CA2464585A1 - Low cost shielded cable manufactured from conductive loaded resin-based materials - Google Patents
Low cost shielded cable manufactured from conductive loaded resin-based materials Download PDFInfo
- Publication number
- CA2464585A1 CA2464585A1 CA002464585A CA2464585A CA2464585A1 CA 2464585 A1 CA2464585 A1 CA 2464585A1 CA 002464585 A CA002464585 A CA 002464585A CA 2464585 A CA2464585 A CA 2464585A CA 2464585 A1 CA2464585 A1 CA 2464585A1
- Authority
- CA
- Canada
- Prior art keywords
- conductive
- resin
- conductor
- shield
- based material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 160
- 239000011347 resin Substances 0.000 title claims abstract description 160
- 239000000463 material Substances 0.000 title claims abstract description 126
- 239000004020 conductor Substances 0.000 claims abstract description 136
- 239000000835 fiber Substances 0.000 claims abstract description 59
- 238000000034 method Methods 0.000 claims abstract description 59
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 239000002184 metal Substances 0.000 claims abstract description 43
- 239000000843 powder Substances 0.000 claims abstract description 40
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052709 silver Inorganic materials 0.000 claims abstract description 9
- 239000004332 silver Substances 0.000 claims abstract description 9
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 9
- 239000010935 stainless steel Substances 0.000 claims abstract description 9
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 4
- 239000004917 carbon fiber Substances 0.000 claims abstract description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 3
- 239000010439 graphite Substances 0.000 claims abstract description 3
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract 7
- 229910052799 carbon Inorganic materials 0.000 claims abstract 2
- 239000004744 fabric Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000001125 extrusion Methods 0.000 abstract description 23
- 238000001746 injection moulding Methods 0.000 abstract description 4
- 150000002739 metals Chemical class 0.000 abstract description 2
- 238000000748 compression moulding Methods 0.000 abstract 1
- 150000002843 nonmetals Chemical class 0.000 abstract 1
- 239000002759 woven fabric Substances 0.000 abstract 1
- 239000012212 insulator Substances 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 18
- 238000000465 moulding Methods 0.000 description 13
- 239000002245 particle Substances 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000004804 winding Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000002952 polymeric resin Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000004753 textile Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- SYJPAKDNFZLSMV-HYXAFXHYSA-N (Z)-2-methylpropanal oxime Chemical compound CC(C)\C=N/O SYJPAKDNFZLSMV-HYXAFXHYSA-N 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- 229920004738 ULTEM® Polymers 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000002265 electronic spectrum Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000012255 powdered metal Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B11/00—Communication cables or conductors
- H01B11/02—Cables with twisted pairs or quads
- H01B11/06—Cables with twisted pairs or quads with means for reducing effects of electromagnetic or electrostatic disturbances, e.g. screens
- H01B11/10—Screens specially adapted for reducing interference from external sources
- H01B11/1058—Screens specially adapted for reducing interference from external sources using a coating, e.g. a loaded polymer, ink or print
- H01B11/1066—Screens specially adapted for reducing interference from external sources using a coating, e.g. a loaded polymer, ink or print the coating containing conductive or semiconductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0013—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor using fillers dispersed in the moulding material, e.g. metal particles
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0005—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3456—Antennas, e.g. radomes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0281—Conductive fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Insulated Conductors (AREA)
- Communication Cables (AREA)
- Manufacturing Of Electric Cables (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US46306803P | 2003-04-15 | 2003-04-15 | |
| US60/463,068 | 2003-04-15 | ||
| US48439903P | 2003-07-02 | 2003-07-02 | |
| US60/484,399 | 2003-07-02 | ||
| US10/811,371 US7244890B2 (en) | 2001-02-15 | 2004-03-26 | Low cost shielded cable manufactured from conductive loaded resin-based materials |
| US10/811,371 | 2004-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2464585A1 true CA2464585A1 (en) | 2004-10-15 |
Family
ID=32913044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002464585A Abandoned CA2464585A1 (en) | 2003-04-15 | 2004-04-14 | Low cost shielded cable manufactured from conductive loaded resin-based materials |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7244890B2 (zh) |
| EP (1) | EP1469485A3 (zh) |
| JP (1) | JP2004319508A (zh) |
| KR (1) | KR20040090487A (zh) |
| CN (1) | CN1571076A (zh) |
| CA (1) | CA2464585A1 (zh) |
Families Citing this family (81)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7079086B2 (en) * | 2001-02-15 | 2006-07-18 | Integral Technologies, Inc. | Low cost electromagnetic field absorbing devices manufactured from conductive loaded resin-based materials |
| NO319061B1 (no) * | 2003-05-15 | 2005-06-13 | Nexans | Blyfri elektrisk kabel med hoy spesifikk vekt |
| FR2872993B1 (fr) * | 2004-07-08 | 2006-10-20 | Christian Aumoite | Gaine de protection a l'egard du rayonnement, notamment du champ electrique engendre par des cables electriques |
| US20070102188A1 (en) | 2005-11-01 | 2007-05-10 | Cable Components Group, Llc | High performance support-separators for communications cable supporting low voltage and wireless fidelity applications and providing conductive shielding for alien crosstalk |
| JP2006210203A (ja) * | 2005-01-28 | 2006-08-10 | Nissei Electric Co Ltd | 同軸ケーブル及びその製造方法 |
| KR100725287B1 (ko) * | 2005-07-28 | 2007-06-07 | 엘에스전선 주식회사 | 고주파 신호 전송용 ｕｔｐ케이블 |
| US7414189B2 (en) * | 2005-09-30 | 2008-08-19 | The Boeing Company | Integrated wiring for composite structures |
| CN1953107A (zh) * | 2005-10-17 | 2007-04-25 | 富士康(昆山)电脑接插件有限公司 | 高速信号电缆 |
| KR100729545B1 (ko) * | 2005-12-16 | 2007-06-18 | 한국기초과학지원연구원 | 검출센서 및 그를 구비한 측정기 |
| ATE493875T1 (de) * | 2006-07-25 | 2011-01-15 | Koninkl Philips Electronics Nv | Geformte kabelhalter |
| JP2008078082A (ja) * | 2006-09-25 | 2008-04-03 | Hitachi Cable Ltd | メタリックケーブル |
| US9044593B2 (en) * | 2007-02-14 | 2015-06-02 | Medtronic, Inc. | Discontinuous conductive filler polymer-matrix composites for electromagnetic shielding |
| FR2921512B1 (fr) * | 2007-09-25 | 2012-10-05 | Rayponse | Gaine de protection a l'egard du rayonnement, notamment du champ electrique engendre par des cables electriques |
| KR100902402B1 (ko) | 2007-11-29 | 2009-06-11 | 유봉환 | 동파방지용 히팅 케이블 |
| WO2010035627A1 (en) | 2008-09-25 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| MX2008013821A (es) * | 2008-10-28 | 2010-04-28 | Magnekon S A De C V | Alambre magneto con revestimiento adicionado con nanoestructuras tipo fulereno. |
| JP2010108843A (ja) * | 2008-10-31 | 2010-05-13 | Hitachi Cable Ltd | 絶縁被覆電線 |
| US8823244B2 (en) * | 2008-11-20 | 2014-09-02 | Ceramtec Gmbh | Monolithic multi-layered actuator with external electrodes made of a metallic, porous, expandable conductive layer |
| TWI371237B (en) * | 2008-12-26 | 2012-08-21 | Askey Computer Corp | A framework of wireless network access device |
| US9011177B2 (en) * | 2009-01-30 | 2015-04-21 | Molex Incorporated | High speed bypass cable assembly |
| TW201101339A (en) * | 2009-06-30 | 2011-01-01 | Askey Computer Corp | Transmission wire |
| JP2011014393A (ja) * | 2009-07-02 | 2011-01-20 | Yazaki Corp | シールド電線 |
| TWM375956U (en) * | 2009-08-10 | 2010-03-11 | Vso Electric Co Ltd | Improvement of wire structure |
| US8593153B2 (en) * | 2010-02-26 | 2013-11-26 | The United States Of America As Represented By The United States National Aeronautics And Space Administration | Method of fault detection and rerouting |
| EP2618337A3 (en) * | 2010-03-12 | 2013-10-30 | General Cable Technologies Corporation | Conductor insulation with micro oxide particles |
| US8885999B2 (en) | 2010-03-19 | 2014-11-11 | Corning Cable Systems Llc | Optical USB cable with controlled fiber positioning |
| US9087630B2 (en) * | 2010-10-05 | 2015-07-21 | General Cable Technologies Corporation | Cable barrier layer with shielding segments |
| US20120080209A1 (en) * | 2010-10-05 | 2012-04-05 | General Cable Technologies Corporation | Shielding for communication cables using conductive particles |
| US9136043B2 (en) | 2010-10-05 | 2015-09-15 | General Cable Technologies Corporation | Cable with barrier layer |
| US8907211B2 (en) * | 2010-10-29 | 2014-12-09 | Jamie M. Fox | Power cable with twisted and untwisted wires to reduce ground loop voltages |
| EP2660827B1 (en) * | 2010-12-27 | 2016-10-12 | Yazaki Corporation | Wire harness shield structure |
| JP5675329B2 (ja) | 2010-12-27 | 2015-02-25 | 矢崎総業株式会社 | 導電路シールド構造、及び、ワイヤハーネス |
| KR101298477B1 (ko) * | 2011-09-20 | 2013-08-21 | 주식회사 디와이전기 | 이산화탄소 용접기용 싱글케이블 |
| JP6080350B2 (ja) * | 2011-10-31 | 2017-02-15 | 矢崎総業株式会社 | ワイヤハーネス |
| DE102012203638A1 (de) * | 2012-03-08 | 2013-09-12 | Tyco Electronics Amp Gmbh | Kabel mit elektrischer Schirmung und Dichtung |
| US9875825B2 (en) | 2012-03-13 | 2018-01-23 | Cable Components Group, Llc | Compositions, methods and devices providing shielding in communications cables |
| US9251927B2 (en) * | 2012-08-13 | 2016-02-02 | Joinset Co., Ltd. | Cable having reduced tangle ability |
| CN104704682B (zh) | 2012-08-22 | 2017-03-22 | 安费诺有限公司 | 高频电连接器 |
| FR3002076B1 (fr) * | 2013-02-12 | 2022-11-11 | Nexans | Cable electrique resistant aux decharges partielles |
| US9142921B2 (en) | 2013-02-27 | 2015-09-22 | Molex Incorporated | High speed bypass cable for use with backplanes |
| WO2015035052A1 (en) | 2013-09-04 | 2015-03-12 | Molex Incorporated | Connector system with cable by-pass |
| CN103872420A (zh) * | 2014-03-13 | 2014-06-18 | 苏州科茂电子材料科技有限公司 | 一种新型耐弯曲射频同轴电缆的制备方法 |
| CN103872421B (zh) * | 2014-03-13 | 2016-01-20 | 苏州科茂电子材料科技有限公司 | 一种射频同轴电缆外皮的制备方法 |
| CN103872414A (zh) * | 2014-03-13 | 2014-06-18 | 苏州科茂电子材料科技有限公司 | 一种新型耐弯曲的射频同轴电缆 |
| CN103871564A (zh) * | 2014-03-13 | 2014-06-18 | 苏州科茂电子材料科技有限公司 | 一种新型极细同轴电缆 |
| CN103872412A (zh) * | 2014-03-13 | 2014-06-18 | 苏州科茂电子材料科技有限公司 | 一种射频同轴电缆的外皮 |
| CN103871687A (zh) * | 2014-03-13 | 2014-06-18 | 苏州科茂电子材料科技有限公司 | 一种新型极细同轴电缆的制备方法 |
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| US10177471B2 (en) * | 2014-11-14 | 2019-01-08 | The Boeing Company | Composite and nanowire conduit |
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-
2004
- 2004-03-26 US US10/811,371 patent/US7244890B2/en not_active Expired - Fee Related
- 2004-04-14 KR KR1020040025785A patent/KR20040090487A/ko not_active Application Discontinuation
- 2004-04-14 CA CA002464585A patent/CA2464585A1/en not_active Abandoned
- 2004-04-15 JP JP2004120557A patent/JP2004319508A/ja active Pending
- 2004-04-15 EP EP04392019A patent/EP1469485A3/en not_active Withdrawn
- 2004-04-15 CN CNA2004100595333A patent/CN1571076A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US7244890B2 (en) | 2007-07-17 |
| US20050006126A1 (en) | 2005-01-13 |
| KR20040090487A (ko) | 2004-10-25 |
| JP2004319508A (ja) | 2004-11-11 |
| EP1469485A3 (en) | 2006-03-29 |
| CN1571076A (zh) | 2005-01-26 |
| EP1469485A2 (en) | 2004-10-20 |
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| EEER | Examination request | ||
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