CA2351687C - Device for increasing heat transfer - Google Patents

Device for increasing heat transfer Download PDF

Info

Publication number
CA2351687C
CA2351687C CA002351687A CA2351687A CA2351687C CA 2351687 C CA2351687 C CA 2351687C CA 002351687 A CA002351687 A CA 002351687A CA 2351687 A CA2351687 A CA 2351687A CA 2351687 C CA2351687 C CA 2351687C
Authority
CA
Canada
Prior art keywords
air
membrane
cabinet
nozzle
motion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002351687A
Other languages
English (en)
French (fr)
Other versions
CA2351687A1 (en
Inventor
Carl Henrik Tullstedt
Patrik Bergman
Anders Edgren
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of CA2351687A1 publication Critical patent/CA2351687A1/en
Application granted granted Critical
Publication of CA2351687C publication Critical patent/CA2351687C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B35/00—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for
    • F04B35/04—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric
    • F04B35/045—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric using solenoids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/10—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
  • Cookers (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
CA002351687A 1998-12-11 1999-11-23 Device for increasing heat transfer Expired - Fee Related CA2351687C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9804299-7 1998-12-11
SE9804299A SE514735C2 (sv) 1998-12-11 1998-12-11 Anordning för ökande av värmeavgivning
PCT/SE1999/002166 WO2000036892A1 (en) 1998-12-11 1999-11-23 Device for increasing heat transfer

Publications (2)

Publication Number Publication Date
CA2351687A1 CA2351687A1 (en) 2000-06-22
CA2351687C true CA2351687C (en) 2007-06-12

Family

ID=20413634

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002351687A Expired - Fee Related CA2351687C (en) 1998-12-11 1999-11-23 Device for increasing heat transfer

Country Status (10)

Country Link
US (1) US6252769B1 (https=)
EP (1) EP1142461A2 (https=)
JP (1) JP2002532913A (https=)
KR (1) KR20010089446A (https=)
CN (1) CN1201647C (https=)
AU (1) AU2011400A (https=)
BR (1) BR9916137A (https=)
CA (1) CA2351687C (https=)
SE (1) SE514735C2 (https=)
WO (1) WO2000036892A1 (https=)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE50207121D1 (de) * 2001-07-30 2006-07-20 Bistekos Michael Georg Einrichtung zur kühlung von gehausen, raumen, bauteilen, medien u. dgl
US6904968B2 (en) * 2001-09-14 2005-06-14 Hewlett-Packard Development Company, L.P. Method and apparatus for individually cooling components of electronic systems
US7061161B2 (en) * 2002-02-15 2006-06-13 Siemens Technology-To-Business Center Llc Small piezoelectric air pumps with unobstructed airflow
US6937472B2 (en) * 2003-05-09 2005-08-30 Intel Corporation Apparatus for cooling heat generating components within a computer system enclosure
ATE372045T1 (de) * 2003-05-09 2007-09-15 Intel Corp Eine betätigungsmembran zur verwendung in einem systemskartenschlitz
US6801430B1 (en) * 2003-05-09 2004-10-05 Intel Corporation Actuation membrane to reduce an ambient temperature of heat generating device
WO2005008348A2 (en) * 2003-07-07 2005-01-27 Georgia Tech Research Corporation System and method for thermal management using distributed synthetic jet actuators
US7269005B2 (en) * 2003-11-21 2007-09-11 Intel Corporation Pumped loop cooling with remote heat exchanger and display cooling
US7527086B2 (en) * 2004-07-20 2009-05-05 National Taiwan University Double-acting device for generating synthetic jets
US7252140B2 (en) * 2004-09-03 2007-08-07 Nuveatix, Inc. Apparatus and method for enhanced heat transfer
CN100388872C (zh) * 2004-09-29 2008-05-14 鸿进科技有限公司 散热装置及散热方法
GB2434910B (en) * 2004-11-03 2008-07-30 Xyratex Tech Ltd A temperature control, apparatus for a hard disk drive and a method of varying the temperature of a hard disk drive
JP5088526B2 (ja) 2005-04-18 2012-12-05 ソニー株式会社 噴流発生装置及び電子機器
JP4910464B2 (ja) * 2005-04-18 2012-04-04 ソニー株式会社 噴流発生装置及び電子機器
JP4747657B2 (ja) * 2005-04-21 2011-08-17 ソニー株式会社 噴流発生装置及び電子機器
JP5096340B2 (ja) * 2005-09-16 2012-12-12 ザイラテックス テクノロジー リミテッド 製造中にディスクドライブの温度を制御するための方法および装置
US20070146993A1 (en) * 2005-12-23 2007-06-28 Intel Corporation Method, apparatus and computer system for enhancement of thermal energy transfer
FR2900308B1 (fr) * 2006-04-21 2008-07-04 D Aviat Latecoere Societeanony Diaphragme dispose sur un circuit de ventilation d'un meuble electronique, meuble electronique correspondant et utilisation particuliere de ce diaphragme
US7996174B2 (en) 2007-12-18 2011-08-09 Teradyne, Inc. Disk drive testing
US8549912B2 (en) 2007-12-18 2013-10-08 Teradyne, Inc. Disk drive transport, clamping and testing
US7945424B2 (en) 2008-04-17 2011-05-17 Teradyne, Inc. Disk drive emulator and method of use thereof
US20090262455A1 (en) 2008-04-17 2009-10-22 Teradyne, Inc. Temperature Control Within Disk Drive Testing Systems
US7848106B2 (en) 2008-04-17 2010-12-07 Teradyne, Inc. Temperature control within disk drive testing systems
US8305751B2 (en) 2008-04-17 2012-11-06 Teradyne, Inc. Vibration isolation within disk drive testing systems
US8160739B2 (en) 2008-04-17 2012-04-17 Teradyne, Inc. Transferring storage devices within storage device testing systems
US8102173B2 (en) 2008-04-17 2012-01-24 Teradyne, Inc. Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit
US8238099B2 (en) 2008-04-17 2012-08-07 Teradyne, Inc. Enclosed operating area for disk drive testing systems
US8041449B2 (en) 2008-04-17 2011-10-18 Teradyne, Inc. Bulk feeding disk drives to disk drive testing systems
US8117480B2 (en) 2008-04-17 2012-02-14 Teradyne, Inc. Dependent temperature control within disk drive testing systems
US8095234B2 (en) 2008-04-17 2012-01-10 Teradyne, Inc. Transferring disk drives within disk drive testing systems
WO2009148942A2 (en) 2008-06-03 2009-12-10 Teradyne, Inc. Processing storage devices
WO2010019213A2 (en) * 2008-08-11 2010-02-18 Veeco Instruments Inc. Vacuum deposition sources having heated effusion orifices
US8466699B2 (en) 2009-07-15 2013-06-18 Teradyne, Inc. Heating storage devices in a testing system
US8547123B2 (en) 2009-07-15 2013-10-01 Teradyne, Inc. Storage device testing system with a conductive heating assembly
US8628239B2 (en) 2009-07-15 2014-01-14 Teradyne, Inc. Storage device temperature sensing
US7995349B2 (en) 2009-07-15 2011-08-09 Teradyne, Inc. Storage device temperature sensing
US8116079B2 (en) 2009-07-15 2012-02-14 Teradyne, Inc. Storage device testing system cooling
US7920380B2 (en) 2009-07-15 2011-04-05 Teradyne, Inc. Test slot cooling system for a storage device testing system
US8687356B2 (en) 2010-02-02 2014-04-01 Teradyne, Inc. Storage device testing system cooling
US9779780B2 (en) 2010-06-17 2017-10-03 Teradyne, Inc. Damping vibrations within storage device testing systems
US8687349B2 (en) 2010-07-21 2014-04-01 Teradyne, Inc. Bulk transfer of storage devices using manual loading
US9001456B2 (en) 2010-08-31 2015-04-07 Teradyne, Inc. Engaging test slots
WO2012176083A2 (en) 2011-06-20 2012-12-27 Koninklijke Philips Electronics N.V. Active cooling device with electro-statically moving electrode and method of active cooling with electro-statically moving electrode
CN103987234B (zh) * 2013-02-08 2017-08-29 台达电子工业股份有限公司 散热装置
US9459312B2 (en) 2013-04-10 2016-10-04 Teradyne, Inc. Electronic assembly test system
US20150192119A1 (en) * 2014-01-08 2015-07-09 Samsung Electro-Mechanics Co., Ltd. Piezoelectric blower
US10018429B2 (en) * 2014-08-13 2018-07-10 Asia Vital Components Co., Ltd. Apparatus body heat dissipation device
US10045461B1 (en) * 2014-09-30 2018-08-07 Apple Inc. Electronic device with diaphragm cooling
US11226390B2 (en) 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
US10725091B2 (en) 2017-08-28 2020-07-28 Teradyne, Inc. Automated test system having multiple stages
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US10983145B2 (en) 2018-04-24 2021-04-20 Teradyne, Inc. System for testing devices inside of carriers
SE542025C2 (en) * 2018-06-21 2020-02-11 Gestamp Hardtech Ab Process and apparatus for cooling hot components
US10775408B2 (en) 2018-08-20 2020-09-15 Teradyne, Inc. System for testing devices inside of carriers
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2522309C3 (de) * 1975-05-20 1979-10-11 Waldemar 4500 Osnabrueck Riepe Flüssigkeitspumpe
US4498851A (en) * 1980-05-02 1985-02-12 Piezo Electric Products, Inc. Solid state blower
US4780062A (en) * 1985-10-09 1988-10-25 Murata Manufacturing Co., Ltd. Piezoelectric fan
US4834619A (en) * 1987-11-10 1989-05-30 The Boeing Company Ducted oscillatory blade fan
US4923000A (en) * 1989-03-03 1990-05-08 Microelectronics And Computer Technology Corporation Heat exchanger having piezoelectric fan means
US5104626A (en) * 1990-09-07 1992-04-14 Yang Tai Her Vibrating diffusion type aromatic device
KR970011621B1 (ko) * 1992-12-07 1997-07-12 가부시끼가이샤 히다찌세이사꾸쇼 냉각 디바이스
SE508435C2 (sv) * 1993-02-23 1998-10-05 Erik Stemme Förträngningspump av membranpumptyp
US5522712A (en) * 1993-12-08 1996-06-04 Winn; Ray Low-powered cooling fan for dissipating heat
DE4422743A1 (de) * 1994-06-29 1996-01-04 Torsten Gerlach Mikropumpe
JPH08330488A (ja) * 1995-05-30 1996-12-13 Sumitomo Metal Ind Ltd 圧電ファン付きヒートシンク
US5861703A (en) * 1997-05-30 1999-01-19 Motorola Inc. Low-profile axial-flow single-blade piezoelectric fan
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US5914856A (en) * 1997-07-23 1999-06-22 Litton Systems, Inc. Diaphragm pumped air cooled planar heat exchanger
JPH11145659A (ja) * 1997-11-10 1999-05-28 Sony Corp 空冷装置
US6043978A (en) * 1997-12-15 2000-03-28 Eaton Corporation Cooling device for circuit breakers

Also Published As

Publication number Publication date
KR20010089446A (ko) 2001-10-06
WO2000036892A8 (en) 2000-08-03
CN1201647C (zh) 2005-05-11
US6252769B1 (en) 2001-06-26
JP2002532913A (ja) 2002-10-02
BR9916137A (pt) 2001-09-11
EP1142461A2 (en) 2001-10-10
CN1330859A (zh) 2002-01-09
SE9804299L (sv) 2000-06-12
SE514735C2 (sv) 2001-04-09
CA2351687A1 (en) 2000-06-22
SE9804299D0 (sv) 1998-12-11
WO2000036892A1 (en) 2000-06-22
AU2011400A (en) 2000-07-03

Similar Documents

Publication Publication Date Title
CA2351687C (en) Device for increasing heat transfer
US20090041282A1 (en) Porting
US7031155B2 (en) Electronic thermal management
US7793709B2 (en) Jet generating device and electronic apparatus
US8081454B2 (en) Gas ejector, electronic device, and gas-ejecting method
ES2226845T3 (es) Sistema para refrigerar un modulo electrico y aparato tecnico.
US20090084866A1 (en) Vibration balanced synthetic jet ejector
US8561756B2 (en) Acoustic ports aligned to create free convective airflow
EP1999381B1 (en) Cooling device and electronic device comprising such a cooling device
US20100018675A1 (en) Pulsating cooling system
JP2010512642A (ja) 組み込み環境向け熱管理システム及びその製造方法
JP2008167252A (ja) 熱励起型の音波発生装置
CN100399232C (zh) 气流产生装置和电子设备
US20050169494A1 (en) Thermal chimney equipped audio speaker cabinet
JP2002364991A (ja) 強制振動流型ヒートパイプ及びその設計方法
JP2002130198A (ja) 圧電ファン
CN101889145A (zh) 低噪声冷却设备
US6405794B1 (en) Acoustic convection apparatus
JP2007218241A (ja) 振動アクチュエータ、噴流発生装置及び電子機器
US20230049263A1 (en) Linear fan forced air cooling
US20090262500A1 (en) Cooling device, heat sink, and electronic apparatus
JP2007162525A (ja) 噴流発生装置、放熱装置及び電子機器
Razak et al. FHigh Potential of Magnet on the Performance of Dual Piezoelectric Fans in Electronics Cooling System
US7035101B1 (en) Power supply architecture
CN219328888U (zh) 一种降噪装置及核磁共振设备

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed