SE514735C2 - Anordning för ökande av värmeavgivning - Google Patents

Anordning för ökande av värmeavgivning

Info

Publication number
SE514735C2
SE514735C2 SE9804299A SE9804299A SE514735C2 SE 514735 C2 SE514735 C2 SE 514735C2 SE 9804299 A SE9804299 A SE 9804299A SE 9804299 A SE9804299 A SE 9804299A SE 514735 C2 SE514735 C2 SE 514735C2
Authority
SE
Sweden
Prior art keywords
air
cabinet
membrane
nozzle
heat sink
Prior art date
Application number
SE9804299A
Other languages
English (en)
Swedish (sv)
Other versions
SE9804299L (sv
SE9804299D0 (sv
Inventor
Carl Tullstedt
Patrik Bergman
Anders Edgren
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9804299A priority Critical patent/SE514735C2/sv
Publication of SE9804299D0 publication Critical patent/SE9804299D0/xx
Priority to CA002351687A priority patent/CA2351687C/fr
Priority to KR1020017005985A priority patent/KR20010089446A/ko
Priority to AU20114/00A priority patent/AU2011400A/en
Priority to PCT/SE1999/002166 priority patent/WO2000036892A1/fr
Priority to EP99963741A priority patent/EP1142461A2/fr
Priority to JP2000589016A priority patent/JP2002532913A/ja
Priority to CNB998143057A priority patent/CN1201647C/zh
Priority to BR9916137-0A priority patent/BR9916137A/pt
Priority to US09/457,862 priority patent/US6252769B1/en
Publication of SE9804299L publication Critical patent/SE9804299L/
Publication of SE514735C2 publication Critical patent/SE514735C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B35/00—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for
    • F04B35/04—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric
    • F04B35/045—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric using solenoids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/10—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/465—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/467—Chemical or electrical treatment, e.g. electrolytic etching using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Cookers (AREA)
SE9804299A 1998-12-11 1998-12-11 Anordning för ökande av värmeavgivning SE514735C2 (sv)

Priority Applications (10)

Application Number Priority Date Filing Date Title
SE9804299A SE514735C2 (sv) 1998-12-11 1998-12-11 Anordning för ökande av värmeavgivning
BR9916137-0A BR9916137A (pt) 1998-12-11 1999-11-23 Dispositivo para a intensificação da transferência de calor
PCT/SE1999/002166 WO2000036892A1 (fr) 1998-12-11 1999-11-23 Dispositif accroissant les transferts thermiques
KR1020017005985A KR20010089446A (ko) 1998-12-11 1999-11-23 열 전달 증가 장치
AU20114/00A AU2011400A (en) 1998-12-11 1999-11-23 Device for increasing heat transfer
CA002351687A CA2351687C (fr) 1998-12-11 1999-11-23 Dispositif accroissant les transferts thermiques
EP99963741A EP1142461A2 (fr) 1998-12-11 1999-11-23 Dispositif accroissant les transferts thermiques
JP2000589016A JP2002532913A (ja) 1998-12-11 1999-11-23 熱伝達増加装置
CNB998143057A CN1201647C (zh) 1998-12-11 1999-11-23 增加传热的装置
US09/457,862 US6252769B1 (en) 1998-12-11 1999-12-10 Device for increasing heat transfer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9804299A SE514735C2 (sv) 1998-12-11 1998-12-11 Anordning för ökande av värmeavgivning

Publications (3)

Publication Number Publication Date
SE9804299D0 SE9804299D0 (sv) 1998-12-11
SE9804299L SE9804299L (sv) 2000-06-12
SE514735C2 true SE514735C2 (sv) 2001-04-09

Family

ID=20413634

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9804299A SE514735C2 (sv) 1998-12-11 1998-12-11 Anordning för ökande av värmeavgivning

Country Status (10)

Country Link
US (1) US6252769B1 (fr)
EP (1) EP1142461A2 (fr)
JP (1) JP2002532913A (fr)
KR (1) KR20010089446A (fr)
CN (1) CN1201647C (fr)
AU (1) AU2011400A (fr)
BR (1) BR9916137A (fr)
CA (1) CA2351687C (fr)
SE (1) SE514735C2 (fr)
WO (1) WO2000036892A1 (fr)

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US7061161B2 (en) * 2002-02-15 2006-06-13 Siemens Technology-To-Business Center Llc Small piezoelectric air pumps with unobstructed airflow
US6801430B1 (en) * 2003-05-09 2004-10-05 Intel Corporation Actuation membrane to reduce an ambient temperature of heat generating device
ATE372045T1 (de) * 2003-05-09 2007-09-15 Intel Corp Eine betätigungsmembran zur verwendung in einem systemskartenschlitz
US6937472B2 (en) * 2003-05-09 2005-08-30 Intel Corporation Apparatus for cooling heat generating components within a computer system enclosure
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US7269005B2 (en) * 2003-11-21 2007-09-11 Intel Corporation Pumped loop cooling with remote heat exchanger and display cooling
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US7252140B2 (en) * 2004-09-03 2007-08-07 Nuveatix, Inc. Apparatus and method for enhanced heat transfer
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CN101065805B (zh) * 2004-11-03 2010-04-14 齐拉泰克斯技术有限公司 硬盘驱动器温度控制装置和硬盘驱动器温度改变方法
JP4910464B2 (ja) * 2005-04-18 2012-04-04 ソニー株式会社 噴流発生装置及び電子機器
JP5088526B2 (ja) 2005-04-18 2012-12-05 ソニー株式会社 噴流発生装置及び電子機器
JP4747657B2 (ja) * 2005-04-21 2011-08-17 ソニー株式会社 噴流発生装置及び電子機器
JP5096340B2 (ja) * 2005-09-16 2012-12-12 ザイラテックス テクノロジー リミテッド 製造中にディスクドライブの温度を制御するための方法および装置
US20070146993A1 (en) * 2005-12-23 2007-06-28 Intel Corporation Method, apparatus and computer system for enhancement of thermal energy transfer
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US7996174B2 (en) 2007-12-18 2011-08-09 Teradyne, Inc. Disk drive testing
US8549912B2 (en) 2007-12-18 2013-10-08 Teradyne, Inc. Disk drive transport, clamping and testing
US8041449B2 (en) 2008-04-17 2011-10-18 Teradyne, Inc. Bulk feeding disk drives to disk drive testing systems
US8095234B2 (en) 2008-04-17 2012-01-10 Teradyne, Inc. Transferring disk drives within disk drive testing systems
US8102173B2 (en) 2008-04-17 2012-01-24 Teradyne, Inc. Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit
US8117480B2 (en) * 2008-04-17 2012-02-14 Teradyne, Inc. Dependent temperature control within disk drive testing systems
US8305751B2 (en) 2008-04-17 2012-11-06 Teradyne, Inc. Vibration isolation within disk drive testing systems
US8160739B2 (en) 2008-04-17 2012-04-17 Teradyne, Inc. Transferring storage devices within storage device testing systems
US8238099B2 (en) 2008-04-17 2012-08-07 Teradyne, Inc. Enclosed operating area for disk drive testing systems
US7848106B2 (en) 2008-04-17 2010-12-07 Teradyne, Inc. Temperature control within disk drive testing systems
US7945424B2 (en) 2008-04-17 2011-05-17 Teradyne, Inc. Disk drive emulator and method of use thereof
US20090262455A1 (en) 2008-04-17 2009-10-22 Teradyne, Inc. Temperature Control Within Disk Drive Testing Systems
JP2011524060A (ja) 2008-06-03 2011-08-25 テラダイン、 インコーポレイテッド 記憶デバイスを処理する方法
WO2010019218A2 (fr) * 2008-08-11 2010-02-18 Veeco Instruments Inc. Contacts électriques pour une utilisation avec des sources de dépôt sous vide
US7995349B2 (en) 2009-07-15 2011-08-09 Teradyne, Inc. Storage device temperature sensing
US8628239B2 (en) 2009-07-15 2014-01-14 Teradyne, Inc. Storage device temperature sensing
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US8687356B2 (en) 2010-02-02 2014-04-01 Teradyne, Inc. Storage device testing system cooling
US7920380B2 (en) 2009-07-15 2011-04-05 Teradyne, Inc. Test slot cooling system for a storage device testing system
US8547123B2 (en) 2009-07-15 2013-10-01 Teradyne, Inc. Storage device testing system with a conductive heating assembly
US8466699B2 (en) 2009-07-15 2013-06-18 Teradyne, Inc. Heating storage devices in a testing system
US9779780B2 (en) 2010-06-17 2017-10-03 Teradyne, Inc. Damping vibrations within storage device testing systems
US8687349B2 (en) 2010-07-21 2014-04-01 Teradyne, Inc. Bulk transfer of storage devices using manual loading
US9001456B2 (en) 2010-08-31 2015-04-07 Teradyne, Inc. Engaging test slots
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CN103987234B (zh) * 2013-02-08 2017-08-29 台达电子工业股份有限公司 散热装置
US9459312B2 (en) 2013-04-10 2016-10-04 Teradyne, Inc. Electronic assembly test system
US20150192119A1 (en) * 2014-01-08 2015-07-09 Samsung Electro-Mechanics Co., Ltd. Piezoelectric blower
US10018429B2 (en) * 2014-08-13 2018-07-10 Asia Vital Components Co., Ltd. Apparatus body heat dissipation device
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US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
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Also Published As

Publication number Publication date
CA2351687A1 (fr) 2000-06-22
CN1330859A (zh) 2002-01-09
US6252769B1 (en) 2001-06-26
EP1142461A2 (fr) 2001-10-10
WO2000036892A8 (fr) 2000-08-03
CA2351687C (fr) 2007-06-12
KR20010089446A (ko) 2001-10-06
BR9916137A (pt) 2001-09-11
WO2000036892A1 (fr) 2000-06-22
CN1201647C (zh) 2005-05-11
JP2002532913A (ja) 2002-10-02
SE9804299L (sv) 2000-06-12
SE9804299D0 (sv) 1998-12-11
AU2011400A (en) 2000-07-03

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