CA1244966A - Schottky-gate field effect transistor with trapezoidal gate - Google Patents
Schottky-gate field effect transistor with trapezoidal gateInfo
- Publication number
- CA1244966A CA1244966A CA000505246A CA505246A CA1244966A CA 1244966 A CA1244966 A CA 1244966A CA 000505246 A CA000505246 A CA 000505246A CA 505246 A CA505246 A CA 505246A CA 1244966 A CA1244966 A CA 1244966A
- Authority
- CA
- Canada
- Prior art keywords
- schottky
- substrate
- gate
- electrode
- gate electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/061—Manufacture or treatment of FETs having Schottky gates
- H10D30/0612—Manufacture or treatment of FETs having Schottky gates of lateral single-gate Schottky FETs
- H10D30/0616—Manufacture or treatment of FETs having Schottky gates of lateral single-gate Schottky FETs using processes wherein the final gate is made before the completion of the source and drain regions, e.g. gate-first processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
- H01L21/28587—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds characterised by the sectional shape, e.g. T, inverted T
-
- H10D64/0125—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60063096A JPS61220376A (ja) | 1985-03-26 | 1985-03-26 | ショットキゲート電界効果トランジスタの製造方法 |
| JP63096/1985 | 1985-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1244966A true CA1244966A (en) | 1988-11-15 |
Family
ID=13219425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000505246A Expired CA1244966A (en) | 1985-03-26 | 1986-03-26 | Schottky-gate field effect transistor with trapezoidal gate |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4774200A (Direct) |
| EP (1) | EP0196087A3 (Direct) |
| JP (1) | JPS61220376A (Direct) |
| CA (1) | CA1244966A (Direct) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2613134B1 (fr) * | 1987-03-24 | 1990-03-09 | Labo Electronique Physique | Dispositif semiconducteur du type transistor a effet de champ |
| US4808545A (en) * | 1987-04-20 | 1989-02-28 | International Business Machines Corporation | High speed GaAs MESFET having refractory contacts and a self-aligned cold gate fabrication process |
| JPH022142A (ja) * | 1988-06-13 | 1990-01-08 | Mitsubishi Electric Corp | 電界効果トランジスタ及びその製造方法 |
| JP2562840B2 (ja) * | 1988-08-01 | 1996-12-11 | 富士通株式会社 | 電界効果トランジスタ |
| US4963501A (en) * | 1989-09-25 | 1990-10-16 | Rockwell International Corporation | Method of fabricating semiconductor devices with sub-micron linewidths |
| US5206531A (en) * | 1990-03-19 | 1993-04-27 | Lockheed Sanders, Inc. | Semiconductor device having a control gate with reduced semiconductor contact |
| US5011785A (en) * | 1990-10-30 | 1991-04-30 | The United States Of America As Represented By The Secretary Of The Navy | Insulator assisted self-aligned gate junction |
| US5907177A (en) * | 1995-03-14 | 1999-05-25 | Matsushita Electric Industrial Co.,Ltd. | Semiconductor device having a tapered gate electrode |
| US5652179A (en) * | 1996-04-24 | 1997-07-29 | Watkins-Johnson Company | Method of fabricating sub-micron gate electrode by angle and direct evaporation |
| CN103137449B (zh) * | 2011-12-01 | 2016-04-20 | 中芯国际集成电路制造(上海)有限公司 | 栅极的制作方法、晶体管的制作方法 |
| US8629559B2 (en) | 2012-02-09 | 2014-01-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Stress reduction apparatus with an inverted cup-shaped layer |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4171234A (en) * | 1976-07-20 | 1979-10-16 | Matsushita Electric Industrial Co., Ltd. | Method of fabricating three-dimensional epitaxial layers utilizing molecular beams of varied angles |
| JPS588151B2 (ja) * | 1976-09-30 | 1983-02-14 | 松下電器産業株式会社 | 接合型電界効果トランジスタの製造方法 |
| US4099305A (en) * | 1977-03-14 | 1978-07-11 | Bell Telephone Laboratories, Incorporated | Fabrication of mesa devices by MBE growth over channeled substrates |
| JPS5667974A (en) * | 1979-10-26 | 1981-06-08 | Ibm | Method of manufacturing semiconductor device |
| US4379005A (en) * | 1979-10-26 | 1983-04-05 | International Business Machines Corporation | Semiconductor device fabrication |
| US4309267A (en) * | 1980-07-21 | 1982-01-05 | Bell Telephone Laboratories, Incorporated | Reactive sputter etching apparatus |
| JPS5773975A (en) * | 1980-10-27 | 1982-05-08 | Toshiba Corp | Mis type field effect transistor and manufacture thereof |
| US4325181A (en) * | 1980-12-17 | 1982-04-20 | The United States Of America As Represented By The Secretary Of The Navy | Simplified fabrication method for high-performance FET |
| JPS57128071A (en) * | 1981-01-30 | 1982-08-09 | Fujitsu Ltd | Field-effect type semiconductor device and manufacture thereof |
| JPS57180184A (en) * | 1981-04-30 | 1982-11-06 | Fujitsu Ltd | Manufacturing method for fet |
| IT1171402B (it) * | 1981-07-20 | 1987-06-10 | Selenia Ind Eletroniche Associ | Transistor ad effeto di campo a barriera metallo-semiconduttorre conzona svuotata modificata |
| US4404732A (en) * | 1981-12-07 | 1983-09-20 | Ibm Corporation | Self-aligned extended epitaxy mesfet fabrication process |
| JPS58178567A (ja) * | 1982-04-14 | 1983-10-19 | Toshiba Corp | 半導体装置およびその製造方法 |
| US4640003A (en) * | 1985-09-30 | 1987-02-03 | The United States Of America As Represented By The Secretary Of The Navy | Method of making planar geometry Schottky diode using oblique evaporation and normal incidence proton bombardment |
-
1985
- 1985-03-26 JP JP60063096A patent/JPS61220376A/ja active Granted
-
1986
- 1986-03-26 EP EP86104159A patent/EP0196087A3/en not_active Ceased
- 1986-03-26 US US06/844,477 patent/US4774200A/en not_active Expired - Fee Related
- 1986-03-26 CA CA000505246A patent/CA1244966A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| EP0196087A2 (en) | 1986-10-01 |
| US4774200A (en) | 1988-09-27 |
| JPS61220376A (ja) | 1986-09-30 |
| EP0196087A3 (en) | 1986-12-17 |
| JPH0329301B2 (Direct) | 1991-04-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |