CA2346111A1 - Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric - Google Patents

Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric Download PDF

Info

Publication number
CA2346111A1
CA2346111A1 CA002346111A CA2346111A CA2346111A1 CA 2346111 A1 CA2346111 A1 CA 2346111A1 CA 002346111 A CA002346111 A CA 002346111A CA 2346111 A CA2346111 A CA 2346111A CA 2346111 A1 CA2346111 A1 CA 2346111A1
Authority
CA
Canada
Prior art keywords
particles
fabric
prepreg
prepreg according
glass fibers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002346111A
Other languages
English (en)
French (fr)
Inventor
Ernest L. Lawton
Kami Lammon-Hilinski
Vedagiri Velpari
Bruce E. Novich
Walter J. Robertson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PPG Industries Ohio Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2346111A1 publication Critical patent/CA2346111A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0254—Microballoons or hollow filler particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Composite Materials (AREA)
  • General Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Reinforced Plastic Materials (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Laminated Bodies (AREA)
  • Woven Fabrics (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
CA002346111A 1998-10-13 1999-10-08 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric Abandoned CA2346111A1 (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US17057898A 1998-10-13 1998-10-13
US09/170,578 1998-10-13
US13307699P 1999-05-07 1999-05-07
US13307599P 1999-05-07 1999-05-07
US60/133,075 1999-05-07
US60/133,076 1999-05-07
US14633799P 1999-07-30 1999-07-30
US60/146,337 1999-07-30
PCT/US1999/021443 WO2000021900A1 (en) 1998-10-13 1999-10-08 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric

Publications (1)

Publication Number Publication Date
CA2346111A1 true CA2346111A1 (en) 2000-04-20

Family

ID=27495008

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002346111A Abandoned CA2346111A1 (en) 1998-10-13 1999-10-08 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric

Country Status (7)

Country Link
EP (1) EP1124770A1 (zh)
JP (1) JP2002527538A (zh)
CN (2) CN100488906C (zh)
AU (1) AU6391499A (zh)
CA (1) CA2346111A1 (zh)
MX (1) MXPA01003656A (zh)
WO (1) WO2000021900A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210402719A1 (en) * 2018-11-13 2021-12-30 J&P Coats Limited Vehicle component based on selective commingled fiber bundle having integral electrical harness and embedded electronics

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6593255B1 (en) * 1998-03-03 2003-07-15 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6949289B1 (en) * 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
KR20020057947A (ko) * 1999-07-30 2002-07-12 랜닝 지. 브라이어 침윤된 유리섬유 스트랜드 및 이를 포함한 제품
MXPA01003660A (es) * 1999-07-30 2001-07-01 Torones de fibra de vidrio impregnados y productos que los inclu
WO2001009226A1 (en) * 1999-07-30 2001-02-08 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US20020051882A1 (en) * 2000-02-18 2002-05-02 Lawton Ernest L. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
AU2001252916A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068755A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001252915A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068753A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068748A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001247491A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
FR2811662B1 (fr) * 2000-07-13 2003-07-18 Saint Gobain Isover Produit d'isolation thermique/phonique a base de laine minerale
US20040052997A1 (en) * 2002-09-17 2004-03-18 Ietsugu Santo Composite pressure container or tubular body and composite intermediate
JP4996086B2 (ja) * 2005-09-29 2012-08-08 株式会社東芝 マイカテープおよびこのマイカテープを用いた回転電機コイル
JP4476226B2 (ja) * 2006-02-24 2010-06-09 三洋電機株式会社 回路基板および回路基板の製造方法
WO2009035439A1 (en) * 2007-09-14 2009-03-19 Henkel Ag & Co, Kgaa Thermally conductive composition
JP5181221B2 (ja) * 2008-01-15 2013-04-10 日立化成株式会社 低熱膨張性低誘電損失プリプレグ及びその応用品
EP2163570A1 (en) * 2008-09-10 2010-03-17 Rohm and Haas France SA Urethane Arcrylic Blends
WO2011078339A1 (ja) 2009-12-25 2011-06-30 日立化成工業株式会社 熱硬化性樹脂組成物、樹脂組成物ワニスの製造方法、プリプレグ及び積層板
CN102548222A (zh) * 2010-12-30 2012-07-04 北大方正集团有限公司 电路板的制作方法、装置及电路板
AT511501A1 (de) * 2011-06-09 2012-12-15 Helfenberger Immobilien Llc & Co Textilforschungs Und Entwicklungs Kg Textiles flächengebilde
KR101420525B1 (ko) 2012-11-23 2014-07-16 삼성전기주식회사 적층형 인덕터 및 이의 제조방법
KR20150046609A (ko) * 2013-10-22 2015-04-30 삼성전기주식회사 인쇄회로기판용 절연기판 및 인쇄회로기판
CN103613909B (zh) * 2013-11-22 2016-06-29 哈尔滨工业大学 玻璃纤维复合材料电机护环
JP2018058938A (ja) * 2016-10-03 2018-04-12 学校法人金沢工業大学 複合材料および複合材料の製造方法
FR3071891B1 (fr) * 2017-09-29 2021-04-23 Valeo Materiaux De Friction Ciment d'impregnation aqueux
CN108102125A (zh) * 2017-12-25 2018-06-01 广东生益科技股份有限公司 预浸料、层压板和印制电路板
US11618240B2 (en) 2018-03-30 2023-04-04 Toray Industries, Inc. Nonwoven fabric sheet
TWI718907B (zh) * 2020-03-18 2021-02-11 易華電子股份有限公司 用於印刷電路板雷射鑽孔之墊板
WO2021235014A1 (ja) 2020-05-22 2021-11-25 日東紡績株式会社 表面着色ガラスクロス及び繊維強化樹脂成形品
CN114059349B (zh) * 2021-11-23 2022-09-06 中国科学院合肥物质科学研究院 玻璃纤维带表面改性方法和玻璃纤维带及其应用
CN114315172B (zh) * 2021-12-30 2024-04-16 中国建筑材料科学研究总院有限公司 浸润剂及制备方法和用途，镀铝玻璃纤维及制备方法和用途

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US3312569A (en) * 1965-05-07 1967-04-04 Owens Corning Fiberglass Corp Compatible fibrous glass reinforcements of superior bonding and wetting characteristics
US5217778A (en) * 1982-10-21 1993-06-08 Raymark Industries, Inc. Composite fiber friction facing
US4542106A (en) * 1983-12-19 1985-09-17 Ppg Industries, Inc. Fiber glass composition
DE3826522A1 (de) * 1988-08-04 1990-02-08 Teldix Gmbh Leiterplatte
JPH0818853B2 (ja) * 1989-11-15 1996-02-28 日東紡績株式会社 ガラスクロスの製造方法
JP2993065B2 (ja) * 1990-07-27 1999-12-20 三菱瓦斯化学株式会社 表面平滑金属箔張積層板
CA2060709C (en) * 1991-02-08 1996-06-04 Kiyotaka Komori Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material
JP3116341B2 (ja) * 1995-04-26 2000-12-11 新神戸電機株式会社 積層板および積層板基材用ガラス織布、ならびに積層板の使用法
JP3520604B2 (ja) * 1995-05-23 2004-04-19 日立化成工業株式会社 コンポジット積層板
US5773146A (en) * 1995-06-05 1998-06-30 Ppg Industries, Inc. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
US6187852B1 (en) * 1996-03-22 2001-02-13 Isola Laminate Systems Corp. Fillers for improved epoxy laminates

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210402719A1 (en) * 2018-11-13 2021-12-30 J&P Coats Limited Vehicle component based on selective commingled fiber bundle having integral electrical harness and embedded electronics

Also Published As

Publication number Publication date
CN101117275B (zh) 2012-10-24
CN1332704A (zh) 2002-01-23
CN100488906C (zh) 2009-05-20
MXPA01003656A (es) 2001-07-01
AU6391499A (en) 2000-05-01
JP2002527538A (ja) 2002-08-27
EP1124770A1 (en) 2001-08-22
CN101117275A (zh) 2008-02-06
WO2000021900A1 (en) 2000-04-20

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Legal Events

Date Code Title Description
EEER Examination request
FZDE Dead