CA1222574A - Method and apparatus for manufacturing multi layer printed circuit boards - Google Patents

Method and apparatus for manufacturing multi layer printed circuit boards

Info

Publication number
CA1222574A
CA1222574A CA000422703A CA422703A CA1222574A CA 1222574 A CA1222574 A CA 1222574A CA 000422703 A CA000422703 A CA 000422703A CA 422703 A CA422703 A CA 422703A CA 1222574 A CA1222574 A CA 1222574A
Authority
CA
Canada
Prior art keywords
conductive
layer
raised
conductive material
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000422703A
Other languages
English (en)
French (fr)
Inventor
Peter P. Pelligrino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ecolab Inc
Original Assignee
Economics Laboratory Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Economics Laboratory Inc filed Critical Economics Laboratory Inc
Priority to CA000516574A priority Critical patent/CA1234923A/en
Application granted granted Critical
Publication of CA1222574A publication Critical patent/CA1222574A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Burglar Alarm Systems (AREA)
CA000422703A 1982-03-04 1983-03-02 Method and apparatus for manufacturing multi layer printed circuit boards Expired CA1222574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA000516574A CA1234923A (en) 1982-03-04 1986-08-21 Method for manufacturing multi-layered printed circuit boards and a circuit board produced by same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35473682A 1982-03-04 1982-03-04
US354,736 1982-03-04

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CA000516574A Division CA1234923A (en) 1982-03-04 1986-08-21 Method for manufacturing multi-layered printed circuit boards and a circuit board produced by same

Publications (1)

Publication Number Publication Date
CA1222574A true CA1222574A (en) 1987-06-02

Family

ID=23394704

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000422703A Expired CA1222574A (en) 1982-03-04 1983-03-02 Method and apparatus for manufacturing multi layer printed circuit boards

Country Status (8)

Country Link
EP (1) EP0103627A4 (it)
JP (1) JPS59500341A (it)
CA (1) CA1222574A (it)
DK (1) DK502783A (it)
IN (1) IN158376B (it)
IT (1) IT1163136B (it)
NO (1) NO834009L (it)
WO (1) WO1983003065A1 (it)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60258996A (ja) * 1984-03-09 1985-12-20 アール．ダブリュ．キュー．インコ． 多層プリント配線板の積層方法および装置
US4734315A (en) * 1985-06-05 1988-03-29 Joyce Florence Space-Bate Low power circuitry components
US4927477A (en) * 1985-08-26 1990-05-22 International Business Machines Corporation Method for making a flush surface laminate for a multilayer circuit board
GB2212333A (en) * 1987-11-11 1989-07-19 Gen Electric Co Plc Method of fabricating multi-layer circuits
US4875966A (en) * 1988-09-12 1989-10-24 General Dynamics Corp., Pomona Div. Pressure transfer plate assembly for a heat bonding apparatus
JPH03196691A (ja) * 1989-12-26 1991-08-28 Cmk Corp プリント配線板の絶縁層の形成方法
EP3197251B1 (en) * 2014-07-18 2023-10-18 Mitsubishi Gas Chemical Company, Inc. Laminate and substrate for mounting a semiconductor device, and methods for producing the same
EP3007526A1 (en) * 2014-10-08 2016-04-13 T-Kingdom Co., Ltd. Manufacturing method and structure of circuit board with very fine conductive circuit lines
US10332832B2 (en) 2017-08-07 2019-06-25 General Electric Company Method of manufacturing an electronics package using device-last or device-almost last placement
US11664240B2 (en) 2017-11-16 2023-05-30 Mitsubishi Gas Chemical Company, Inc. Method for producing laminate having patterned metal foil, and laminate having patterned metal foil
JP7153242B2 (ja) 2017-12-14 2022-10-14 三菱瓦斯化学株式会社 絶縁性樹脂層付き銅箔
JP7164839B2 (ja) 2018-08-30 2022-11-02 三菱瓦斯化学株式会社 積層体、金属箔張積層板、パターニングされた金属箔付き積層体、ビルドアップ構造を有する積層体、プリント配線板、多層コアレス基板、及びその製造方法
JP7479596B2 (ja) 2019-03-29 2024-05-09 三菱瓦斯化学株式会社 絶縁性樹脂層付き銅箔、並びに、これを用いた積層体及び積層体の製造方法
CN113891797A (zh) 2019-05-31 2022-01-04 三菱瓦斯化学株式会社 带绝缘性树脂层的基材、以及使用其的层叠体和层叠体的制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3219749A (en) * 1961-04-21 1965-11-23 Litton Systems Inc Multilayer printed circuit board with solder access apertures
GB964349A (en) * 1961-08-31 1964-07-22 Rogers Corp Improvements in printed circuit and method of making the same
US3350250A (en) * 1962-03-21 1967-10-31 North American Aviation Inc Method of making printed wire circuitry
US3324014A (en) * 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
GB1259837A (en) * 1968-11-18 1972-01-12 Boeing Co Composite structure and method of making the same
US3627902A (en) * 1970-02-02 1971-12-14 Control Data Corp Interconnections for multilayer printed circuit boards
US3972755A (en) * 1972-12-14 1976-08-03 The United States Of America As Represented By The Secretary Of The Navy Dielectric circuit board bonding
US4159222A (en) * 1977-01-11 1979-06-26 Pactel Corporation Method of manufacturing high density fine line printed circuitry
US4354895A (en) * 1981-11-27 1982-10-19 International Business Machines Corporation Method for making laminated multilayer circuit boards

Also Published As

Publication number Publication date
EP0103627A4 (en) 1985-09-18
IT8319877A1 (it) 1984-09-03
DK502783D0 (da) 1983-11-03
WO1983003065A1 (en) 1983-09-15
JPS59500341A (ja) 1984-03-01
IT1163136B (it) 1987-04-08
IT8319877A0 (it) 1983-03-03
EP0103627A1 (en) 1984-03-28
IN158376B (it) 1986-11-01
NO834009L (no) 1983-11-03
DK502783A (da) 1983-11-03

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Legal Events

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