CA2028899A1 - Lasers a semiconducteur et methode de fabrication de ces lasers - Google Patents

Lasers a semiconducteur et methode de fabrication de ces lasers

Info

Publication number
CA2028899A1
CA2028899A1 CA2028899A CA2028899A CA2028899A1 CA 2028899 A1 CA2028899 A1 CA 2028899A1 CA 2028899 A CA2028899 A CA 2028899A CA 2028899 A CA2028899 A CA 2028899A CA 2028899 A1 CA2028899 A1 CA 2028899A1
Authority
CA
Canada
Prior art keywords
semiconductor laser
layer
production
laser elements
quantum well
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2028899A
Other languages
English (en)
Other versions
CA2028899C (fr
Inventor
Teturo Ijichi
Hiroshi Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1284535A external-priority patent/JPH03145787A/ja
Priority claimed from JP30733989A external-priority patent/JP2786276B2/ja
Priority claimed from JP2018449A external-priority patent/JPH03222488A/ja
Application filed by Individual filed Critical Individual
Publication of CA2028899A1 publication Critical patent/CA2028899A1/fr
Application granted granted Critical
Publication of CA2028899C publication Critical patent/CA2028899C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2054—Methods of obtaining the confinement
    • H01S5/2081—Methods of obtaining the confinement using special etching techniques
    • H01S5/209—Methods of obtaining the confinement using special etching techniques special etch stop layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/223—Buried stripe structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/223—Buried stripe structure
    • H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/3403—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers having a strained layer structure in which the strain performs a special function, e.g. general strain effects, strain versus polarisation
    • H01S5/3406—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers having a strained layer structure in which the strain performs a special function, e.g. general strain effects, strain versus polarisation including strain compensation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Semiconductor Lasers (AREA)
CA002028899A 1989-10-31 1990-10-30 Lasers a semiconducteur et methode de fabrication de ces lasers Expired - Fee Related CA2028899C (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP1-284535 1989-10-31
JP1284535A JPH03145787A (ja) 1989-10-31 1989-10-31 半導体レーザ素子
JP1-307339 1989-11-27
JP30733989A JP2786276B2 (ja) 1989-11-27 1989-11-27 半導体レーザ素子
JP2018449A JPH03222488A (ja) 1990-01-29 1990-01-29 半導体レーザ素子及びその製造方法
JP2-18449 1990-01-29

Publications (2)

Publication Number Publication Date
CA2028899A1 true CA2028899A1 (fr) 1991-05-01
CA2028899C CA2028899C (fr) 1997-03-04

Family

ID=27282211

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002028899A Expired - Fee Related CA2028899C (fr) 1989-10-31 1990-10-30 Lasers a semiconducteur et methode de fabrication de ces lasers

Country Status (6)

Country Link
US (1) US5155738A (fr)
EP (1) EP0426419B1 (fr)
KR (1) KR940005001B1 (fr)
CA (1) CA2028899C (fr)
DE (1) DE69031415T2 (fr)
ES (1) ES2109231T3 (fr)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69115555T2 (de) * 1990-05-07 1996-09-05 Toshiba Kawasaki Kk Halbleiterlaser
FR2666455A1 (fr) * 1990-08-31 1992-03-06 Thomson Csf Dispositif optoelectronique et application a la realisation d'un laser et d'un photodetecteur.
US5404027A (en) * 1991-05-15 1995-04-04 Minnesota Mining & Manufacturing Compay Buried ridge II-VI laser diode
CN1119358A (zh) * 1991-05-15 1996-03-27 明尼苏达州采矿制造公司 蓝-绿激光二极管
JP3129779B2 (ja) * 1991-08-30 2001-01-31 株式会社東芝 半導体レーザ装置
US5212704A (en) * 1991-11-27 1993-05-18 At&T Bell Laboratories Article comprising a strained layer quantum well laser
GB2263814B (en) * 1992-01-17 1996-01-10 Northern Telecom Ltd Semiconductor mixed crystal quantum well device manufacture
US5257276A (en) * 1992-04-03 1993-10-26 California Institute Of Technology Strained layer InP/InGaAs quantum well laser
US5283444A (en) * 1992-07-24 1994-02-01 United Technologies Corporation Increased well depth hact using a strained layer superlattice
JPH06125141A (ja) * 1992-08-25 1994-05-06 Olympus Optical Co Ltd 半導体量子井戸光学素子
JP2706411B2 (ja) * 1992-12-11 1998-01-28 古河電気工業株式会社 歪量子井戸半導体レーザ
WO1994015367A1 (fr) * 1992-12-21 1994-07-07 The Furukawa Electric Co., Ltd. Element photodetecteur monolithique a reseau cristallin deforme, comportant une structure de contact lateral
US5330932A (en) * 1992-12-31 1994-07-19 Texas Instruments Incorporated Method for fabricating GaInP/GaAs structures
JPH07263811A (ja) * 1994-03-25 1995-10-13 Hitachi Ltd 半導体レーザ装置
TW291585B (fr) * 1994-07-04 1996-11-21 Mitsubishi Chem Corp
US5456206A (en) * 1994-12-07 1995-10-10 Electronics And Telecommunications Research Institute Method for two-dimensional epitaxial growth of III-V compound semiconductors
US5756403A (en) * 1995-12-29 1998-05-26 Philips Electronics North America Method of preferentially etching a semiconductor substrate with respect to epitaxial layers
JP3428797B2 (ja) * 1996-02-08 2003-07-22 古河電気工業株式会社 半導体レーザ素子
JP3317335B2 (ja) * 1998-02-10 2002-08-26 富士写真フイルム株式会社 半導体レーザ装置
KR100964399B1 (ko) * 2003-03-08 2010-06-17 삼성전자주식회사 반도체 레이저 다이오드 및 이를 채용한 반도체 레이저다이오드 조립체
US20080009844A1 (en) * 2006-06-26 2008-01-10 Ingeborg Rolle Device for Laser Surgery
CN117374728A (zh) * 2023-12-05 2024-01-09 上海三菲半导体有限公司 一种分布反馈型半导体激光二极管及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0650723B2 (ja) * 1984-10-17 1994-06-29 日本電気株式会社 エピタキシヤル成長方法
JP2559373B2 (ja) * 1986-07-14 1996-12-04 株式会社日立製作所 半導体レーザ素子の製造方法
JPS63150986A (ja) * 1986-12-15 1988-06-23 Sharp Corp 半導体レ−ザ
JP2525788B2 (ja) * 1987-01-20 1996-08-21 株式会社東芝 半導体レ−ザ装置の製造方法
JPS63197391A (ja) * 1987-02-12 1988-08-16 Hitachi Ltd 半導体レ−ザ装置
FR2628575A1 (fr) * 1988-03-11 1989-09-15 Thomson Csf Laser de puissance a 0,808 micrometres de longueur d'onde pour pompage du laser yag
JPH0212885A (ja) * 1988-06-29 1990-01-17 Nec Corp 半導体レーザ及びその出射ビームの垂直放射角の制御方法
US5016252A (en) * 1988-09-29 1991-05-14 Sanyo Electric Co., Ltd. Semiconductor laser device
US4984242A (en) * 1989-09-18 1991-01-08 Spectra Diode Laboratories, Inc. GaAs/AlGaAs heterostructure laser containing indium

Also Published As

Publication number Publication date
CA2028899C (fr) 1997-03-04
KR910008899A (ko) 1991-05-31
ES2109231T3 (es) 1998-01-16
EP0426419A3 (en) 1991-11-13
KR940005001B1 (ko) 1994-06-09
EP0426419B1 (fr) 1997-09-10
DE69031415D1 (de) 1997-10-16
EP0426419A2 (fr) 1991-05-08
US5155738A (en) 1992-10-13
DE69031415T2 (de) 1998-04-02

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