CA2150573A1 - Transistor en couches minces a isolateur de gachette dielectrique a trois couches, methode de fabrication de ce transistor et afficheur a matrice active comportant une multiplicite de ces transistors - Google Patents
Transistor en couches minces a isolateur de gachette dielectrique a trois couches, methode de fabrication de ce transistor et afficheur a matrice active comportant une multiplicite de ces transistorsInfo
- Publication number
- CA2150573A1 CA2150573A1 CA002150573A CA2150573A CA2150573A1 CA 2150573 A1 CA2150573 A1 CA 2150573A1 CA 002150573 A CA002150573 A CA 002150573A CA 2150573 A CA2150573 A CA 2150573A CA 2150573 A1 CA2150573 A1 CA 2150573A1
- Authority
- CA
- Canada
- Prior art keywords
- thin film
- layer
- film transistor
- dielectric
- gate insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 29
- 239000012212 insulator Substances 0.000 title claims abstract description 15
- 239000011159 matrix material Substances 0.000 title claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 230000006872 improvement Effects 0.000 claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 55
- 239000010408 film Substances 0.000 claims description 48
- 239000004065 semiconductor Substances 0.000 claims description 14
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 claims description 9
- 239000011651 chromium Substances 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 9
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 238000002161 passivation Methods 0.000 claims description 8
- 229910004205 SiNX Inorganic materials 0.000 claims description 7
- 150000004767 nitrides Chemical class 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 229910003070 TaOx Inorganic materials 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229910017107 AlOx Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 51
- 235000012239 silicon dioxide Nutrition 0.000 description 23
- 239000000377 silicon dioxide Substances 0.000 description 23
- 229910052681 coesite Inorganic materials 0.000 description 21
- 229910052906 cristobalite Inorganic materials 0.000 description 21
- 229910052682 stishovite Inorganic materials 0.000 description 21
- 229910052905 tridymite Inorganic materials 0.000 description 21
- 230000015556 catabolic process Effects 0.000 description 20
- 238000009413 insulation Methods 0.000 description 19
- 239000003990 capacitor Substances 0.000 description 14
- 238000012360 testing method Methods 0.000 description 11
- 239000002356 single layer Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 4
- 238000000572 ellipsometry Methods 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 2
- -1 SiOXNy Inorganic materials 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 230000035899 viability Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66969—Multistep manufacturing processes of devices having semiconductor bodies not comprising group 14 or group 13/15 materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/469—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers
- H01L21/471—Inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/469—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers
- H01L21/471—Inorganic layers
- H01L21/473—Inorganic layers composed of oxides or glassy oxides or oxide based glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Thin Film Transistor (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002150573A CA2150573A1 (fr) | 1992-12-01 | 1992-12-01 | Transistor en couches minces a isolateur de gachette dielectrique a trois couches, methode de fabrication de ce transistor et afficheur a matrice active comportant une multiplicite de ces transistors |
PCT/CA1992/000519 WO1994013018A1 (fr) | 1992-12-01 | 1992-12-01 | Transistor a couches minces possedant un dielectrique de grille a trois couches, son procede de fabrication, et affichage a matrice active muni d'une pluralite de transistors de ce type |
JP6512598A JPH08503815A (ja) | 1992-12-01 | 1992-12-01 | 三層誘電体のゲート絶縁体を有する薄膜トランジスタ、このような薄膜トランジスタの製造方法、及び複数のこのような薄膜トランジスタを有するアクティブなマトリクスディスプレイ |
EP92923642A EP0672301A1 (fr) | 1992-12-01 | 1992-12-01 | Transistor a couches minces possedant un dielectrique de grille a trois couches, son procede de fabrication, et affichage a matrice active muni d'une pluralite de transistors de ce type |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002150573A CA2150573A1 (fr) | 1992-12-01 | 1992-12-01 | Transistor en couches minces a isolateur de gachette dielectrique a trois couches, methode de fabrication de ce transistor et afficheur a matrice active comportant une multiplicite de ces transistors |
PCT/CA1992/000519 WO1994013018A1 (fr) | 1992-12-01 | 1992-12-01 | Transistor a couches minces possedant un dielectrique de grille a trois couches, son procede de fabrication, et affichage a matrice active muni d'une pluralite de transistors de ce type |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2150573A1 true CA2150573A1 (fr) | 1994-06-09 |
Family
ID=25677983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002150573A Abandoned CA2150573A1 (fr) | 1992-12-01 | 1992-12-01 | Transistor en couches minces a isolateur de gachette dielectrique a trois couches, methode de fabrication de ce transistor et afficheur a matrice active comportant une multiplicite de ces transistors |
Country Status (2)
Country | Link |
---|---|
CA (1) | CA2150573A1 (fr) |
WO (1) | WO1994013018A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8835909B2 (en) | 2008-08-04 | 2014-09-16 | The Trustees Of Princeton University | Hybrid dielectric material for thin film transistors |
CN106292151B (zh) * | 2015-06-10 | 2017-12-26 | 钱鸿斌 | 采用有机反射镜管的微型投影装置 |
CN110797413A (zh) * | 2019-11-11 | 2020-02-14 | 云谷(固安)科技有限公司 | 薄膜晶体管、像素驱动电路和显示面板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3671820A (en) * | 1970-04-27 | 1972-06-20 | Rudolph R Haering | High voltage thin-film transistor |
JPH01291467A (ja) * | 1988-05-19 | 1989-11-24 | Toshiba Corp | 薄膜トランジスタ |
JPH0816756B2 (ja) * | 1988-08-10 | 1996-02-21 | シャープ株式会社 | 透過型アクティブマトリクス液晶表示装置 |
JPH03190141A (ja) * | 1989-12-12 | 1991-08-20 | Samsung Electron Devices Co Ltd | 平板ディスプレー用薄膜トランジスタ及びその製造方法 |
-
1992
- 1992-12-01 WO PCT/CA1992/000519 patent/WO1994013018A1/fr not_active Application Discontinuation
- 1992-12-01 CA CA002150573A patent/CA2150573A1/fr not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO1994013018A1 (fr) | 1994-06-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
FZDE | Discontinued |