CA2422609A1 - Leadframe assembly - Google Patents
Leadframe assembly Download PDFInfo
- Publication number
- CA2422609A1 CA2422609A1 CA002422609A CA2422609A CA2422609A1 CA 2422609 A1 CA2422609 A1 CA 2422609A1 CA 002422609 A CA002422609 A CA 002422609A CA 2422609 A CA2422609 A CA 2422609A CA 2422609 A1 CA2422609 A1 CA 2422609A1
- Authority
- CA
- Canada
- Prior art keywords
- leadframe
- component
- biasing member
- central frame
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Coils Or Transformers For Communication (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/139,007 US6657287B2 (en) | 2002-05-03 | 2002-05-03 | Leadframe assembly |
| US10/139,007 | 2002-05-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2422609A1 true CA2422609A1 (en) | 2003-11-03 |
Family
ID=29215725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002422609A Abandoned CA2422609A1 (en) | 2002-05-03 | 2003-03-19 | Leadframe assembly |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6657287B2 (enExample) |
| EP (1) | EP1359644A3 (enExample) |
| JP (1) | JP4430328B2 (enExample) |
| KR (1) | KR20030086894A (enExample) |
| BR (1) | BR0301022A (enExample) |
| CA (1) | CA2422609A1 (enExample) |
| MX (1) | MXPA03003998A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7162388B2 (en) * | 2004-06-17 | 2007-01-09 | Fci Americas Technology, Inc. | Vehicle air bag electrical system |
| US7808074B2 (en) * | 2005-07-08 | 2010-10-05 | Infineon Technologies Ag | Advanced leadframe having predefined bases for attaching passive components |
| DE102006028815B3 (de) | 2006-06-21 | 2007-08-30 | Hansa Tronic Gmbh | Verfahren zur Herstellung eines elektrischen Hybridbauteils |
| ES2340075T3 (es) * | 2007-04-27 | 2010-05-28 | Tyco Electronics Nederland B.V. | Procedimiento de fabricacion de un contenedor electrico. |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4376922A (en) * | 1980-10-23 | 1983-03-15 | Itt | Filter connector |
| US4699445A (en) * | 1986-07-28 | 1987-10-13 | Amp Incorporated | Electrical terminal assembly for thermistors |
| US5541376A (en) * | 1994-03-28 | 1996-07-30 | Valleylab Inc | Switch and connector |
| US5954842A (en) * | 1996-01-26 | 1999-09-21 | Micron Technology, Inc. | Lead finger clamp assembly |
| WO1999054966A1 (en) * | 1998-04-20 | 1999-10-28 | Pulse Engineering, Inc. | Simplified microelectronic connector and method of manufacturing |
-
2002
- 2002-05-03 US US10/139,007 patent/US6657287B2/en not_active Expired - Fee Related
-
2003
- 2003-03-19 CA CA002422609A patent/CA2422609A1/en not_active Abandoned
- 2003-04-15 KR KR10-2003-0023792A patent/KR20030086894A/ko not_active Withdrawn
- 2003-04-16 BR BR0301022-8A patent/BR0301022A/pt not_active IP Right Cessation
- 2003-04-23 EP EP03252543A patent/EP1359644A3/en not_active Withdrawn
- 2003-05-02 JP JP2003127020A patent/JP4430328B2/ja not_active Expired - Fee Related
- 2003-05-02 MX MXPA03003998A patent/MXPA03003998A/es active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR20030086894A (ko) | 2003-11-12 |
| JP4430328B2 (ja) | 2010-03-10 |
| US6657287B2 (en) | 2003-12-02 |
| BR0301022A (pt) | 2004-08-17 |
| EP1359644A2 (en) | 2003-11-05 |
| EP1359644A3 (en) | 2004-08-18 |
| US20030205788A1 (en) | 2003-11-06 |
| JP2003332498A (ja) | 2003-11-21 |
| MXPA03003998A (es) | 2004-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR0178600B1 (ko) | 원피스 하우징내에 전기 요소를 성형하는 방법 | |
| JP2602343B2 (ja) | Icカード | |
| US6486766B1 (en) | Housing for double-ended fuse | |
| JPS6288930A (ja) | 一体型圧力変換器パツケ−ジおよびこれを用いた圧力変換器 | |
| AU2010348146A1 (en) | Housing base element of a multi-part housing and method for assembly of a housing | |
| US20050046010A1 (en) | Semiconductor package | |
| US6657287B2 (en) | Leadframe assembly | |
| US7161461B1 (en) | Injection molded trim resistor assembly | |
| US6147398A (en) | Semiconductor device package | |
| JP2002042979A (ja) | コネクタ及びその製造方法 | |
| JP2001033337A (ja) | 圧力センサを製造する方法 | |
| JPS6216553B2 (enExample) | ||
| JP2001085120A (ja) | コネクタ | |
| US5851122A (en) | Multipole, plastic connector housing | |
| US7232966B2 (en) | Steering wheel horn contact unit and assembly | |
| JP3447476B2 (ja) | 配線用止め具 | |
| KR100680124B1 (ko) | 조립식 플러그의 내부 프레임 구조체 | |
| KR100509548B1 (ko) | 마이크로 휴즈용 리드플레이트 | |
| JPH0339870Y2 (enExample) | ||
| JPH0716280Y2 (ja) | 継電器の防水構造 | |
| JP3216975B2 (ja) | グロメット | |
| JP4063361B2 (ja) | 樹脂成形型電子部品の製造方法 | |
| JP3131229B2 (ja) | マイクロスイッチ | |
| KR200278325Y1 (ko) | 휴즈홀다의 구조 | |
| JPS6343725Y2 (enExample) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| FZDE | Discontinued |