toroidal transformer
US7982572B2 (en) * 2008-07-17 2011-07-19 Pulse Engineering, Inc. Substrate inductive devices and methods
TWI394185B (zh) * 2009-07-01 2013-04-21 Delta Electronics Inc 磁性組件及其組裝方法
US9823274B2 (en) 2009-07-31 2017-11-21 Pulse Electronics, Inc. Current sensing inductive devices
US9664711B2 (en) 2009-07-31 2017-05-30 Pulse Electronics, Inc. Current sensing devices and methods
US8567046B2 (en) * 2009-12-07 2013-10-29 General Electric Company Methods for making magnetic components
US9440378B2 (en) 2010-05-05 2016-09-13 Tyco Electronics Corporation Planar electronic device and method for manufacturing
US8358193B2 (en) 2010-05-26 2013-01-22 Tyco Electronics Corporation Planar inductor devices
US8466769B2 (en) 2010-05-26 2013-06-18 Tyco Electronics Corporation Planar inductor devices
US8384507B2 (en) * 2010-06-01 2013-02-26 Qualcomm Incorporated Through via inductor or transformer in a high-resistance substrate with programmability
US8591262B2 (en) 2010-09-03 2013-11-26 Pulse Electronics, Inc. Substrate inductive devices and methods
CN102738128B (zh) 2011-03-30 2015-08-26 香港科技大学 大电感值集成磁性感应器件及其制造方法
KR101359705B1 (ko) * 2011-09-22 2014-02-10 주식회사 코리아썬엘이디 조립식 코일을 구비한 트로이덜형 인덕터
WO2013130842A1 (en) 2012-03-02 2013-09-06 Pulse Electronics, Inc. Deposition antenna apparatus and methods
US9304149B2 (en) 2012-05-31 2016-04-05 Pulse Electronics, Inc. Current sensing devices and methods
US20140043130A1 (en) * 2012-08-10 2014-02-13 Tyco Electronics Corporation Planar electronic device
US20140125446A1 (en) 2012-11-07 2014-05-08 Pulse Electronics, Inc. Substrate inductive device methods and apparatus
US9190204B1 (en) * 2013-05-12 2015-11-17 Marion Harlan Cates, Jr. Multilayer printed circuit board having circuit trace windings
US20150035162A1 (en) * 2013-08-02 2015-02-05 Qualcomm Incorporated Inductive device that includes conductive via and metal layer
US10020561B2 (en) 2013-09-19 2018-07-10 Pulse Finland Oy Deposited three-dimensional antenna apparatus and methods
CN104517941B (zh) * 2013-09-29 2018-12-28 澜起科技股份有限公司 线圈及制备应用于电感元件的线圈的方法
WO2015125028A2 (en) 2014-02-12 2015-08-27 Pulse Finland Oy Methods and apparatus for conductive element deposition and formation
WO2015141434A1 (ja) * 2014-03-18 2015-09-24 株式会社村田製作所 モジュールおよびこのモジュールの製造方法
WO2015146736A1 (ja) * 2014-03-28 2015-10-01 株式会社村田製作所 コイルモジュール
US10356904B2 (en) 2014-05-14 2019-07-16 AT&S Austria Technologie & Systemtechnik Aktiengesellshaft Conductor track with enlargement-free transition between conductor path and contact structure
US9833802B2 (en) 2014-06-27 2017-12-05 Pulse Finland Oy Methods and apparatus for conductive element deposition and formation
GB2529235B (en) * 2014-08-14 2019-05-08 Murata Manufacturing Co An embedded magnetic component device
GB2528990B (en) * 2014-08-14 2019-03-06 Murata Manufacturing Co An embedded magnetic component device
WO2016056426A1 (ja) * 2014-10-09 2016-04-14 株式会社村田製作所 インダクタ部品
GB2531352B (en) * 2014-10-17 2017-07-12 Murata Manufacturing Co Embedded isolation transformer with improved winding arrangement
GB2531354B (en) * 2014-10-17 2018-01-10 Murata Manufacturing Co An embedded magnetic component Device
GB2531350B (en) * 2014-10-17 2019-05-15 Murata Manufacturing Co High leakage inductance embedded isolation transformer device and method of making the same
JP6350675B2 (ja) 2014-11-12 2018-07-04 株式会社村田製作所 電源モジュールおよびその実装構造
US9824811B2 (en) 2014-12-19 2017-11-21 Texas Instruments Incorporated Embedded coil assembly and method of making
US10170232B2 (en) * 2015-11-03 2019-01-01 Qualcomm Incorporated Toroid inductor with reduced electromagnetic field leakage
US9947456B2 (en) * 2015-11-24 2018-04-17 The University Of North Carolina At Charlotte High power density printed circuit board (PCB) embedded inductors
WO2017147129A1 (en) 2016-02-24 2017-08-31 Murata Manufacturing Co., Ltd. Substrate-embedded transformer with improved isolation
WO2017177389A1 (zh) * 2016-04-13 2017-10-19 深圳线易科技有限责任公司 具有集成磁性器件的转接板
DE102016119164A1 (de) * 2016-10-10 2018-04-12 Phoenix Contact Gmbh & Co. Kg Planarer Übertrager mit integriertem Ringkern
JP6777525B2 (ja) * 2016-12-21 2020-10-28 日本碍子株式会社 電流検出用の耐熱性素子
JP6838548B2 (ja) * 2017-12-07 2021-03-03 株式会社村田製作所 コイル部品およびその製造方法
EP3618109B1 (en) 2018-08-28 2021-11-17 Nxp B.V. Integrated passive coupler and method

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3581243A (en) * 1969-03-21 1971-05-25 Andrew Alford Directional coupler wherein dielectric media surrounding main line is different from dielectric media surrounding coupled line
FR2050584A5 (zh) * 1969-06-18 1971-04-02 Lignes Telegraph Telephon
JPS56123102A (en) 1980-03-04 1981-09-28 Mitsubishi Electric Corp Interdigital wave filter
FR2547116B1 (fr) * 1983-05-31 1985-10-25 Thomson Csf Procede d'ajustage notamment en frequence d'un filtre imprime en ligne " microbandes ", et filtre obtenu par ce procede
JPS62139395A (ja) * 1985-12-13 1987-06-23 松下電器産業株式会社 多機能回路基板
US4967171A (en) * 1987-08-07 1990-10-30 Mitsubishi Danki Kabushiki Kaisha Microwave integrated circuit
US5055816A (en) * 1989-06-26 1991-10-08 Motorola, Inc. Method for fabricating an electronic device
US5349743A (en) * 1991-05-02 1994-09-27 At&T Bell Laboratories Method of making a multilayer monolithic magnet component
JPH05211402A (ja) 1992-01-31 1993-08-20 Furukawa Electric Co Ltd:The 分布定数型回路
JPH06333742A (ja) * 1993-05-19 1994-12-02 Sumitomo Electric Ind Ltd 積層コイル
JPH0715218A (ja) 1993-06-21 1995-01-17 Fuji Elelctrochem Co Ltd 積層誘電体フィルタの製造方法
US5576680A (en) * 1994-03-01 1996-11-19 Amer-Soi Structure and fabrication process of inductors on semiconductor chip
US5728470A (en) * 1994-05-13 1998-03-17 Nec Corporation Multi-layer wiring substrate, and process for producing the same
JPH08154006A (ja) 1994-11-28 1996-06-11 Murata Mfg Co Ltd 誘電体基板
JPH08307117A (ja) 1995-04-28 1996-11-22 Taise:Kk トランス結合器
TW321776B (zh) 1995-07-21 1997-12-01 Tdk Electronics Co Ltd
US5781091A (en) * 1995-07-24 1998-07-14 Autosplice Systems Inc. Electronic inductive device and method for manufacturing
CN1166014C (zh) * 1996-11-15 2004-09-08 凌沛清(音译) 半导体芯片上的电感的结构及其制造方法
JP2823004B2 (ja) 1996-12-20 1998-11-11 日本電気株式会社 誘電体絶縁膜を備えた結合素子
JPH11102817A (ja) * 1997-09-26 1999-04-13 Murata Mfg Co Ltd インダクタ
US6054914A (en) * 1998-07-06 2000-04-25 Midcom, Inc. Multi-layer transformer having electrical connection in a magnetic core
US6198374B1 (en) * 1999-04-01 2001-03-06 Midcom, Inc. Multi-layer transformer apparatus and method
JP2000307362A (ja) 1999-04-23 2000-11-02 Mitsubishi Electric Corp マイクロ波増幅回路と誘電体基板原材及びマイクロ波増幅回路部品
WO2001001453A2 (en) 1999-06-29 2001-01-04 Sun Microsystems, Inc. Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards
JP3497785B2 (ja) 1999-09-29 2004-02-16 株式会社東芝 プレーナ形フィルタ
US6596462B2 (en) 1999-12-17 2003-07-22 Konica Corporation Printing plate element and preparation method of printing plate
JP2002025288A (ja) * 2000-06-30 2002-01-25 Hitachi Ltd 半導体集積回路
JP2002063069A (ja) * 2000-08-21 2002-02-28 Hitachi Ltd メモリ制御装置、データ処理システム及び半導体装置
JP2002289436A (ja) * 2001-03-28 2002-10-04 Niigata Seimitsu Kk インダクタンス素子
US6990729B2 (en) * 2003-09-05 2006-01-31 Harris Corporation Method for forming an inductor
US7196607B2 (en) * 2004-03-26 2007-03-27 Harris Corporation Embedded toroidal transformers in ceramic substrates

Also Published As

Publication number Publication date
US20060176139A1 (en) 2006-08-10
CN101156223B (zh) 2011-02-23
CN101156223A (zh) 2008-04-02
JP2008530799A (ja) 2008-08-07
KR100942337B1 (ko) 2010-02-12
TW200644001A (en) 2006-12-16
US7158005B2 (en) 2007-01-02
KR20070096034A (ko) 2007-10-01
WO2006086260A1 (en) 2006-08-17
CA2597058A1 (en) 2006-08-17
TWI321327B (en) 2010-03-01
EP1854110A1 (en) 2007-11-14
JP4865732B2 (ja) 2012-02-01

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Effective date: 20140206