CA2302357A1 - Spring clamp assembly for thermal stacked components - Google Patents

Spring clamp assembly for thermal stacked components Download PDF

Info

Publication number
CA2302357A1
CA2302357A1 CA002302357A CA2302357A CA2302357A1 CA 2302357 A1 CA2302357 A1 CA 2302357A1 CA 002302357 A CA002302357 A CA 002302357A CA 2302357 A CA2302357 A CA 2302357A CA 2302357 A1 CA2302357 A1 CA 2302357A1
Authority
CA
Canada
Prior art keywords
spring
coil
cross member
clamp device
central portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002302357A
Other languages
English (en)
French (fr)
Inventor
Randolph H. Cook
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermal Products Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority claimed from PCT/US1997/015562 external-priority patent/WO1999012202A1/en
Publication of CA2302357A1 publication Critical patent/CA2302357A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Springs (AREA)
CA002302357A 1997-09-04 1997-09-04 Spring clamp assembly for thermal stacked components Abandoned CA2302357A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1997/015562 WO1999012202A1 (en) 1996-09-03 1997-09-04 Spring clamp assembly for thermal stacked components

Publications (1)

Publication Number Publication Date
CA2302357A1 true CA2302357A1 (en) 1999-03-11

Family

ID=22261557

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002302357A Abandoned CA2302357A1 (en) 1997-09-04 1997-09-04 Spring clamp assembly for thermal stacked components

Country Status (3)

Country Link
EP (1) EP1029350A4 (ja)
JP (1) JP2001515272A (ja)
CA (1) CA2302357A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5127886B2 (ja) 2010-06-25 2013-01-23 三菱電機株式会社 発熱部品と放熱部品の組付用金具およびこの組付用金具を用いたヒートシンク組立体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5329426A (en) * 1993-03-22 1994-07-12 Digital Equipment Corporation Clip-on heat sink
US5617292A (en) * 1995-09-14 1997-04-01 International Electronic Research Corporation Two piece clip for heat dissipating assemblies
DE29620432U1 (de) * 1996-11-23 1997-02-06 Cheng, Chun-cheng, Hsintien, Taipeh Befestigungsvorrichtung für einen Wärmeableitkörper

Also Published As

Publication number Publication date
EP1029350A4 (en) 2001-01-31
JP2001515272A (ja) 2001-09-18
EP1029350A1 (en) 2000-08-23

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Legal Events

Date Code Title Description
FZDE Discontinued