CA1308002C - Process for chemically shaving and pickling copper rod - Google Patents
Process for chemically shaving and pickling copper rodInfo
- Publication number
- CA1308002C CA1308002C CA000557154A CA557154A CA1308002C CA 1308002 C CA1308002 C CA 1308002C CA 000557154 A CA000557154 A CA 000557154A CA 557154 A CA557154 A CA 557154A CA 1308002 C CA1308002 C CA 1308002C
- Authority
- CA
- Canada
- Prior art keywords
- hot
- copper rod
- rod
- rolled copper
- aqueous solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 129
- 239000010949 copper Substances 0.000 title claims abstract description 124
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 121
- 238000000034 method Methods 0.000 title claims abstract description 44
- 230000008569 process Effects 0.000 title claims abstract description 43
- 238000005554 pickling Methods 0.000 title abstract description 47
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 81
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 73
- 238000005096 rolling process Methods 0.000 claims abstract description 23
- 238000005266 casting Methods 0.000 claims abstract description 13
- 238000005098 hot rolling Methods 0.000 claims abstract description 7
- 230000001105 regulatory effect Effects 0.000 claims abstract 13
- 238000012360 testing method Methods 0.000 claims description 27
- 239000007864 aqueous solution Substances 0.000 claims description 26
- 239000002253 acid Substances 0.000 claims description 15
- 150000002978 peroxides Chemical class 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 230000035484 reaction time Effects 0.000 claims description 5
- 229960002163 hydrogen peroxide Drugs 0.000 claims 11
- 239000000126 substance Substances 0.000 abstract description 21
- 230000003750 conditioning effect Effects 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract description 5
- 239000000243 solution Substances 0.000 description 35
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 25
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 17
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 17
- 229940112669 cuprous oxide Drugs 0.000 description 17
- 238000006243 chemical reaction Methods 0.000 description 16
- 229960004643 cupric oxide Drugs 0.000 description 11
- 229910001868 water Inorganic materials 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- KIEOKOFEPABQKJ-UHFFFAOYSA-N sodium dichromate Chemical compound [Na+].[Na+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KIEOKOFEPABQKJ-UHFFFAOYSA-N 0.000 description 3
- 238000005491 wire drawing Methods 0.000 description 3
- 241000196324 Embryophyta Species 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 240000001987 Pyrus communis Species 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000002844 continuous effect Effects 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000344 soap Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011545 laboratory measurement Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 235000021110 pickles Nutrition 0.000 description 1
- 229920000136 polysorbate Polymers 0.000 description 1
- 238000000195 production control method Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- OIWCYIUQAVBPGV-DAQGAKHBSA-N {1-O-hexadecanoyl-2-O-[(Z)-octadec-9-enoyl]-sn-glycero-3-phospho}serine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP(O)(=O)OC[C@H](N)C(O)=O)OC(=O)CCCCCCC\C=C/CCCCCCCC OIWCYIUQAVBPGV-DAQGAKHBSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
- Y10T29/49988—Metal casting
- Y10T29/49989—Followed by cutting or removing material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
- Y10T29/49988—Metal casting
- Y10T29/49991—Combined with rolling
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- ing And Chemical Polishing (AREA)
- Metal Rolling (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/009,775 US4754803A (en) | 1987-02-02 | 1987-02-02 | Manufacturing copper rod by casting, hot rolling and chemically shaving and pickling |
| US09,775 | 1987-02-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1308002C true CA1308002C (en) | 1992-09-29 |
Family
ID=21739637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000557154A Expired - Lifetime CA1308002C (en) | 1987-02-02 | 1988-01-22 | Process for chemically shaving and pickling copper rod |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4754803A (OSRAM) |
| EP (1) | EP0277781B1 (OSRAM) |
| JP (1) | JP2695423B2 (OSRAM) |
| AT (1) | ATE76664T1 (OSRAM) |
| CA (1) | CA1308002C (OSRAM) |
| DE (1) | DE3871401D1 (OSRAM) |
| ES (1) | ES2032957T3 (OSRAM) |
| GR (1) | GR3004745T3 (OSRAM) |
| MX (1) | MX165729B (OSRAM) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4899798A (en) * | 1988-11-28 | 1990-02-13 | Southwire Company | Method of and apparatus for recovering and reusing organic pickling vapors |
| US5106454A (en) * | 1990-11-01 | 1992-04-21 | Shipley Company Inc. | Process for multilayer printed circuit board manufacture |
| DE4136085C2 (de) * | 1991-10-30 | 1993-11-04 | Mannesmann Ag | Verfahren zum herstellen von sauerstoffreiem kupferdraht |
| US5904157A (en) * | 1996-04-05 | 1999-05-18 | Phelps Dodge Industries, Inc. | Copper surface pickling system |
| US6197210B1 (en) * | 1998-08-17 | 2001-03-06 | Gerber Plumbing Fixtures Corp. | Process for treating brass components to substantially eliminate leachabale lead |
| DE60136977D1 (de) * | 2000-02-24 | 2009-01-22 | Mitsubishi Materials Corp | Verfahren zur kontinuierlichen Herstellung von Kupferdraht mit niedrigem Sauerstoffgehalt |
| DE10023480A1 (de) * | 2000-05-10 | 2001-11-15 | Sms Demag Ag | Verfahren zum Säubern oxidierter, warmgewalzter Kupferstäbe |
| ATE309397T1 (de) | 2001-04-09 | 2005-11-15 | Ak Steel Properties Inc | Wasserstoffperoxid-beizen von siliciumhaltigen elektrostrahlqualitäten |
| US6645306B2 (en) | 2001-04-09 | 2003-11-11 | Ak Steel Corporation | Hydrogen peroxide pickling scheme for stainless steel grades |
| WO2002081380A1 (en) * | 2001-04-09 | 2002-10-17 | Ak Properties, Inc. | Apparatus and method for removing hydrogen peroxide from spent pickle liquor |
| US6803354B2 (en) | 2002-08-05 | 2004-10-12 | Henkel Kormanditgesellschaft Auf Aktien | Stabilization of hydrogen peroxide in acidic baths for cleaning metals |
| US20090145856A1 (en) * | 2007-12-11 | 2009-06-11 | Raymond Letize A | Acid recycle process with iron removal |
| RU2604162C2 (ru) * | 2014-02-19 | 2016-12-10 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Юго-Западный государственный университет" (ЮЗГУ) | Способ очистки поверхностей меди и ее сплавов от продуктов коррозии и окисления соединениями меди (ii) |
| US11428482B2 (en) | 2016-04-12 | 2022-08-30 | Angara Global Ltd. | Industrial cleaning systems, including solutions for removing various types of deposits, and cognitive cleaning |
| RU2639433C2 (ru) * | 2016-04-12 | 2017-12-21 | Общество с ограниченной ответственностью "АНГАРА ДЕВЕЛОПМЕНТ", ООО "АНГАРА ДЕВЕЛОПМЕНТ" | Раствор для удаления отложений различной природы |
| CN112720147A (zh) * | 2020-12-24 | 2021-04-30 | 无锡市红年金属制品科技有限公司 | 一种提高铜排表面处理效果的方法 |
| CN113235100A (zh) * | 2021-03-11 | 2021-08-10 | 中国科学院近代物理研究所 | 一种无氧铜钎焊前的表面处理方法 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2428804A (en) * | 1945-09-07 | 1947-10-14 | Esther M Terry | Copper cleaning composition |
| US2678876A (en) * | 1950-12-26 | 1954-05-18 | Rca Corp | Conditioning of metal surfaces |
| US2965521A (en) * | 1954-06-10 | 1960-12-20 | Crucible Steel Co America | Metal pickling solutions and methods |
| US2856275A (en) * | 1956-11-20 | 1958-10-14 | Amchem Prod | Chemical treatment of refractory metal surfaces |
| BE652530A (OSRAM) * | 1963-09-02 | |||
| DE1255443B (de) * | 1964-08-22 | 1967-11-30 | Degussa | Verfahren zum chemischen AEtzen von gedruckten Schaltungen |
| NL154561B (nl) * | 1965-04-27 | 1977-09-15 | Lancy Lab | Werkwijze voor het verwijderen van koper(i)oxyde en koper(ii)oxyde van een voorwerp met een oppervlak van koper of een koperlegering, werkwijze voor het bereiden van een hiervoor toe te passen beitsvloeistof en de door toepassing van deze beitswerkwijze verkregen voorwerpen. |
| GB1119969A (en) * | 1965-04-27 | 1968-07-17 | Lancy Lab | Metal cleaning |
| GB1157038A (en) * | 1967-09-19 | 1969-07-02 | Lancy Lab | Pickling Solutions for Removing Copper Oxides from Copper Containing Workpieces |
| US3623532A (en) * | 1969-03-20 | 1971-11-30 | Southwire Co | Continuous pickling of cast rod |
| BE757200A (fr) * | 1969-10-07 | 1971-03-16 | Westinghouse Electric Corp | Procede perfectionne pour produire du fil machine de cuivre |
| SE388444B (sv) * | 1972-10-30 | 1976-10-04 | Southwire Co | Forfarande for kontinuerlig behandling av gjuten kopparstang med ett oxidskikt pa sin yta samt apparat for genomforande av forfarandet |
| JPS526853B2 (OSRAM) * | 1972-12-22 | 1977-02-25 | ||
| US3903244A (en) * | 1973-02-02 | 1975-09-02 | Fmc Corp | Stabilized hydrogen peroxide |
| JPS5243195Y2 (OSRAM) * | 1973-09-22 | 1977-09-30 | ||
| SE400575B (sv) * | 1974-12-13 | 1978-04-03 | Nordnero Ab | Bad for betning av koppar och dess legeringar |
| SE400581B (sv) * | 1974-12-13 | 1978-04-03 | Nordnero Ab | Bad for kemisk polering av koppar och dess legeringar |
| JPS5286933A (en) * | 1976-01-14 | 1977-07-20 | Tokai Electro Chemical Co | Method of treating surface of copper and copper alloy |
| US4220706A (en) * | 1978-05-10 | 1980-09-02 | Rca Corporation | Etchant solution containing HF-HnO3 -H2 SO4 -H2 O2 |
| US4175011A (en) * | 1978-07-17 | 1979-11-20 | Allied Chemical Corporation | Sulfate-free method of etching copper pattern on printed circuit boards |
| DE2847267C2 (de) * | 1978-10-31 | 1993-12-23 | Decker Gmbh & Co Kg Geb | Stabilisator für eine wäßrige Lösung zum Beizen und/oder chemischen Glänzen von Gegenständen aus Kupfer oder Kupferlegierungen in einem mehrstufigen Verfahren und Verwendung des Stabilisators |
| US4236957A (en) * | 1979-06-25 | 1980-12-02 | Dart Industries Inc. | Dissolution of metals utilizing an aqueous H2 SOY --H2 O.sub. -mercapto containing heterocyclic nitrogen etchant |
| US4443268A (en) * | 1981-11-12 | 1984-04-17 | The Dow Chemical Company | Process for removing copper and copper oxide encrustations from ferrous surfaces |
| JPS58197277A (ja) * | 1982-05-08 | 1983-11-16 | Mitsubishi Gas Chem Co Inc | 金属の化学的溶解処理液 |
| US4401509A (en) * | 1982-09-07 | 1983-08-30 | Fmc Corporation | Composition and process for printed circuit etching using a sulfuric acid solution containing hydrogen peroxide |
| FR2539140A1 (fr) * | 1983-01-07 | 1984-07-13 | Ugine Kuhlmann | Stabilisation de solutions aqueuses contenant du peroxyde d'hydrogene, de l'acide fluorhydrique et des ions metalliques |
| JPS6061028U (ja) * | 1983-09-30 | 1985-04-27 | 松下電工株式会社 | エア−マツト |
| US4510018A (en) * | 1984-02-21 | 1985-04-09 | The Lea Manufacturing Company | Solution and process for treating copper and copper alloys |
-
1987
- 1987-02-02 US US07/009,775 patent/US4754803A/en not_active Expired - Lifetime
-
1988
- 1988-01-22 CA CA000557154A patent/CA1308002C/en not_active Expired - Lifetime
- 1988-01-29 AT AT88300778T patent/ATE76664T1/de not_active IP Right Cessation
- 1988-01-29 DE DE8888300778T patent/DE3871401D1/de not_active Expired - Lifetime
- 1988-01-29 EP EP88300778A patent/EP0277781B1/en not_active Expired - Lifetime
- 1988-01-29 ES ES198888300778T patent/ES2032957T3/es not_active Expired - Lifetime
- 1988-02-01 JP JP63019718A patent/JP2695423B2/ja not_active Expired - Lifetime
- 1988-02-01 MX MX010266A patent/MX165729B/es unknown
-
1992
- 1992-05-28 GR GR920401000T patent/GR3004745T3/el unknown
Also Published As
| Publication number | Publication date |
|---|---|
| MX165729B (es) | 1992-12-02 |
| US4754803A (en) | 1988-07-05 |
| DE3871401D1 (de) | 1992-07-02 |
| EP0277781A1 (en) | 1988-08-10 |
| JPS63213685A (ja) | 1988-09-06 |
| GR3004745T3 (OSRAM) | 1993-04-28 |
| JP2695423B2 (ja) | 1997-12-24 |
| EP0277781B1 (en) | 1992-05-27 |
| ATE76664T1 (de) | 1992-06-15 |
| ES2032957T3 (es) | 1993-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |