CA2351687C - Dispositif accroissant les transferts thermiques - Google Patents
Dispositif accroissant les transferts thermiques Download PDFInfo
- Publication number
- CA2351687C CA2351687C CA002351687A CA2351687A CA2351687C CA 2351687 C CA2351687 C CA 2351687C CA 002351687 A CA002351687 A CA 002351687A CA 2351687 A CA2351687 A CA 2351687A CA 2351687 C CA2351687 C CA 2351687C
- Authority
- CA
- Canada
- Prior art keywords
- air
- membrane
- cabinet
- nozzle
- motion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012528 membrane Substances 0.000 claims abstract description 128
- 238000004891 communication Methods 0.000 claims description 8
- 210000004379 membrane Anatomy 0.000 description 99
- 238000001816 cooling Methods 0.000 description 13
- 230000000875 corresponding effect Effects 0.000 description 13
- 230000001419 dependent effect Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000005404 monopole Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000639 Spring steel Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B35/00—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for
- F04B35/04—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric
- F04B35/045—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric using solenoids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/10—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/465—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/467—Chemical or electrical treatment, e.g. electrolytic etching using masks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Cookers (AREA)
Abstract
L'invention porte sur le problème de l'obtention d'un dispositif accroissant le transfert de la chaleur provenant d'un objet (3; 73; 103). Ledit problème est ici résolu à l'aide d'un dispositif (1; 71; 101) présentant une ou plusieurs membranes oscillantes (21, 25; 81; 121, 125) produisant un déplacement d'air autour de l'objet (3; 73; 103), et comprenant en outre des moyens (31, 33; 87; 129, 131) agissant sur lesdits déplacements d'air pour qu'ils entraînent un renouvellement continu de l'air entourant l'objet (3; 73; 103). Ce renouvellement continu signifie que l'objet (3; 73; 103) est entouré en permanence d'air relativement froid, d'où un transfert de chaleur efficace de l'objet (3; 73; 103) vers l'air environnant.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9804299A SE514735C2 (sv) | 1998-12-11 | 1998-12-11 | Anordning för ökande av värmeavgivning |
SE9804299-7 | 1998-12-11 | ||
PCT/SE1999/002166 WO2000036892A1 (fr) | 1998-12-11 | 1999-11-23 | Dispositif accroissant les transferts thermiques |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2351687A1 CA2351687A1 (fr) | 2000-06-22 |
CA2351687C true CA2351687C (fr) | 2007-06-12 |
Family
ID=20413634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002351687A Expired - Fee Related CA2351687C (fr) | 1998-12-11 | 1999-11-23 | Dispositif accroissant les transferts thermiques |
Country Status (10)
Country | Link |
---|---|
US (1) | US6252769B1 (fr) |
EP (1) | EP1142461A2 (fr) |
JP (1) | JP2002532913A (fr) |
KR (1) | KR20010089446A (fr) |
CN (1) | CN1201647C (fr) |
AU (1) | AU2011400A (fr) |
BR (1) | BR9916137A (fr) |
CA (1) | CA2351687C (fr) |
SE (1) | SE514735C2 (fr) |
WO (1) | WO2000036892A1 (fr) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE50207121D1 (de) * | 2001-07-30 | 2006-07-20 | Bistekos Michael Georg | Einrichtung zur kühlung von gehausen, raumen, bauteilen, medien u. dgl |
US6904968B2 (en) * | 2001-09-14 | 2005-06-14 | Hewlett-Packard Development Company, L.P. | Method and apparatus for individually cooling components of electronic systems |
US7061161B2 (en) * | 2002-02-15 | 2006-06-13 | Siemens Technology-To-Business Center Llc | Small piezoelectric air pumps with unobstructed airflow |
US6801430B1 (en) * | 2003-05-09 | 2004-10-05 | Intel Corporation | Actuation membrane to reduce an ambient temperature of heat generating device |
US6937472B2 (en) * | 2003-05-09 | 2005-08-30 | Intel Corporation | Apparatus for cooling heat generating components within a computer system enclosure |
ATE372045T1 (de) * | 2003-05-09 | 2007-09-15 | Intel Corp | Eine betätigungsmembran zur verwendung in einem systemskartenschlitz |
WO2005008348A2 (fr) * | 2003-07-07 | 2005-01-27 | Georgia Tech Research Corporation | Systeme et procede de gestion thermique effectuee au moyen d'organes de commande de jets synthetiques |
US7269005B2 (en) * | 2003-11-21 | 2007-09-11 | Intel Corporation | Pumped loop cooling with remote heat exchanger and display cooling |
US7527086B2 (en) * | 2004-07-20 | 2009-05-05 | National Taiwan University | Double-acting device for generating synthetic jets |
US7252140B2 (en) * | 2004-09-03 | 2007-08-07 | Nuveatix, Inc. | Apparatus and method for enhanced heat transfer |
CN100388872C (zh) * | 2004-09-29 | 2008-05-14 | 鸿进科技有限公司 | 散热装置及散热方法 |
JP4797023B2 (ja) * | 2004-11-03 | 2011-10-19 | ザイラテックス・テクノロジー・リミテッド | ハードディスクドライブの温度制御装置およびハードディスクドライブの温度変更方法 |
JP5088526B2 (ja) | 2005-04-18 | 2012-12-05 | ソニー株式会社 | 噴流発生装置及び電子機器 |
JP4910464B2 (ja) * | 2005-04-18 | 2012-04-04 | ソニー株式会社 | 噴流発生装置及び電子機器 |
JP4747657B2 (ja) * | 2005-04-21 | 2011-08-17 | ソニー株式会社 | 噴流発生装置及び電子機器 |
CN101223604B (zh) * | 2005-09-16 | 2011-01-19 | 齐拉泰克斯技术有限公司 | 在生产过程中用于控制磁盘驱动器温度的方法和装置 |
US20070146993A1 (en) * | 2005-12-23 | 2007-06-28 | Intel Corporation | Method, apparatus and computer system for enhancement of thermal energy transfer |
FR2900308B1 (fr) * | 2006-04-21 | 2008-07-04 | D Aviat Latecoere Societeanony | Diaphragme dispose sur un circuit de ventilation d'un meuble electronique, meuble electronique correspondant et utilisation particuliere de ce diaphragme |
US8549912B2 (en) | 2007-12-18 | 2013-10-08 | Teradyne, Inc. | Disk drive transport, clamping and testing |
US7996174B2 (en) | 2007-12-18 | 2011-08-09 | Teradyne, Inc. | Disk drive testing |
US7945424B2 (en) | 2008-04-17 | 2011-05-17 | Teradyne, Inc. | Disk drive emulator and method of use thereof |
US8117480B2 (en) | 2008-04-17 | 2012-02-14 | Teradyne, Inc. | Dependent temperature control within disk drive testing systems |
US8041449B2 (en) | 2008-04-17 | 2011-10-18 | Teradyne, Inc. | Bulk feeding disk drives to disk drive testing systems |
US8238099B2 (en) | 2008-04-17 | 2012-08-07 | Teradyne, Inc. | Enclosed operating area for disk drive testing systems |
US8095234B2 (en) | 2008-04-17 | 2012-01-10 | Teradyne, Inc. | Transferring disk drives within disk drive testing systems |
US7848106B2 (en) | 2008-04-17 | 2010-12-07 | Teradyne, Inc. | Temperature control within disk drive testing systems |
US8305751B2 (en) | 2008-04-17 | 2012-11-06 | Teradyne, Inc. | Vibration isolation within disk drive testing systems |
US8102173B2 (en) | 2008-04-17 | 2012-01-24 | Teradyne, Inc. | Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit |
US20090262455A1 (en) | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Temperature Control Within Disk Drive Testing Systems |
US8160739B2 (en) | 2008-04-17 | 2012-04-17 | Teradyne, Inc. | Transferring storage devices within storage device testing systems |
CN102112887B (zh) | 2008-06-03 | 2015-06-10 | 泰拉丁公司 | 处理存储设备 |
EP2321443B1 (fr) * | 2008-08-11 | 2015-07-22 | Veeco Instruments Inc. | Sources de dépôt sous vide ayant des orifices d'effusion chauffés |
US8466699B2 (en) | 2009-07-15 | 2013-06-18 | Teradyne, Inc. | Heating storage devices in a testing system |
US7995349B2 (en) | 2009-07-15 | 2011-08-09 | Teradyne, Inc. | Storage device temperature sensing |
US8687356B2 (en) | 2010-02-02 | 2014-04-01 | Teradyne, Inc. | Storage device testing system cooling |
US8116079B2 (en) | 2009-07-15 | 2012-02-14 | Teradyne, Inc. | Storage device testing system cooling |
US7920380B2 (en) | 2009-07-15 | 2011-04-05 | Teradyne, Inc. | Test slot cooling system for a storage device testing system |
US8547123B2 (en) | 2009-07-15 | 2013-10-01 | Teradyne, Inc. | Storage device testing system with a conductive heating assembly |
US8628239B2 (en) | 2009-07-15 | 2014-01-14 | Teradyne, Inc. | Storage device temperature sensing |
US9779780B2 (en) | 2010-06-17 | 2017-10-03 | Teradyne, Inc. | Damping vibrations within storage device testing systems |
US8687349B2 (en) | 2010-07-21 | 2014-04-01 | Teradyne, Inc. | Bulk transfer of storage devices using manual loading |
US9001456B2 (en) | 2010-08-31 | 2015-04-07 | Teradyne, Inc. | Engaging test slots |
EP2721345A2 (fr) | 2011-06-20 | 2014-04-23 | Koninklijke Philips N.V. | Dispositif de refroidissement actif comprenant une électrode électrostatiquement mobile et procédé de refroidissement actif comprenant une électrode électrostatiquement mobile |
CN103987234B (zh) * | 2013-02-08 | 2017-08-29 | 台达电子工业股份有限公司 | 散热装置 |
US9459312B2 (en) | 2013-04-10 | 2016-10-04 | Teradyne, Inc. | Electronic assembly test system |
US20150192119A1 (en) * | 2014-01-08 | 2015-07-09 | Samsung Electro-Mechanics Co., Ltd. | Piezoelectric blower |
US10018429B2 (en) * | 2014-08-13 | 2018-07-10 | Asia Vital Components Co., Ltd. | Apparatus body heat dissipation device |
US10045461B1 (en) * | 2014-09-30 | 2018-08-07 | Apple Inc. | Electronic device with diaphragm cooling |
US10948534B2 (en) | 2017-08-28 | 2021-03-16 | Teradyne, Inc. | Automated test system employing robotics |
US10725091B2 (en) | 2017-08-28 | 2020-07-28 | Teradyne, Inc. | Automated test system having multiple stages |
US11226390B2 (en) | 2017-08-28 | 2022-01-18 | Teradyne, Inc. | Calibration process for an automated test system |
US10845410B2 (en) | 2017-08-28 | 2020-11-24 | Teradyne, Inc. | Automated test system having orthogonal robots |
US10983145B2 (en) | 2018-04-24 | 2021-04-20 | Teradyne, Inc. | System for testing devices inside of carriers |
SE542025C2 (en) * | 2018-06-21 | 2020-02-11 | Gestamp Hardtech Ab | Process and apparatus for cooling hot components |
US10775408B2 (en) | 2018-08-20 | 2020-09-15 | Teradyne, Inc. | System for testing devices inside of carriers |
US11754596B2 (en) | 2020-10-22 | 2023-09-12 | Teradyne, Inc. | Test site configuration in an automated test system |
US11899042B2 (en) | 2020-10-22 | 2024-02-13 | Teradyne, Inc. | Automated test system |
US11754622B2 (en) | 2020-10-22 | 2023-09-12 | Teradyne, Inc. | Thermal control system for an automated test system |
US11867749B2 (en) | 2020-10-22 | 2024-01-09 | Teradyne, Inc. | Vision system for an automated test system |
US11953519B2 (en) | 2020-10-22 | 2024-04-09 | Teradyne, Inc. | Modular automated test system |
US12007411B2 (en) | 2021-06-22 | 2024-06-11 | Teradyne, Inc. | Test socket having an automated lid |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2522309C3 (de) * | 1975-05-20 | 1979-10-11 | Waldemar 4500 Osnabrueck Riepe | Flüssigkeitspumpe |
US4498851A (en) * | 1980-05-02 | 1985-02-12 | Piezo Electric Products, Inc. | Solid state blower |
US4780062A (en) * | 1985-10-09 | 1988-10-25 | Murata Manufacturing Co., Ltd. | Piezoelectric fan |
US4834619A (en) * | 1987-11-10 | 1989-05-30 | The Boeing Company | Ducted oscillatory blade fan |
US4923000A (en) * | 1989-03-03 | 1990-05-08 | Microelectronics And Computer Technology Corporation | Heat exchanger having piezoelectric fan means |
US5104626A (en) * | 1990-09-07 | 1992-04-14 | Yang Tai Her | Vibrating diffusion type aromatic device |
EP0601516B1 (fr) * | 1992-12-07 | 1998-10-07 | Hitachi, Ltd. | Dispositif de refroidissement |
SE508435C2 (sv) * | 1993-02-23 | 1998-10-05 | Erik Stemme | Förträngningspump av membranpumptyp |
US5522712A (en) * | 1993-12-08 | 1996-06-04 | Winn; Ray | Low-powered cooling fan for dissipating heat |
DE4422743A1 (de) * | 1994-06-29 | 1996-01-04 | Torsten Gerlach | Mikropumpe |
JPH08330488A (ja) * | 1995-05-30 | 1996-12-13 | Sumitomo Metal Ind Ltd | 圧電ファン付きヒートシンク |
US5861703A (en) * | 1997-05-30 | 1999-01-19 | Motorola Inc. | Low-profile axial-flow single-blade piezoelectric fan |
US5901037A (en) * | 1997-06-18 | 1999-05-04 | Northrop Grumman Corporation | Closed loop liquid cooling for semiconductor RF amplifier modules |
US5914856A (en) * | 1997-07-23 | 1999-06-22 | Litton Systems, Inc. | Diaphragm pumped air cooled planar heat exchanger |
JPH11145659A (ja) * | 1997-11-10 | 1999-05-28 | Sony Corp | 空冷装置 |
US6043978A (en) * | 1997-12-15 | 2000-03-28 | Eaton Corporation | Cooling device for circuit breakers |
-
1998
- 1998-12-11 SE SE9804299A patent/SE514735C2/sv not_active IP Right Cessation
-
1999
- 1999-11-23 JP JP2000589016A patent/JP2002532913A/ja active Pending
- 1999-11-23 WO PCT/SE1999/002166 patent/WO2000036892A1/fr not_active Application Discontinuation
- 1999-11-23 CN CNB998143057A patent/CN1201647C/zh not_active Expired - Fee Related
- 1999-11-23 CA CA002351687A patent/CA2351687C/fr not_active Expired - Fee Related
- 1999-11-23 AU AU20114/00A patent/AU2011400A/en not_active Abandoned
- 1999-11-23 KR KR1020017005985A patent/KR20010089446A/ko not_active Application Discontinuation
- 1999-11-23 BR BR9916137-0A patent/BR9916137A/pt not_active IP Right Cessation
- 1999-11-23 EP EP99963741A patent/EP1142461A2/fr not_active Withdrawn
- 1999-12-10 US US09/457,862 patent/US6252769B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
SE514735C2 (sv) | 2001-04-09 |
AU2011400A (en) | 2000-07-03 |
SE9804299L (sv) | 2000-06-12 |
US6252769B1 (en) | 2001-06-26 |
CA2351687A1 (fr) | 2000-06-22 |
BR9916137A (pt) | 2001-09-11 |
EP1142461A2 (fr) | 2001-10-10 |
WO2000036892A8 (fr) | 2000-08-03 |
WO2000036892A1 (fr) | 2000-06-22 |
CN1201647C (zh) | 2005-05-11 |
KR20010089446A (ko) | 2001-10-06 |
CN1330859A (zh) | 2002-01-09 |
SE9804299D0 (sv) | 1998-12-11 |
JP2002532913A (ja) | 2002-10-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |