EP1029350A4 - Spring clamp assembly for thermal stacked components - Google Patents

Spring clamp assembly for thermal stacked components

Info

Publication number
EP1029350A4
EP1029350A4 EP97939798A EP97939798A EP1029350A4 EP 1029350 A4 EP1029350 A4 EP 1029350A4 EP 97939798 A EP97939798 A EP 97939798A EP 97939798 A EP97939798 A EP 97939798A EP 1029350 A4 EP1029350 A4 EP 1029350A4
Authority
EP
European Patent Office
Prior art keywords
thermal
clamp assembly
spring clamp
stacked components
stacked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97939798A
Other languages
German (de)
French (fr)
Other versions
EP1029350A1 (en
Inventor
Randolph H Cook
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermal Products Inc
Original Assignee
Aavid Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Engineering Inc filed Critical Aavid Engineering Inc
Priority claimed from PCT/US1997/015562 external-priority patent/WO1999012202A1/en
Publication of EP1029350A1 publication Critical patent/EP1029350A1/en
Publication of EP1029350A4 publication Critical patent/EP1029350A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
EP97939798A 1997-09-04 1997-09-04 Spring clamp assembly for thermal stacked components Withdrawn EP1029350A4 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1997/015562 WO1999012202A1 (en) 1996-09-03 1997-09-04 Spring clamp assembly for thermal stacked components

Publications (2)

Publication Number Publication Date
EP1029350A1 EP1029350A1 (en) 2000-08-23
EP1029350A4 true EP1029350A4 (en) 2001-01-31

Family

ID=22261557

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97939798A Withdrawn EP1029350A4 (en) 1997-09-04 1997-09-04 Spring clamp assembly for thermal stacked components

Country Status (3)

Country Link
EP (1) EP1029350A4 (en)
JP (1) JP2001515272A (en)
CA (1) CA2302357A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5127886B2 (en) 2010-06-25 2013-01-23 三菱電機株式会社 Mounting bracket for heat-generating component and heat-dissipating component and heat sink assembly using the mounting bracket

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5329426A (en) * 1993-03-22 1994-07-12 Digital Equipment Corporation Clip-on heat sink
DE29620432U1 (en) * 1996-11-23 1997-02-06 Cheng Chun Cheng Fastening device for a heat sink
US5617292A (en) * 1995-09-14 1997-04-01 International Electronic Research Corporation Two piece clip for heat dissipating assemblies

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5329426A (en) * 1993-03-22 1994-07-12 Digital Equipment Corporation Clip-on heat sink
US5617292A (en) * 1995-09-14 1997-04-01 International Electronic Research Corporation Two piece clip for heat dissipating assemblies
DE29620432U1 (en) * 1996-11-23 1997-02-06 Cheng Chun Cheng Fastening device for a heat sink

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
CARUTHERS F: "ADVANCED PACKAGING BECOMES PRACTICAL FOR PORTABLES", COMPUTER DESIGN,PENNWELL PUBL. LITTLETON, MASSACHUSETTS,US, vol. 34, no. 3, 1 March 1995 (1995-03-01), pages 99 - 104, XP000504730, ISSN: 0010-4566 *
See also references of WO9912202A1 *

Also Published As

Publication number Publication date
JP2001515272A (en) 2001-09-18
CA2302357A1 (en) 1999-03-11
EP1029350A1 (en) 2000-08-23

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