KR20010089446A - 열 전달 증가 장치 - Google Patents

열 전달 증가 장치 Download PDF

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Publication number
KR20010089446A
KR20010089446A KR1020017005985A KR20017005985A KR20010089446A KR 20010089446 A KR20010089446 A KR 20010089446A KR 1020017005985 A KR1020017005985 A KR 1020017005985A KR 20017005985 A KR20017005985 A KR 20017005985A KR 20010089446 A KR20010089446 A KR 20010089446A
Authority
KR
South Korea
Prior art keywords
air
cabinet
nozzle
heat transfer
membrane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020017005985A
Other languages
English (en)
Korean (ko)
Inventor
툴스테트칼헨릭
베르크만파트릭
에드그렌안데르스
Original Assignee
클라스 노린, 쿨트 헬스트룀
텔레폰악티에볼라겟엘엠에릭슨(펍)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 클라스 노린, 쿨트 헬스트룀, 텔레폰악티에볼라겟엘엠에릭슨(펍) filed Critical 클라스 노린, 쿨트 헬스트룀
Publication of KR20010089446A publication Critical patent/KR20010089446A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B35/00—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for
    • F04B35/04—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric
    • F04B35/045—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric using solenoids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/10—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
  • Cookers (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
KR1020017005985A 1998-12-11 1999-11-23 열 전달 증가 장치 Withdrawn KR20010089446A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9804299-7 1998-12-11
SE9804299A SE514735C2 (sv) 1998-12-11 1998-12-11 Anordning för ökande av värmeavgivning
PCT/SE1999/002166 WO2000036892A1 (en) 1998-12-11 1999-11-23 Device for increasing heat transfer

Publications (1)

Publication Number Publication Date
KR20010089446A true KR20010089446A (ko) 2001-10-06

Family

ID=20413634

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020017005985A Withdrawn KR20010089446A (ko) 1998-12-11 1999-11-23 열 전달 증가 장치

Country Status (10)

Country Link
US (1) US6252769B1 (https=)
EP (1) EP1142461A2 (https=)
JP (1) JP2002532913A (https=)
KR (1) KR20010089446A (https=)
CN (1) CN1201647C (https=)
AU (1) AU2011400A (https=)
BR (1) BR9916137A (https=)
CA (1) CA2351687C (https=)
SE (1) SE514735C2 (https=)
WO (1) WO2000036892A1 (https=)

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US6904968B2 (en) * 2001-09-14 2005-06-14 Hewlett-Packard Development Company, L.P. Method and apparatus for individually cooling components of electronic systems
US7061161B2 (en) * 2002-02-15 2006-06-13 Siemens Technology-To-Business Center Llc Small piezoelectric air pumps with unobstructed airflow
US6937472B2 (en) * 2003-05-09 2005-08-30 Intel Corporation Apparatus for cooling heat generating components within a computer system enclosure
ATE372045T1 (de) * 2003-05-09 2007-09-15 Intel Corp Eine betätigungsmembran zur verwendung in einem systemskartenschlitz
US6801430B1 (en) * 2003-05-09 2004-10-05 Intel Corporation Actuation membrane to reduce an ambient temperature of heat generating device
WO2005008348A2 (en) * 2003-07-07 2005-01-27 Georgia Tech Research Corporation System and method for thermal management using distributed synthetic jet actuators
US7269005B2 (en) * 2003-11-21 2007-09-11 Intel Corporation Pumped loop cooling with remote heat exchanger and display cooling
US7527086B2 (en) * 2004-07-20 2009-05-05 National Taiwan University Double-acting device for generating synthetic jets
US7252140B2 (en) * 2004-09-03 2007-08-07 Nuveatix, Inc. Apparatus and method for enhanced heat transfer
CN100388872C (zh) * 2004-09-29 2008-05-14 鸿进科技有限公司 散热装置及散热方法
GB2434910B (en) * 2004-11-03 2008-07-30 Xyratex Tech Ltd A temperature control, apparatus for a hard disk drive and a method of varying the temperature of a hard disk drive
JP5088526B2 (ja) 2005-04-18 2012-12-05 ソニー株式会社 噴流発生装置及び電子機器
JP4910464B2 (ja) * 2005-04-18 2012-04-04 ソニー株式会社 噴流発生装置及び電子機器
JP4747657B2 (ja) * 2005-04-21 2011-08-17 ソニー株式会社 噴流発生装置及び電子機器
JP5096340B2 (ja) * 2005-09-16 2012-12-12 ザイラテックス テクノロジー リミテッド 製造中にディスクドライブの温度を制御するための方法および装置
US20070146993A1 (en) * 2005-12-23 2007-06-28 Intel Corporation Method, apparatus and computer system for enhancement of thermal energy transfer
FR2900308B1 (fr) * 2006-04-21 2008-07-04 D Aviat Latecoere Societeanony Diaphragme dispose sur un circuit de ventilation d'un meuble electronique, meuble electronique correspondant et utilisation particuliere de ce diaphragme
US7996174B2 (en) 2007-12-18 2011-08-09 Teradyne, Inc. Disk drive testing
US8549912B2 (en) 2007-12-18 2013-10-08 Teradyne, Inc. Disk drive transport, clamping and testing
US7945424B2 (en) 2008-04-17 2011-05-17 Teradyne, Inc. Disk drive emulator and method of use thereof
US20090262455A1 (en) 2008-04-17 2009-10-22 Teradyne, Inc. Temperature Control Within Disk Drive Testing Systems
US7848106B2 (en) 2008-04-17 2010-12-07 Teradyne, Inc. Temperature control within disk drive testing systems
US8305751B2 (en) 2008-04-17 2012-11-06 Teradyne, Inc. Vibration isolation within disk drive testing systems
US8160739B2 (en) 2008-04-17 2012-04-17 Teradyne, Inc. Transferring storage devices within storage device testing systems
US8102173B2 (en) 2008-04-17 2012-01-24 Teradyne, Inc. Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit
US8238099B2 (en) 2008-04-17 2012-08-07 Teradyne, Inc. Enclosed operating area for disk drive testing systems
US8041449B2 (en) 2008-04-17 2011-10-18 Teradyne, Inc. Bulk feeding disk drives to disk drive testing systems
US8117480B2 (en) 2008-04-17 2012-02-14 Teradyne, Inc. Dependent temperature control within disk drive testing systems
US8095234B2 (en) 2008-04-17 2012-01-10 Teradyne, Inc. Transferring disk drives within disk drive testing systems
WO2009148942A2 (en) 2008-06-03 2009-12-10 Teradyne, Inc. Processing storage devices
WO2010019213A2 (en) * 2008-08-11 2010-02-18 Veeco Instruments Inc. Vacuum deposition sources having heated effusion orifices
US8466699B2 (en) 2009-07-15 2013-06-18 Teradyne, Inc. Heating storage devices in a testing system
US8547123B2 (en) 2009-07-15 2013-10-01 Teradyne, Inc. Storage device testing system with a conductive heating assembly
US8628239B2 (en) 2009-07-15 2014-01-14 Teradyne, Inc. Storage device temperature sensing
US7995349B2 (en) 2009-07-15 2011-08-09 Teradyne, Inc. Storage device temperature sensing
US8116079B2 (en) 2009-07-15 2012-02-14 Teradyne, Inc. Storage device testing system cooling
US7920380B2 (en) 2009-07-15 2011-04-05 Teradyne, Inc. Test slot cooling system for a storage device testing system
US8687356B2 (en) 2010-02-02 2014-04-01 Teradyne, Inc. Storage device testing system cooling
US9779780B2 (en) 2010-06-17 2017-10-03 Teradyne, Inc. Damping vibrations within storage device testing systems
US8687349B2 (en) 2010-07-21 2014-04-01 Teradyne, Inc. Bulk transfer of storage devices using manual loading
US9001456B2 (en) 2010-08-31 2015-04-07 Teradyne, Inc. Engaging test slots
WO2012176083A2 (en) 2011-06-20 2012-12-27 Koninklijke Philips Electronics N.V. Active cooling device with electro-statically moving electrode and method of active cooling with electro-statically moving electrode
CN103987234B (zh) * 2013-02-08 2017-08-29 台达电子工业股份有限公司 散热装置
US9459312B2 (en) 2013-04-10 2016-10-04 Teradyne, Inc. Electronic assembly test system
US20150192119A1 (en) * 2014-01-08 2015-07-09 Samsung Electro-Mechanics Co., Ltd. Piezoelectric blower
US10018429B2 (en) * 2014-08-13 2018-07-10 Asia Vital Components Co., Ltd. Apparatus body heat dissipation device
US10045461B1 (en) * 2014-09-30 2018-08-07 Apple Inc. Electronic device with diaphragm cooling
US11226390B2 (en) 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
US10725091B2 (en) 2017-08-28 2020-07-28 Teradyne, Inc. Automated test system having multiple stages
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
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Also Published As

Publication number Publication date
WO2000036892A8 (en) 2000-08-03
CN1201647C (zh) 2005-05-11
US6252769B1 (en) 2001-06-26
JP2002532913A (ja) 2002-10-02
BR9916137A (pt) 2001-09-11
EP1142461A2 (en) 2001-10-10
CN1330859A (zh) 2002-01-09
SE9804299L (sv) 2000-06-12
SE514735C2 (sv) 2001-04-09
CA2351687A1 (en) 2000-06-22
SE9804299D0 (sv) 1998-12-11
WO2000036892A1 (en) 2000-06-22
AU2011400A (en) 2000-07-03
CA2351687C (en) 2007-06-12

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20010511

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid