CA1175884A - Light emitting diode assembly - Google Patents
Light emitting diode assemblyInfo
- Publication number
- CA1175884A CA1175884A CA000376421A CA376421A CA1175884A CA 1175884 A CA1175884 A CA 1175884A CA 000376421 A CA000376421 A CA 000376421A CA 376421 A CA376421 A CA 376421A CA 1175884 A CA1175884 A CA 1175884A
- Authority
- CA
- Canada
- Prior art keywords
- led
- monoliths
- assembly
- sites
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
- H04N1/032—Details of scanning heads ; Means for illuminating the original for picture information reproduction
- H04N1/036—Details of scanning heads ; Means for illuminating the original for picture information reproduction for optical reproduction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Toxicology (AREA)
- Optics & Photonics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Led Devices (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Dot-Matrix Printers And Others (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
LIGHT EMITTING DIODE ASSEMBLY
The Abstract of Disclosure This invention relates to apparatus for electronically recording using a xerographic machine and, more particularly, to an assembly of monoliths containing light emitting diodes (LED's) that yields a relatively long array of LED's with high light density and a contiguous set of light centers. A fiber optic cover is placed over the exposed surfaces of the LED's to counter the effects of the divergent angle of light emitting from the LED's and to protect the LED's from damage. A gel having a relatively high refractive index is applied between the LED's and the fiber optic cover to further counter the effects of the divergent angle of light.
The Abstract of Disclosure This invention relates to apparatus for electronically recording using a xerographic machine and, more particularly, to an assembly of monoliths containing light emitting diodes (LED's) that yields a relatively long array of LED's with high light density and a contiguous set of light centers. A fiber optic cover is placed over the exposed surfaces of the LED's to counter the effects of the divergent angle of light emitting from the LED's and to protect the LED's from damage. A gel having a relatively high refractive index is applied between the LED's and the fiber optic cover to further counter the effects of the divergent angle of light.
Description
1.175~8fl LIGHT EMITTING DIODE ASSEMBLY
Background of the Invention I,ight emitting diodes (LED's~ have a multiplicity of uses, among which is the application o light in the printing industry. For example, LED's may be used in combination with xerographic copiers, photographic film, and the like for the purpose of recording an image of a message that is tra~smitted electronically. The use of LED's for this purpose has certain drawbac~s. Primarily, high density light is required in such printing applications in order to obtain good contrast and high resolution, but the light output of individual LED's i9 not high. Consequently, a large number of LED's must be placed in a small area to provide the required high li~ht density. This has proven di~ficult to achieve because oE the size constraints imposed by ti1e crystalline structure involved.
More specifically, ~ major drawback to the use of LED's is that the length of the monoliths from which LED's are made is limited. This is because the LED's are formed upon monoliths that are of monocrystalline form. Because of the methods required to form the monocrystalline material, a limitation is plàced upon the size of monoliths which can be made. Present techniques of manufacturing can achieve a monocrystalline boule three inches in diameter, thus limiting the length of a monolith to appro~imately three inches in length. The most commonly commercially used crystalline boules for LED fabrication are only somewhat larger than one inch in diameter, thus limiting the length even more greatly.
Many techniques have been used in an attempt to overcome these shortcomings, but to date none has proven completely satisfactory.
~ .
. . . ~
8 8 '1 ~ nother problem associated with the use of LED's in the printing industry is their fragile nature, particularly the electrical connections for such LED`s. In order to assure that the amount of ligilt emitted to the receiving surface is high, the LED's are placed as close to the s~rface as possible.
This increases the possibility of damage to the LED's because of their movement relative to the receiving surface.
Summary of the Invention The invention relates to an assembly having a plurality of light emitting diodes, comprisinc3: a plurality of generally longitudinally extending monoliths, means for att~ehlng the monoliths in tandem, each of the monoliths having longltudl~-llly opposed ends that form an angle of other than 90~ relative to the longitudinal side o~ the monolith, the mo~oliths having -two rows of laterally opposed LED sites extending longitudinally thereon, electrical connection means for providing selective enabling of the LED si-tes, the LED sites of one row being laterally staggered relative to the LED sites of the other row, such that the assembled monoliths define a contiguous set of centers of LED sites.
Thus, it has been found that an LED assembly having a high light density may be obtained by forming the LED's within a monolith in rows in such a manner that the individual LED's of one row are laterally staggered reiative to the LED's in the other row. In addition, the monoliths from which the assembly is made have their ends cut at an angle and are assembled together so that the units can be joined to form a required length while achieving one contiguous set of centers.
,s~, ~ mg/ ~ ~ - 2 -8 ~
In a.ldition, a fiber optic cover may be placed over the exposed surface of the LED's so as to transmit l:ight columnarly from the LEn to the light receiving surface and to protect the LED's from bein~ damaged by inadvertent contact with the light receiving surface. A gel with a rela-tively high refractive index is applied between the LED's ~nd the fiber optic cover to counter the efects of the divergent angle of light emitting from the LED's.
Brief Description of the Drawings Fig. 1 shows portions of a pair of acljacent mono:Liths that incorporate features oE the present :Lnvention.
- rng/~ 2a -. ~
~ ~ 7 r) ~ 8 ~
Fig. 2 shows a partial, cross-sectional view of an LED assembly that incorporates features of the present ~~
invention, the assembly shown addressing a receiving surface.
Fig. 3 shows a portion of circuitry involved in enabling the LED's of the assembly shown in Fig. 1.
Detailed Description of the Invention ~ eferring now to Figs. t and 2, an assembly of mono-liths having LED`s found thereon is shown generally at 10 spaced relative to a surface 12 such as a photoconductive belt or drum made of zinc oxide, selenium, cadmium sulfide and the like. The assembly 10 includes a substrate 14 made o~ a dielectric material such as aluminum oxid~ (Al2O3) with a con~uctive material 15 applied to portions of the surface thercof. ~ plurality oE n-type monoliths 16 are attached to the conductive material 15 by an adhesive 17 such as silver epoxy. The monoliths 16 are made of a material such as gallium arsenide and have a number of doped locations to create p-type sites 18 which in combination with the monolith define light emitting diode (LED's). The doping is accomplished in such a fashion that the p-type sites of LED's 18 are located along two rows, each of which is adjacent the longitudinal edge of a monolith 16. The LED sites 18 of one row are laterally staggered relative to the LED's of the opposite row, as seen in Fig. 1. Although the LED sites are shown as being circular, it will be appreciated that non-circular sites, such as elliptical, may be fashioned for occasions when non-square resolution is required. According to the instant invention, a one inch length would have eight monoliths 1 with thirty-two LED sites situated on each monolith. The , monoliths 16 are joined together at their ends to form the required assembly lO length. For example, if an eight inch assembly is required, sixty-four monoliths would be assembled end to end in tande~ fashion to provide 2048 LED sites 18.
A metallic coating 20 is deposited upon the monolith 16 at the location of each of the LED sites 18, an open portion being formed in each coating to allow exposure of the LED's.
A lead 22 provides electrical connection between the conductive material 15 and the metallic coatings 20 so as to allow the supplying of power to each LRD. The leads 22 may be either soldered or epoxy bonded to the conductive material 15 and metallic coatings 20. A fiber optic cover 24 is placed over the length oE the monoliths 16 intermediate the monoliths and the photoconductive surface t2. The fiber optic cover 24 has lS relief portions 25 that extend the length of the cover and are located above the }ocations where the leads 22 are connected to the metallic coatinqs 20. The fiber optic cover 24 may be made of either glass or methylmethacrylate A gel 28 having a reEractive index greater than one is applied between the LED's 18 and the fiber optic cover 24. Preferably, the gel is polydimethyl siloxane which has a refractive index of 1.465.
The assemblies 10 are made up of a plurality of monoliths 16 each having a diagonal cut at both of its ends 26 thereof.
The diaqonal ends 26 form an angle relative to the longitudinal sides of the monoliths 14, the preferred angle being about 60 degrees.
The advantage of the construction as demonstrated in Fig. 1 is that a high light density is obtained by having the .
., ,, .. , ~, . .. . ~ . -- , .
~ 1~S~8.~
LED's 18 of one row being placed in staggered relationship with the LED's of the adjacent row. More specifically, the two rows of LED's 18 extend longitudinally with the LED's of one row being laterally staggered relative to the LED's of the other row. The staggered arrangement gives the appearance to the surface 12 of a single contiguous line of light. The staggered array of LED's is maintained at the ends 26 oE the monolith 16 so that a contiguous set oE centers is obtained.
More specifically, after a crystal boule is drawn, it has a cylindrical shape. It is then cut into a number of thin waffers having the shape of thin discs. Next, the sites 18 are doped to produce the p-type junction and the metal coating 20 is deposited about the I,ED's as shown in Fig. 1. The discs are then cut into monoliths with a saw that typically results in a three thousanc7s oE an inch cut. With the diaqnol cut, none of the sites l8 is, damaged and the monolith 16 may be assembled to give the appearance Oe one continuous assembly having a uniform distribution oE LÆD's along its entire length.
Although only two rows of LED's 18 are shown, it will be appreciated that a larger number Oe rows may be included.
Another way of obtaining the diagonal cut is to cut the monoliths through laser scoring. By driving a laser with a stepper motor controlled by a micro processor, a plurality of steps would be formed that would match a plurality of steps on an adjacent monolith. The monoliths would then be assembled as described previously.
The advantage achieved in using the fiber optic - cover 24 at the Eace oE the LED's 18 is that columner light is transmitted to the surface 12. A light source such as an LED
1 1~ r~ 3 ,~,~
tends to Eorm a divergent light cone as a result of the light passing through air. By using the fiber optic cover 24 and a gel 28 whose refractive inde~ is greater than that of air, it has been found that the light gathering properties are enhanc~d and the aforementioned loss of light is reduced. Furthermore, the fiber optic cover ~4 provides a degree of protertion to the LED`s which are rather fragile, especially at the bond connection ~ith the leads 220 This is particularly critical since the LED`s must be placed close to the receiving surface 12 in order to enhance resolution.
Referring to Fig. 3, a portion of the circuit used to control input to the LED`s 18 on a selective basis i5 shown. A
set of anode rails or bus bars 30 are shown with the inclividual ~o~
leads or tapes 22 providing connection between the bus bars and the LEU's 18, there being a bus bar for each LF.D in a monolith. A s~t of ca~hode rails or bus bars 32 is also provided, each bus bar 32 being connected in paralled to all the LED's 18 of a given monolith 16. Appropriate controls may be utilized to selectively enable the LED sites 18, but such controls do not form part of the instant invention and will not be described.
..
Background of the Invention I,ight emitting diodes (LED's~ have a multiplicity of uses, among which is the application o light in the printing industry. For example, LED's may be used in combination with xerographic copiers, photographic film, and the like for the purpose of recording an image of a message that is tra~smitted electronically. The use of LED's for this purpose has certain drawbac~s. Primarily, high density light is required in such printing applications in order to obtain good contrast and high resolution, but the light output of individual LED's i9 not high. Consequently, a large number of LED's must be placed in a small area to provide the required high li~ht density. This has proven di~ficult to achieve because oE the size constraints imposed by ti1e crystalline structure involved.
More specifically, ~ major drawback to the use of LED's is that the length of the monoliths from which LED's are made is limited. This is because the LED's are formed upon monoliths that are of monocrystalline form. Because of the methods required to form the monocrystalline material, a limitation is plàced upon the size of monoliths which can be made. Present techniques of manufacturing can achieve a monocrystalline boule three inches in diameter, thus limiting the length of a monolith to appro~imately three inches in length. The most commonly commercially used crystalline boules for LED fabrication are only somewhat larger than one inch in diameter, thus limiting the length even more greatly.
Many techniques have been used in an attempt to overcome these shortcomings, but to date none has proven completely satisfactory.
~ .
. . . ~
8 8 '1 ~ nother problem associated with the use of LED's in the printing industry is their fragile nature, particularly the electrical connections for such LED`s. In order to assure that the amount of ligilt emitted to the receiving surface is high, the LED's are placed as close to the s~rface as possible.
This increases the possibility of damage to the LED's because of their movement relative to the receiving surface.
Summary of the Invention The invention relates to an assembly having a plurality of light emitting diodes, comprisinc3: a plurality of generally longitudinally extending monoliths, means for att~ehlng the monoliths in tandem, each of the monoliths having longltudl~-llly opposed ends that form an angle of other than 90~ relative to the longitudinal side o~ the monolith, the mo~oliths having -two rows of laterally opposed LED sites extending longitudinally thereon, electrical connection means for providing selective enabling of the LED si-tes, the LED sites of one row being laterally staggered relative to the LED sites of the other row, such that the assembled monoliths define a contiguous set of centers of LED sites.
Thus, it has been found that an LED assembly having a high light density may be obtained by forming the LED's within a monolith in rows in such a manner that the individual LED's of one row are laterally staggered reiative to the LED's in the other row. In addition, the monoliths from which the assembly is made have their ends cut at an angle and are assembled together so that the units can be joined to form a required length while achieving one contiguous set of centers.
,s~, ~ mg/ ~ ~ - 2 -8 ~
In a.ldition, a fiber optic cover may be placed over the exposed surface of the LED's so as to transmit l:ight columnarly from the LEn to the light receiving surface and to protect the LED's from bein~ damaged by inadvertent contact with the light receiving surface. A gel with a rela-tively high refractive index is applied between the LED's ~nd the fiber optic cover to counter the efects of the divergent angle of light emitting from the LED's.
Brief Description of the Drawings Fig. 1 shows portions of a pair of acljacent mono:Liths that incorporate features oE the present :Lnvention.
- rng/~ 2a -. ~
~ ~ 7 r) ~ 8 ~
Fig. 2 shows a partial, cross-sectional view of an LED assembly that incorporates features of the present ~~
invention, the assembly shown addressing a receiving surface.
Fig. 3 shows a portion of circuitry involved in enabling the LED's of the assembly shown in Fig. 1.
Detailed Description of the Invention ~ eferring now to Figs. t and 2, an assembly of mono-liths having LED`s found thereon is shown generally at 10 spaced relative to a surface 12 such as a photoconductive belt or drum made of zinc oxide, selenium, cadmium sulfide and the like. The assembly 10 includes a substrate 14 made o~ a dielectric material such as aluminum oxid~ (Al2O3) with a con~uctive material 15 applied to portions of the surface thercof. ~ plurality oE n-type monoliths 16 are attached to the conductive material 15 by an adhesive 17 such as silver epoxy. The monoliths 16 are made of a material such as gallium arsenide and have a number of doped locations to create p-type sites 18 which in combination with the monolith define light emitting diode (LED's). The doping is accomplished in such a fashion that the p-type sites of LED's 18 are located along two rows, each of which is adjacent the longitudinal edge of a monolith 16. The LED sites 18 of one row are laterally staggered relative to the LED's of the opposite row, as seen in Fig. 1. Although the LED sites are shown as being circular, it will be appreciated that non-circular sites, such as elliptical, may be fashioned for occasions when non-square resolution is required. According to the instant invention, a one inch length would have eight monoliths 1 with thirty-two LED sites situated on each monolith. The , monoliths 16 are joined together at their ends to form the required assembly lO length. For example, if an eight inch assembly is required, sixty-four monoliths would be assembled end to end in tande~ fashion to provide 2048 LED sites 18.
A metallic coating 20 is deposited upon the monolith 16 at the location of each of the LED sites 18, an open portion being formed in each coating to allow exposure of the LED's.
A lead 22 provides electrical connection between the conductive material 15 and the metallic coatings 20 so as to allow the supplying of power to each LRD. The leads 22 may be either soldered or epoxy bonded to the conductive material 15 and metallic coatings 20. A fiber optic cover 24 is placed over the length oE the monoliths 16 intermediate the monoliths and the photoconductive surface t2. The fiber optic cover 24 has lS relief portions 25 that extend the length of the cover and are located above the }ocations where the leads 22 are connected to the metallic coatinqs 20. The fiber optic cover 24 may be made of either glass or methylmethacrylate A gel 28 having a reEractive index greater than one is applied between the LED's 18 and the fiber optic cover 24. Preferably, the gel is polydimethyl siloxane which has a refractive index of 1.465.
The assemblies 10 are made up of a plurality of monoliths 16 each having a diagonal cut at both of its ends 26 thereof.
The diaqonal ends 26 form an angle relative to the longitudinal sides of the monoliths 14, the preferred angle being about 60 degrees.
The advantage of the construction as demonstrated in Fig. 1 is that a high light density is obtained by having the .
., ,, .. , ~, . .. . ~ . -- , .
~ 1~S~8.~
LED's 18 of one row being placed in staggered relationship with the LED's of the adjacent row. More specifically, the two rows of LED's 18 extend longitudinally with the LED's of one row being laterally staggered relative to the LED's of the other row. The staggered arrangement gives the appearance to the surface 12 of a single contiguous line of light. The staggered array of LED's is maintained at the ends 26 oE the monolith 16 so that a contiguous set oE centers is obtained.
More specifically, after a crystal boule is drawn, it has a cylindrical shape. It is then cut into a number of thin waffers having the shape of thin discs. Next, the sites 18 are doped to produce the p-type junction and the metal coating 20 is deposited about the I,ED's as shown in Fig. 1. The discs are then cut into monoliths with a saw that typically results in a three thousanc7s oE an inch cut. With the diaqnol cut, none of the sites l8 is, damaged and the monolith 16 may be assembled to give the appearance Oe one continuous assembly having a uniform distribution oE LÆD's along its entire length.
Although only two rows of LED's 18 are shown, it will be appreciated that a larger number Oe rows may be included.
Another way of obtaining the diagonal cut is to cut the monoliths through laser scoring. By driving a laser with a stepper motor controlled by a micro processor, a plurality of steps would be formed that would match a plurality of steps on an adjacent monolith. The monoliths would then be assembled as described previously.
The advantage achieved in using the fiber optic - cover 24 at the Eace oE the LED's 18 is that columner light is transmitted to the surface 12. A light source such as an LED
1 1~ r~ 3 ,~,~
tends to Eorm a divergent light cone as a result of the light passing through air. By using the fiber optic cover 24 and a gel 28 whose refractive inde~ is greater than that of air, it has been found that the light gathering properties are enhanc~d and the aforementioned loss of light is reduced. Furthermore, the fiber optic cover ~4 provides a degree of protertion to the LED`s which are rather fragile, especially at the bond connection ~ith the leads 220 This is particularly critical since the LED`s must be placed close to the receiving surface 12 in order to enhance resolution.
Referring to Fig. 3, a portion of the circuit used to control input to the LED`s 18 on a selective basis i5 shown. A
set of anode rails or bus bars 30 are shown with the inclividual ~o~
leads or tapes 22 providing connection between the bus bars and the LEU's 18, there being a bus bar for each LF.D in a monolith. A s~t of ca~hode rails or bus bars 32 is also provided, each bus bar 32 being connected in paralled to all the LED's 18 of a given monolith 16. Appropriate controls may be utilized to selectively enable the LED sites 18, but such controls do not form part of the instant invention and will not be described.
..
Claims (4)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. An assembly having a plurality of light emitting diodes, comprising: a plurality of generally longitudinally extending monoliths, means for attaching said monoliths in tandem, each of said monoliths having longitudinally opposed ends that form an angle of other than 90° relative to the longitudinal side of said monolith, said monoliths having two rows of laterally opposed LED sites extending longitudinally thereon, electrical connection means for providing selective enabling of said LED sites, the LED sites of one row being laterally staggered relative to the LED sites of the other row, such that said assembled monoliths define a contiguous set of centers of LED sites.
2. The assembly of claim 1 wherein said assembly of monoliths has a fiber optic cover spaced relative to said LED sites.
3. The assembly of claim 2 wherein a gel having a refractive index greater than one is applied between said LED
sites and said optic cover.
sites and said optic cover.
4. The assembly of claim 1 wherein said angle is approximately 60°.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16296880A | 1980-06-25 | 1980-06-25 | |
| US162,968 | 1980-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1175884A true CA1175884A (en) | 1984-10-09 |
Family
ID=22587886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000376421A Expired CA1175884A (en) | 1980-06-25 | 1981-04-28 | Light emitting diode assembly |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5728379A (en) |
| CA (1) | CA1175884A (en) |
| DE (1) | DE3117923A1 (en) |
| FR (1) | FR2485813B1 (en) |
| GB (1) | GB2079049B (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS575083A (en) * | 1980-06-13 | 1982-01-11 | Tokyo Shibaura Electric Co | Display unit |
| DE3276289D1 (en) * | 1982-02-19 | 1987-06-11 | Agfa Gevaert Nv | Recording apparatus |
| JPS58203071A (en) * | 1982-05-21 | 1983-11-26 | Mitsubishi Electric Corp | Light emitting diode array |
| DE3223031A1 (en) * | 1982-06-19 | 1983-12-22 | Olympia Werke Ag, 2940 Wilhelmshaven | PRINTER WITH AN OPTICAL PRINT HEAD FOR LINEAR RECORDING OF GRAPHICS AND TEXT INFORMATION |
| US5184114A (en) * | 1982-11-04 | 1993-02-02 | Integrated Systems Engineering, Inc. | Solid state color display system and light emitting diode pixels therefor |
| EP0115088B1 (en) * | 1983-01-21 | 1986-12-30 | Agfa-Gevaert N.V. | Recording apparatus |
| US4566170A (en) * | 1983-05-10 | 1986-01-28 | Pitney Bowes Inc. | Method of producing a light emiting diode array |
| JPS6027565A (en) * | 1983-07-25 | 1985-02-12 | Mitsubishi Electric Corp | Luminous diode array head and manufacture thereof |
| JPS60166166U (en) * | 1984-04-12 | 1985-11-05 | 沖電気工業株式会社 | Light emitting element array head |
| JPH0638516B2 (en) * | 1984-06-26 | 1994-05-18 | 沖電気工業株式会社 | Light emitting element array |
| JPS61269456A (en) * | 1985-05-17 | 1986-11-28 | Alps Electric Co Ltd | Arrangement structure of optical element |
| JPS6357262A (en) * | 1986-08-29 | 1988-03-11 | Fuji Xerox Co Ltd | Optical writing apparatus |
| JPH05330135A (en) * | 1992-05-29 | 1993-12-14 | Toshiba Corp | Image forming device |
| JP5075789B2 (en) * | 2008-10-20 | 2012-11-21 | 株式会社アルバック | Light irradiation device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1924209A1 (en) * | 1969-05-12 | 1971-01-14 | Beneking Dr Rer Nat Heinz | Electro-optical display |
| US3900864A (en) * | 1973-05-17 | 1975-08-19 | Bell Telephone Labor Inc | Monolithic led displays |
| US3877052A (en) * | 1973-12-26 | 1975-04-08 | Bell Telephone Labor Inc | Light-emitting semiconductor apparatus for optical fibers |
| DE2414778A1 (en) * | 1974-03-27 | 1975-10-02 | Siemens Ag | Monolithic luminescent diodes with p- and n- conducting strips - have light output zones on surface, minimising loss by absorption |
| JPS5117685A (en) * | 1974-08-05 | 1976-02-12 | Mitsubishi Electric Corp | |
| JPS5845191B2 (en) * | 1976-12-08 | 1983-10-07 | 浜松ホトニクス株式会社 | photo diode array |
| JPS5563269A (en) * | 1978-11-07 | 1980-05-13 | Matsushita Electric Ind Co Ltd | Recording head |
-
1981
- 1981-04-28 CA CA000376421A patent/CA1175884A/en not_active Expired
- 1981-05-06 DE DE19813117923 patent/DE3117923A1/en active Granted
- 1981-05-28 JP JP8179681A patent/JPS5728379A/en active Granted
- 1981-06-24 GB GB8119412A patent/GB2079049B/en not_active Expired
- 1981-06-25 FR FR8112471A patent/FR2485813B1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE3117923C2 (en) | 1988-07-28 |
| GB2079049B (en) | 1985-02-06 |
| FR2485813A1 (en) | 1981-12-31 |
| JPS5728379A (en) | 1982-02-16 |
| JPH0137862B2 (en) | 1989-08-09 |
| FR2485813B1 (en) | 1985-11-15 |
| DE3117923A1 (en) | 1982-04-29 |
| GB2079049A (en) | 1982-01-13 |
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