MXPA03003998A - Ensamble de bastidor de conductores. - Google Patents

Ensamble de bastidor de conductores.

Info

Publication number
MXPA03003998A
MXPA03003998A MXPA03003998A MXPA03003998A MXPA03003998A MX PA03003998 A MXPA03003998 A MX PA03003998A MX PA03003998 A MXPA03003998 A MX PA03003998A MX PA03003998 A MXPA03003998 A MX PA03003998A MX PA03003998 A MXPA03003998 A MX PA03003998A
Authority
MX
Mexico
Prior art keywords
frame assembly
driver frame
component
leadframe
driver
Prior art date
Application number
MXPA03003998A
Other languages
English (en)
Spanish (es)
Inventor
R Benson Steven
Original Assignee
Illinois Tool Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works filed Critical Illinois Tool Works
Publication of MXPA03003998A publication Critical patent/MXPA03003998A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
MXPA03003998A 2002-05-03 2003-05-02 Ensamble de bastidor de conductores. MXPA03003998A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/139,007 US6657287B2 (en) 2002-05-03 2002-05-03 Leadframe assembly

Publications (1)

Publication Number Publication Date
MXPA03003998A true MXPA03003998A (es) 2004-10-15

Family

ID=29215725

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA03003998A MXPA03003998A (es) 2002-05-03 2003-05-02 Ensamble de bastidor de conductores.

Country Status (7)

Country Link
US (1) US6657287B2 (enExample)
EP (1) EP1359644A3 (enExample)
JP (1) JP4430328B2 (enExample)
KR (1) KR20030086894A (enExample)
BR (1) BR0301022A (enExample)
CA (1) CA2422609A1 (enExample)
MX (1) MXPA03003998A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7162388B2 (en) * 2004-06-17 2007-01-09 Fci Americas Technology, Inc. Vehicle air bag electrical system
US7808074B2 (en) * 2005-07-08 2010-10-05 Infineon Technologies Ag Advanced leadframe having predefined bases for attaching passive components
DE102006028815B3 (de) 2006-06-21 2007-08-30 Hansa Tronic Gmbh Verfahren zur Herstellung eines elektrischen Hybridbauteils
ATE459116T1 (de) * 2007-04-27 2010-03-15 Tyco Electronics Nederland Bv Herstellungsverfahren eines elektrischen verbinders

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4376922A (en) * 1980-10-23 1983-03-15 Itt Filter connector
US4699445A (en) * 1986-07-28 1987-10-13 Amp Incorporated Electrical terminal assembly for thermistors
US5541376A (en) * 1994-03-28 1996-07-30 Valleylab Inc Switch and connector
US5954842A (en) * 1996-01-26 1999-09-21 Micron Technology, Inc. Lead finger clamp assembly
US6224425B1 (en) * 1998-04-20 2001-05-01 Pulse Engineering, Inc. Simplified microelectronic connector and method of manufacturing

Also Published As

Publication number Publication date
US20030205788A1 (en) 2003-11-06
EP1359644A3 (en) 2004-08-18
JP2003332498A (ja) 2003-11-21
JP4430328B2 (ja) 2010-03-10
EP1359644A2 (en) 2003-11-05
CA2422609A1 (en) 2003-11-03
BR0301022A (pt) 2004-08-17
KR20030086894A (ko) 2003-11-12
US6657287B2 (en) 2003-12-02

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Legal Events

Date Code Title Description
FG Grant or registration