CA2021682C - Porte-puce avec ecran contre les rayons alpha - Google Patents

Porte-puce avec ecran contre les rayons alpha

Info

Publication number
CA2021682C
CA2021682C CA 2021682 CA2021682A CA2021682C CA 2021682 C CA2021682 C CA 2021682C CA 2021682 CA2021682 CA 2021682 CA 2021682 A CA2021682 A CA 2021682A CA 2021682 C CA2021682 C CA 2021682C
Authority
CA
Canada
Prior art keywords
chip
carrier
carrier substrate
spacer
ray shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA 2021682
Other languages
English (en)
Other versions
CA2021682A1 (fr
Inventor
Yukio Yamaguchi
Mutsuo Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP18755289A external-priority patent/JPH0353549A/ja
Priority claimed from JP3208790A external-priority patent/JP2836166B2/ja
Priority claimed from JP2042933A external-priority patent/JP2570880B2/ja
Application filed by NEC Corp filed Critical NEC Corp
Publication of CA2021682A1 publication Critical patent/CA2021682A1/fr
Application granted granted Critical
Publication of CA2021682C publication Critical patent/CA2021682C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CA 2021682 1989-07-21 1990-07-20 Porte-puce avec ecran contre les rayons alpha Expired - Fee Related CA2021682C (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP18755289A JPH0353549A (ja) 1989-07-21 1989-07-21 チツプキヤリア型半導体装置
JP187552/1989 1989-07-21
JP3208790A JP2836166B2 (ja) 1990-02-13 1990-02-13 チツプキヤリア
JP32087/1990 1990-02-13
JP42933/1990 1990-02-22
JP2042933A JP2570880B2 (ja) 1990-02-22 1990-02-22 チップキャリア

Publications (2)

Publication Number Publication Date
CA2021682A1 CA2021682A1 (fr) 1991-01-22
CA2021682C true CA2021682C (fr) 1995-01-03

Family

ID=27287579

Family Applications (1)

Application Number Title Priority Date Filing Date
CA 2021682 Expired - Fee Related CA2021682C (fr) 1989-07-21 1990-07-20 Porte-puce avec ecran contre les rayons alpha

Country Status (2)

Country Link
CA (1) CA2021682C (fr)
FR (1) FR2650121B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114942493B (zh) * 2022-05-05 2024-01-30 武汉光迅科技股份有限公司 一种芯片组件、光器件及组装方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588356A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Semiconductor device
JPS55128851A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Semiconductor memory device
JPS6015152B2 (ja) * 1980-01-09 1985-04-17 株式会社日立製作所 樹脂封止半導体メモリ装置
JPS5931045A (ja) * 1982-04-16 1984-02-18 Mitsubishi Electric Corp 樹脂封止形半導体装置およびその製造方法
JPS59127843A (ja) * 1983-01-12 1984-07-23 Fujitsu Ltd 半導体装置の製造方法
US4709301A (en) * 1985-09-05 1987-11-24 Nec Corporation Package
JPH0638458B2 (ja) * 1985-09-12 1994-05-18 日本電気株式会社 チツプキヤリアとその製造方法
JPS6376444A (ja) * 1986-09-19 1988-04-06 Nec Corp チツプキヤリア
JPS6390843A (ja) * 1986-10-03 1988-04-21 Nec Corp 集積回路の実装構造
JPS63229726A (ja) * 1987-03-18 1988-09-26 Nec Corp 混成集積回路装置

Also Published As

Publication number Publication date
FR2650121B1 (fr) 1997-07-25
FR2650121A1 (fr) 1991-01-25
CA2021682A1 (fr) 1991-01-22

Similar Documents

Publication Publication Date Title
JP3717937B2 (ja) 多重半導体ダイを搭載したパッケージ
US5831836A (en) Power plane for semiconductor device
US4712129A (en) Integrated circuit device with textured bar cover
JP3061954B2 (ja) 半導体装置
US7211900B2 (en) Thin semiconductor package including stacked dies
US5394014A (en) Semiconductor device improved in light shielding property and light shielding package
US6400032B1 (en) Method and apparatus for packaging flip chip bare die on printed circuit boards
US5438216A (en) Light erasable multichip module
US4661837A (en) Resin-sealed radiation shield for a semiconductor device
US20060125093A1 (en) Multi-chip module having bonding wires and method of fabricating the same
US6072700A (en) Ball grid array package
EP0029858B1 (fr) Dispositif a semi-conducteur
US5264726A (en) Chip-carrier
JPS6148265B2 (fr)
KR100660882B1 (ko) 보드 온 칩 패키지 및 그 제조 방법
CA2021682C (fr) Porte-puce avec ecran contre les rayons alpha
JP3065753B2 (ja) 半導体集積回路ベアチップの樹脂封止方法、半導体装置
EP0045561A2 (fr) Dispositif semiconducteur comprenant des circuits à mémoire
JPH10284633A (ja) 半導体集積回路装置およびその製造方法
KR940006578B1 (ko) 반도체 패케이지 및 그 제조방법
JPS63250847A (ja) 半導体装置及びその製造方法
JPH1187410A (ja) 半導体装置
JP2680969B2 (ja) 半導体記憶装置
JP2836165B2 (ja) チツプキヤリア
KR100468024B1 (ko) Loc패키지

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed