CA2273542A1 - Stratifies de film mince - Google Patents
Stratifies de film mince Download PDFInfo
- Publication number
- CA2273542A1 CA2273542A1 CA 2273542 CA2273542A CA2273542A1 CA 2273542 A1 CA2273542 A1 CA 2273542A1 CA 2273542 CA2273542 CA 2273542 CA 2273542 A CA2273542 A CA 2273542A CA 2273542 A1 CA2273542 A1 CA 2273542A1
- Authority
- CA
- Canada
- Prior art keywords
- resin
- liquid crystal
- crystal polymer
- copper foil
- polymer film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000010409 thin film Substances 0.000 title abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 125
- 229920005989 resin Polymers 0.000 claims abstract description 100
- 239000011347 resin Substances 0.000 claims abstract description 100
- 239000011889 copper foil Substances 0.000 claims abstract description 72
- 229920000106 Liquid crystal polymer Polymers 0.000 claims abstract description 65
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims abstract description 65
- 229910052802 copper Inorganic materials 0.000 claims abstract description 54
- 239000010949 copper Substances 0.000 claims abstract description 54
- 239000004840 adhesive resin Substances 0.000 claims abstract description 20
- 229920006223 adhesive resin Polymers 0.000 claims abstract description 20
- 239000002759 woven fabric Substances 0.000 claims abstract description 11
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 10
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 8
- 239000000123 paper Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 30
- 239000000835 fiber Substances 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 239000000945 filler Substances 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 9
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 9
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 6
- 239000003365 glass fiber Substances 0.000 claims description 6
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 6
- -1 polytetrafluoroethylene Polymers 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 239000012779 reinforcing material Substances 0.000 claims description 6
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 5
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000002318 adhesion promoter Substances 0.000 claims description 5
- 229920006231 aramid fiber Polymers 0.000 claims description 5
- 229910002113 barium titanate Inorganic materials 0.000 claims description 5
- 239000004927 clay Substances 0.000 claims description 5
- 229910052570 clay Inorganic materials 0.000 claims description 5
- 239000004643 cyanate ester Substances 0.000 claims description 5
- 239000010445 mica Substances 0.000 claims description 5
- 229910052618 mica group Inorganic materials 0.000 claims description 5
- 238000001020 plasma etching Methods 0.000 claims description 5
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 5
- 229920001955 polyphenylene ether Polymers 0.000 claims description 5
- 230000002441 reversible effect Effects 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 239000000454 talc Substances 0.000 claims description 4
- 229910052623 talc Inorganic materials 0.000 claims description 4
- 230000003068 static effect Effects 0.000 claims description 3
- 239000010408 film Substances 0.000 abstract description 42
- 239000004744 fabric Substances 0.000 abstract description 10
- 229920001169 thermoplastic Polymers 0.000 abstract description 2
- 239000004416 thermosoftening plastic Substances 0.000 abstract description 2
- 230000002787 reinforcement Effects 0.000 description 6
- 239000011888 foil Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229920013683 Celanese Polymers 0.000 description 1
- 229920013651 Zenite Polymers 0.000 description 1
- HJJVPARKXDDIQD-UHFFFAOYSA-N bromuconazole Chemical compound ClC1=CC(Cl)=CC=C1C1(CN2N=CN=C2)OCC(Br)C1 HJJVPARKXDDIQD-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000002294 plasma sputter deposition Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- PGNWIWKMXVDXHP-UHFFFAOYSA-L zinc;1,3-benzothiazole-2-thiolate Chemical compound [Zn+2].C1=CC=C2SC([S-])=NC2=C1.C1=CC=C2SC([S-])=NC2=C1 PGNWIWKMXVDXHP-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10258998A | 1998-06-23 | 1998-06-23 | |
| US09/102,589 | 1998-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2273542A1 true CA2273542A1 (fr) | 1999-12-23 |
Family
ID=31186154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2273542 Abandoned CA2273542A1 (fr) | 1998-06-23 | 1999-06-03 | Stratifies de film mince |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2273542A1 (fr) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6538211B2 (en) | 2000-08-15 | 2003-03-25 | World Properties, Inc. | Multi-layer circuits and methods of manufacture thereof |
| US6602583B2 (en) | 2000-12-14 | 2003-08-05 | World Properties, Inc. | Liquid crystalline polymer bond plies and circuits formed therefrom |
| US6761834B2 (en) | 2000-09-20 | 2004-07-13 | World Properties, Inc. | Electrostatic deposition of high temperature, high performance liquid crystalline polymers |
| US6994896B2 (en) | 2002-09-16 | 2006-02-07 | World Properties, Inc. | Liquid crystalline polymer composites, method of manufacture thereof, and articles formed therefrom |
| US7180172B2 (en) | 2003-06-19 | 2007-02-20 | World Properties, Inc. | Circuits, multi-layer circuits, and methods of manufacture thereof |
| US7227179B2 (en) | 2002-09-30 | 2007-06-05 | World Properties, Inc. | Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
| WO2007123695A2 (fr) * | 2006-03-31 | 2007-11-01 | Intel Corporation | Nanoargiles dans des compositions polymères, articles contenant ces argiles, procédé de fabrication de celles-ci et systèmes les contenant |
| US7524388B2 (en) | 2005-05-10 | 2009-04-28 | World Properties, Inc. | Composites, method of manufacture thereof, and articles formed therefrom |
| US7549220B2 (en) | 2003-12-17 | 2009-06-23 | World Properties, Inc. | Method for making a multilayer circuit |
| US7572515B2 (en) | 2004-01-20 | 2009-08-11 | World Properties, Inc. | Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
| US8778124B2 (en) * | 2008-01-17 | 2014-07-15 | Harris Corporation | Method for making three-dimensional liquid crystal polymer multilayer circuit boards |
| US9117602B2 (en) | 2008-01-17 | 2015-08-25 | Harris Corporation | Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods |
| CN109486185A (zh) * | 2018-12-10 | 2019-03-19 | 苏州大学 | 芳纶纤维增强氰酸酯复合材料 |
-
1999
- 1999-06-03 CA CA 2273542 patent/CA2273542A1/fr not_active Abandoned
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6538211B2 (en) | 2000-08-15 | 2003-03-25 | World Properties, Inc. | Multi-layer circuits and methods of manufacture thereof |
| US6761834B2 (en) | 2000-09-20 | 2004-07-13 | World Properties, Inc. | Electrostatic deposition of high temperature, high performance liquid crystalline polymers |
| US6602583B2 (en) | 2000-12-14 | 2003-08-05 | World Properties, Inc. | Liquid crystalline polymer bond plies and circuits formed therefrom |
| US6994896B2 (en) | 2002-09-16 | 2006-02-07 | World Properties, Inc. | Liquid crystalline polymer composites, method of manufacture thereof, and articles formed therefrom |
| US7227179B2 (en) | 2002-09-30 | 2007-06-05 | World Properties, Inc. | Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
| US7180172B2 (en) | 2003-06-19 | 2007-02-20 | World Properties, Inc. | Circuits, multi-layer circuits, and methods of manufacture thereof |
| US7549220B2 (en) | 2003-12-17 | 2009-06-23 | World Properties, Inc. | Method for making a multilayer circuit |
| US7572515B2 (en) | 2004-01-20 | 2009-08-11 | World Properties, Inc. | Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
| US7524388B2 (en) | 2005-05-10 | 2009-04-28 | World Properties, Inc. | Composites, method of manufacture thereof, and articles formed therefrom |
| WO2007123695A3 (fr) * | 2006-03-31 | 2008-02-28 | Intel Corp | Nanoargiles dans des compositions polymères, articles contenant ces argiles, procédé de fabrication de celles-ci et systèmes les contenant |
| WO2007123695A2 (fr) * | 2006-03-31 | 2007-11-01 | Intel Corporation | Nanoargiles dans des compositions polymères, articles contenant ces argiles, procédé de fabrication de celles-ci et systèmes les contenant |
| US8163830B2 (en) | 2006-03-31 | 2012-04-24 | Intel Corporation | Nanoclays in polymer compositions, articles containing same, processes of making same, and systems containing same |
| US8778124B2 (en) * | 2008-01-17 | 2014-07-15 | Harris Corporation | Method for making three-dimensional liquid crystal polymer multilayer circuit boards |
| US9117602B2 (en) | 2008-01-17 | 2015-08-25 | Harris Corporation | Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods |
| US9922783B2 (en) | 2008-01-17 | 2018-03-20 | Harris Corporation | Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch |
| US10818448B2 (en) | 2008-01-17 | 2020-10-27 | Harris Corporation | Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including air |
| US11657989B2 (en) | 2008-01-17 | 2023-05-23 | Harris Corporation | Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including air |
| CN109486185A (zh) * | 2018-12-10 | 2019-03-19 | 苏州大学 | 芳纶纤维增强氰酸酯复合材料 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Dead |