CA1222574A - Method and apparatus for manufacturing multi layer printed circuit boards - Google Patents
Method and apparatus for manufacturing multi layer printed circuit boardsInfo
- Publication number
- CA1222574A CA1222574A CA000422703A CA422703A CA1222574A CA 1222574 A CA1222574 A CA 1222574A CA 000422703 A CA000422703 A CA 000422703A CA 422703 A CA422703 A CA 422703A CA 1222574 A CA1222574 A CA 1222574A
- Authority
- CA
- Canada
- Prior art keywords
- conductive
- layer
- raised
- conductive material
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Burglar Alarm Systems (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA000516574A CA1234923A (en) | 1982-03-04 | 1986-08-21 | Method for manufacturing multi-layered printed circuit boards and a circuit board produced by same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US35473682A | 1982-03-04 | 1982-03-04 | |
US354,736 | 1982-03-04 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA000516574A Division CA1234923A (en) | 1982-03-04 | 1986-08-21 | Method for manufacturing multi-layered printed circuit boards and a circuit board produced by same |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1222574A true CA1222574A (en) | 1987-06-02 |
Family
ID=23394704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA000422703A Expired CA1222574A (en) | 1982-03-04 | 1983-03-02 | Method and apparatus for manufacturing multi layer printed circuit boards |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0103627A4 (it) |
JP (1) | JPS59500341A (it) |
CA (1) | CA1222574A (it) |
DK (1) | DK502783A (it) |
IN (1) | IN158376B (it) |
IT (1) | IT1163136B (it) |
NO (1) | NO834009L (it) |
WO (1) | WO1983003065A1 (it) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60258996A (ja) * | 1984-03-09 | 1985-12-20 | アール.ダブリュ.キュー.インコ. | 多層プリント配線板の積層方法および装置 |
US4734315A (en) * | 1985-06-05 | 1988-03-29 | Joyce Florence Space-Bate | Low power circuitry components |
US4927477A (en) * | 1985-08-26 | 1990-05-22 | International Business Machines Corporation | Method for making a flush surface laminate for a multilayer circuit board |
GB2212333A (en) * | 1987-11-11 | 1989-07-19 | Gen Electric Co Plc | Method of fabricating multi-layer circuits |
US4875966A (en) * | 1988-09-12 | 1989-10-24 | General Dynamics Corp., Pomona Div. | Pressure transfer plate assembly for a heat bonding apparatus |
JPH03196691A (ja) * | 1989-12-26 | 1991-08-28 | Cmk Corp | プリント配線板の絶縁層の形成方法 |
EP3197251B1 (en) * | 2014-07-18 | 2023-10-18 | Mitsubishi Gas Chemical Company, Inc. | Laminate and substrate for mounting a semiconductor device, and methods for producing the same |
EP3007526A1 (en) * | 2014-10-08 | 2016-04-13 | T-Kingdom Co., Ltd. | Manufacturing method and structure of circuit board with very fine conductive circuit lines |
US10332832B2 (en) | 2017-08-07 | 2019-06-25 | General Electric Company | Method of manufacturing an electronics package using device-last or device-almost last placement |
US11664240B2 (en) | 2017-11-16 | 2023-05-30 | Mitsubishi Gas Chemical Company, Inc. | Method for producing laminate having patterned metal foil, and laminate having patterned metal foil |
JP7153242B2 (ja) | 2017-12-14 | 2022-10-14 | 三菱瓦斯化学株式会社 | 絶縁性樹脂層付き銅箔 |
JP7164839B2 (ja) | 2018-08-30 | 2022-11-02 | 三菱瓦斯化学株式会社 | 積層体、金属箔張積層板、パターニングされた金属箔付き積層体、ビルドアップ構造を有する積層体、プリント配線板、多層コアレス基板、及びその製造方法 |
JP7479596B2 (ja) | 2019-03-29 | 2024-05-09 | 三菱瓦斯化学株式会社 | 絶縁性樹脂層付き銅箔、並びに、これを用いた積層体及び積層体の製造方法 |
CN113891797A (zh) | 2019-05-31 | 2022-01-04 | 三菱瓦斯化学株式会社 | 带绝缘性树脂层的基材、以及使用其的层叠体和层叠体的制造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3219749A (en) * | 1961-04-21 | 1965-11-23 | Litton Systems Inc | Multilayer printed circuit board with solder access apertures |
GB964349A (en) * | 1961-08-31 | 1964-07-22 | Rogers Corp | Improvements in printed circuit and method of making the same |
US3350250A (en) * | 1962-03-21 | 1967-10-31 | North American Aviation Inc | Method of making printed wire circuitry |
US3324014A (en) * | 1962-12-03 | 1967-06-06 | United Carr Inc | Method for making flush metallic patterns |
GB1259837A (en) * | 1968-11-18 | 1972-01-12 | Boeing Co | Composite structure and method of making the same |
US3627902A (en) * | 1970-02-02 | 1971-12-14 | Control Data Corp | Interconnections for multilayer printed circuit boards |
US3972755A (en) * | 1972-12-14 | 1976-08-03 | The United States Of America As Represented By The Secretary Of The Navy | Dielectric circuit board bonding |
US4159222A (en) * | 1977-01-11 | 1979-06-26 | Pactel Corporation | Method of manufacturing high density fine line printed circuitry |
US4354895A (en) * | 1981-11-27 | 1982-10-19 | International Business Machines Corporation | Method for making laminated multilayer circuit boards |
-
1983
- 1983-03-02 CA CA000422703A patent/CA1222574A/en not_active Expired
- 1983-03-03 IT IT19877/83A patent/IT1163136B/it active
- 1983-03-04 JP JP58501241A patent/JPS59500341A/ja active Pending
- 1983-03-04 IN IN272/CAL/83A patent/IN158376B/en unknown
- 1983-03-04 WO PCT/US1983/000292 patent/WO1983003065A1/en not_active Application Discontinuation
- 1983-03-04 EP EP19830901286 patent/EP0103627A4/en not_active Ceased
- 1983-11-03 NO NO834009A patent/NO834009L/no unknown
- 1983-11-03 DK DK502783A patent/DK502783A/da not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP0103627A4 (en) | 1985-09-18 |
IT8319877A1 (it) | 1984-09-03 |
DK502783D0 (da) | 1983-11-03 |
WO1983003065A1 (en) | 1983-09-15 |
JPS59500341A (ja) | 1984-03-01 |
IT1163136B (it) | 1987-04-08 |
IT8319877A0 (it) | 1983-03-03 |
EP0103627A1 (en) | 1984-03-28 |
IN158376B (it) | 1986-11-01 |
NO834009L (no) | 1983-11-03 |
DK502783A (da) | 1983-11-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MKEX | Expiry |