JP5075789B2 - Light irradiation device - Google Patents

Description

  The present invention relates to a light irradiation apparatus.

  In a liquid crystal display panel, an element substrate on which thin film transistors are arranged and formed in a matrix and an opposite substrate on which a light shielding film, a color filter, and the like are formed are arranged to face each other at an extremely narrow interval. When the two substrates are overlaid, the liquid crystal is sealed in a region between the two substrates and surrounded by a sealing material containing a photocurable resin. Subsequently, the liquid crystal display panel is manufactured by irradiating the sealing material with ultraviolet rays, curing the sealing material, and bonding the two substrates together.

  At this time, there is a light irradiation device as a device for ultraviolet curing the sealing material and bonding the two substrates together. As this type of light irradiation apparatus, for example, an arc discharge type metal highland lamp or the like is used as a light source, and the entire surface of a substrate to be bonded is irradiated with ultraviolet rays (for example, Patent Document 1).

  However, since the light irradiation apparatus irradiates the entire surface of the substrate using an arc discharge type metal highland lamp, there is a problem that power consumption is large and manufacturing cost increases. In addition, since the pattern of the sealing material formed on the substrate differs depending on the type of the substrate, a shading mask for irradiating only the sealing material with ultraviolet rays must be prepared accordingly, which increases the number of parts and costs. However, there was a problem of increasing further.

In order to solve these problems, a light irradiation device using an ultraviolet light emitting diode has been proposed. In this light irradiation device, a plurality of ultraviolet light emitting diodes are arranged at a predetermined pitch in one direction. An optical system such as a hemispherical lens or a cylindrical lens is disposed on the light emitting side of each ultraviolet light emitting diode. Thereby, the light emitted from each ultraviolet light emitting diode is irradiated to the linear sealing material as a linear light beam through the optical system such as the hemispherical lens and the cylindrical lens.
JP 2006-66585 A

  By the way, it is desirable that the linear light beam emitted by the light emission of the ultraviolet light emitting diode has a uniform illuminance in the irradiation region. For this purpose, it is preferable that the illuminance of light emitted from each ultraviolet light emitting diode is the same in all ultraviolet light emitting diodes.

  Therefore, before shipping the light irradiation device, an ultraviolet light emitting diode having the characteristic of emitting the same illuminance under the same applied voltage is selected, and the illuminance is uniform in all irradiation regions with the ultraviolet light emitting diode having the same characteristic. A linear light beam was formed.

  However, when the ultraviolet light emitting diode continues to emit light by applying a constant voltage, its illuminance decreases as the lighting time elapses. The degree of decrease in illuminance differs for each ultraviolet light emitting diode.

  Therefore, each ultraviolet light emitting diode that originally emitted light having substantially the same illuminance emits light with different illuminance over time. As a result, the illuminance of the line-shaped light beam irradiated on the line-shaped sealing material is not uniform in the entire irradiation region, and becomes non-uniform and cannot be used.

  Therefore, a new module in which a plurality of ultraviolet light emitting diodes are arranged at a predetermined pitch is replaced. However, the replacement is frequently performed, which is a problem. In addition, since a part of each ultraviolet light emitting diode is reduced in illuminance, it is replaced with a new module, and many normal ultraviolet light emitting diodes are wasted and discarded.

  The present invention has been made in order to solve the above-described problems, and has as its object to uniformly distribute the light emitted from each light emitting element over a long period of time without wasting all light emitting elements. It is intended to provide a light irradiation device that can maintain a long life and extend the life.

  The invention according to claim 1 is a light irradiation for irradiating light emitted from a plurality of optical elements arranged in one direction onto a linear sealing material made of a photocurable resin interposed between bonded substrates. A device, provided for each of the plurality of optical elements, for supplying a power supply voltage to the corresponding optical element, a plurality of bus bars to which different power supply voltages are applied, and the lead wires, Connection means for connecting to each bus bar so as to be electrically connected to and separated from each other is provided.

  According to the first aspect of the present invention, since the lead wire provided for each light emitting element is connected to a plurality of bus bars having different power supply voltages in accordance with a decrease in illuminance of the light emitting element, the plurality of light emitting elements The illuminance can be individually changed.

  Therefore, even if the illuminance of each of the light emitting elements decreases individually, the illuminance of the optical element can be individually adjusted, and the illuminance of linear ultraviolet rays irradiated on the linear sealing material interposed on the substrate It can be made uniform in the irradiation region. As a result, the lifetime of the light irradiation device can be extended without wasting all the optical elements.

According to a second aspect of the present invention, in the light irradiation device according to the first aspect, the connection means is provided for each of the plurality of lead wires.
According to the second aspect of the present invention, each lead wire provided for each of the plurality of optical elements is connected to the bus bar through the corresponding connecting means so as to be electrically connected and separated.

  According to a third aspect of the present invention, in the light irradiation device according to the first or second aspect, the plurality of optical elements are ultraviolet light-emitting diodes, and the plurality of ultraviolet light-emitting diodes are unidirectional with respect to the circuit board. The plurality of circuit boards are arranged in the one direction, and the ultraviolet light emitting diodes mounted on the circuit boards are arranged in a straight line in the one direction. .

According to the third aspect of the present invention, the ultraviolet rays emitted from the respective ultraviolet light emitting diodes become ultraviolet rays extending linearly in one direction.
According to a fourth aspect of the present invention, in the light irradiation device according to the third aspect, the circuit board is externally connected to the anode terminal of each of the plurality of ultraviolet light emitting diodes mounted. A fixing connector having a connection terminal is mounted, and the fixing connector includes a mounting connector having an external connection terminal electrically connected to a lead wire provided for each of the plurality of ultraviolet light-emitting diodes. Removably connected.

  According to the invention described in claim 4, the fixing connector that is electrically connected to the anode terminal of each ultraviolet light emitting diode is mounted on the circuit board, and the ultraviolet light emitting diode is fixed to the fixing connector. Since the mounting connectors that connect the corresponding lead wires are detachably connected, when performing an illuminance inspection using an inspection device, remove the mounting connector from the fixing connector and inspect the inspection device. The illuminance measurement test can be performed with a simple operation by simply mounting the inspection mounting connector to which the lead wire for applying the operating voltage is connected.

  According to a fifth aspect of the present invention, in the light irradiation device according to the third or fourth aspect, a hemispherical lens is disposed on an ultraviolet light emitting side of the plurality of ultraviolet light emitting diodes mounted on the circuit board. A cylindrical lens that is shared with other hemispherical lenses is disposed on the ultraviolet emission side of the lens.

  According to the fifth aspect of the present invention, the ultraviolet rays emitted from the respective ultraviolet light emitting diodes extend linearly in one direction and are irradiated to the linear sealing material.

  According to the present invention, it is possible to maintain a uniform irradiation distribution of light emitted from each light emitting element over a long period of time without wasting all the light emitting elements, thereby extending the life.

Hereinafter, an embodiment in which the light irradiation apparatus of the present invention is embodied in an ultraviolet irradiation apparatus provided in a substrate bonding apparatus will be described with reference to the drawings.
In FIG. 1, a substrate laminating apparatus 1 includes an ultraviolet irradiation device 2 and is provided in a production line (not shown) for producing an active matrix type liquid crystal display in which liquid crystal is sealed between two types of substrates. The substrate laminating apparatus 1 includes an ultraviolet ray on a sealing material S made of an ultraviolet curable resin interposed between bonded substrates constituting a liquid crystal panel (hereinafter referred to as a lower substrate W1 and an upper substrate W2) in a manufacturing process of a liquid crystal display. It is used for the step of curing the sealing material S by irradiating ultraviolet rays from the irradiation device 2.

  As shown in FIG.1 and FIG.2, as for the board | substrate bonding apparatus 1, the square box-shaped housing | casing 3 is installed in the floor surface, and the square-shaped opening part 4 is penetrated and formed in the upper surface 3a of the housing 3. As shown in FIG. . A stage moving device 5 is disposed in the housing 3.

  The stage moving device 5 has a base 6 fixed to the bottom plate 3 b of the housing 3, and a lifting device 7 is installed on the base 6. The elevating device 7 has a plurality of elevating rods 7a, and a square plate-like support plate 8 is placed and fixed on the upper end surface of each elevating rod 7a. The elevating device 7 has a main body 7b with a built-in elevating motor and a ball screw that rotates forward and backward with the motor. The elevating rod 7a (support plate 8) is moved up and down (Z direction) by rotating the elevating motor forward and backward. It is supposed to be moved to.

  A plurality of main columns 9a are arranged at equal intervals on the outer periphery of the upper surface of the support plate 8, and a square frame plate-shaped holding stage ST1 is placed and fixed on the upper end surface of each main column 9a. . On the holding stage ST1, a lower substrate W1 and a lower substrate W2 to be bonded are placed. The holding stage ST1 has an alignment through hole 10 formed inside the frame. An alignment camera CA is provided on the lower surface of the holding stage ST1, and the alignment camera CA images the alignment marks of the lower substrate W1 and the upper substrate W2 placed on the holding stage ST1 through the alignment through hole 10. It has become.

  A plurality of sub columns 9b are arranged at equal intervals in the X and Y directions inside the main columns 9a arranged along the outer periphery of the upper surface of the support plate 8. Then, for each row of sub-columns 9b arranged in the Y direction, a plate-like levitation stage ST2 extending in the Y direction is placed and fixed on the upper end surface of the sub-column 9b. The upper surface of the levitation stage ST2 is flush with the upper surface of the holding stage ST1 mounted and fixed on the main column 9a.

  Accordingly, the rectangular frame plate-shaped holding stage ST1 places and supports the lower substrate W1 and the upper substrate W2 in cooperation with the floating stages ST2 arranged on the inside thereof. Each levitation stage ST2 is formed with a plurality of suction holes (not shown), and the suction holes are connected to a vacuum pump through a pipe formed in the sub-support 9b. Therefore, by setting the suction hole to a negative pressure, the lower substrate W1 and the upper substrate W2 placed are sucked and fixed to the floating stage ST2.

  The lower substrate W1 and the upper substrate W2 placed and fixed on the holding stage ST1 and the floating stage ST2 are opened in the housing 3 by the support plate 8 moving up and down by the stage moving device 5 provided in the housing 3. The part 4 is arranged so that it can appear and disappear.

  A substrate moving device 11 is installed and fixed at the center of the upper surface of the support plate 8. The substrate moving device 11 is provided with an alignment member 12 having a disk-like table TB on the top. The substrate moving device 11 moves the alignment member 12 (table TB) relative to the substrate moving device 11 in the Z direction, the left-right direction (X direction) in FIG. 2, and the Y direction orthogonal to the Z direction and the X direction. It is mounted as possible. In addition, the substrate moving device 11 rotates the alignment member 12 (table TB) with the central axis L of the alignment member 12 as the rotation center axis.

  When the substrate moving device 11 moves the alignment member 12 upward in the Z direction, the substrates W1 and W2 placed on the holding stage ST1 and the floating stage ST2 are lifted upward to hold the substrates W1 and W2. It is slightly separated from the stage ST1 and the floating stage ST2. Further, when the substrate moving device 11 moves the alignment member 12 in the X direction and the Y direction in the separated state, the substrate W1 and W2 are moved in the X direction and the Y direction while being placed on the table TB. be able to. Further, when the substrate moving device 11 rotates the alignment member 12 in the separated state, the substrate moving device 11 can rotate the substrates W1 and W2 placed on the table TB with the central axis L of the alignment member 12 as the rotation center axis. it can.

  The substrate moving device 11 includes an X-axis motor that moves the alignment member 12 in the X direction, a Y-axis motor that moves the alignment member 12 in the Y direction, a Z-axis motor that moves the alignment member 12 in the Z direction, and the alignment member 12. And a rotation motor that rotates the central axis L as a rotation center axis. These motors are driven and controlled by a control circuit (not shown).

  The table TB of the alignment member 12 is formed with a plurality of suction holes (not shown), and the suction holes are connected to a vacuum pump via piping formed in the alignment member 12. Therefore, by placing the suction hole at a negative pressure, the placed substrates W1 and W2 are sucked and fixed to the table TB of the alignment member 12.

  Therefore, in a state where the substrates W1 and W2 are attracted to the table TB of the alignment member 12, the alignment camera CA performs alignment based on the image data of the alignment marks printed on the substrates W1 and W2 imaged through the alignment through holes 10. The substrates W1 and W2 can be placed at predetermined positions by moving or rotating the member 12 in the X direction or the Y direction.

  A gate-type gantry 15 is fixed to the upper surface 3a of the housing 3 so as to straddle the opening 4 in the X direction. The gantry 15 includes a pair of leg portions 15a fixed to the upper surface 3a and a connecting frame 15b connected to both the leg portions 15a. A guide rail 16 extending in the X direction is attached to one side surface of the connecting frame 15b.

  The guide rail 16 is provided with a plurality of X-axis linear motors 17 that move along the guide rail 16. Each X-axis linear motor 17 is provided with a base 18, and each base 18 is provided with an ultraviolet irradiation device 2 via an attachment member 19. Each ultraviolet irradiation device 2 provided on the attachment member 19 is formed to extend along the Y direction, and reciprocates in the X direction as the X-axis linear motor 17 moves.

  That is, each ultraviolet irradiation device 2 is reciprocated in the X direction between the upper positions of the substrates W1 and W2 that are placed and fixed on the holding stage ST1 and the floating stage ST2 and discharged from the opening 4 of the housing 3, and a predetermined upper position ( It stops at a position facing the sealing material S formed between the substrates W1 and W2. Each ultraviolet irradiation device 2 irradiates ultraviolet rays toward the lower substrates W1 and W2 (sealing material S) from the stopped position to cure the sealing material S.

Next, the ultraviolet irradiation device 2 will be described with reference to FIGS.
As shown in FIGS. 3 and 4, the ultraviolet irradiation device 2 has a rectangular support plate 21 connected and fixed to the lower end of the mounting member 19 with a bolt, and the lower surfaces of both side portions of the support plate 21 in the X direction. A pair of side plates 22a and 22b are fixed to the frame. The pair of side plates 22a and 22b are plates that are long in the Y direction, and are arranged at equal intervals.

  The interval holding member 23 is connected between the upper portions of the pair of side plates 22a and 22b with a predetermined interval in the Y direction. The insulating plate 24 is connected between the pair of side plates 22a and 22b with a predetermined interval in the Y direction. In each insulating plate 24, four first to fourth bus bars B1 to B4 that are long in the Y direction are inserted and supported and fixed.

  As shown in FIG. 5, the four first to fourth bus bars B <b> 1 to B <b> 4 are copper bars, and are disposed between the pair of side plates 22 a and 22 b along the Y direction. The first bus bar B1 is applied with a low power supply voltage V1 from an external power supply circuit (not shown). The second bus bar B2 is applied with an intermediate power supply voltage V2 (> V1) from an external power supply circuit (not shown). The third bus bar B3 is applied with a high power supply voltage V3 (> V2) from an external power supply circuit (not shown). The fourth bus bar B4 is grounded to the ground voltage (0 volt).

  Further, as shown in FIG. 4, a connecting plate 25 extending in the Y direction is connected between the lower ends of the pair of side plates 22a and 22b. A plurality (40 in this embodiment) of irradiation modules 30 in which a plurality (eight in this embodiment) of ultraviolet light-emitting diodes D are arranged in a row on the lower surface of the connecting plate 25 are arranged along the Y direction. The array is fixed in one row.

  The irradiation module 30 has a circuit board 31, and as shown in FIG. 6, eight light emitting diodes D as optical elements are mounted on the circuit board 31 in a line along the Y direction. When the circuit board 31 is fixed to the lower surface of the connecting plate 25 with the bolts 32, the mounted ultraviolet light emitting diodes D are positioned on the lower side, and the eight ultraviolet light emitting diodes D are arranged along the Y direction. To be fixed. Moreover, the adjacent irradiation modules 30 are positioned and fixed so that the eight ultraviolet light-emitting diodes D mounted on the circuit board 31 are arranged in a straight line along the Y direction at equal intervals.

Therefore, in the present embodiment, 320 ultraviolet light emitting diodes D are arranged in a straight line along the Y direction at equal intervals.
A first fixed connector CNa1 and a second fixed connector CNa2 are mounted on the circuit board 31 of the irradiation module 30.

  The first fixed connector CNa1 is a male connector and has a number of contact terminals as external connection terminals corresponding to the eight ultraviolet light-emitting diodes D mounted on the circuit board 31, and each contact terminal corresponds to the first fixed connector CNa1. Each is electrically connected to the anode terminal of the ultraviolet light emitting diode D. The first fixed connector CNa1 is detachably connected to the first mounting connector CNb1. The first attachment connector CNb1 is a female connector, and has the number of contact terminals of the first fixed connector CNa1 (the number corresponding to the eight ultraviolet light-emitting diodes D mounted on the circuit board 31) as external connection terminals. Each contact terminal is electrically connected to a plus-side lead line La provided corresponding to each ultraviolet light-emitting diode D. Each plus lead wire La is inserted through a through hole 25a formed in the connecting plate 25, and each tip thereof is electrically connected to any one of the first to third bus bars B1 to B3. It is like that.

  The first to third bus bars B1 to B3 are respectively provided with connection screws 33 as connection means for connecting the tip portions of the plus-side lead wires La so as to be able to contact and separate. And the front-end | tip part of 1st-3rd bus bar B1-B3 and each plus side lead wire La is connected so that contact / separation is possible via the connection screw 33. FIG.

  Specifically, the connection screw 33 advances in a direction in which the screw portion 33a is screwed by screwing the screw portion 33a into the first to third bus bars B1 to B3 and turning the head portion 33b in the clockwise direction. By turning the head 33b in the counterclockwise direction, the screw portion 33a advances in the disengagement direction.

  Accordingly, by winding the tip of the plus lead wire La around the screw portion 33a and turning the head portion 33b in the clockwise direction, the tip portion of the plus lead wire La is connected to the head portion 33b of the connection screw 33 and the first to first portions. It is sandwiched between 3 bus bars B1 to B3. As a result, the plus side lead wire La is electrically connected to the first to third bus bars B1 to B3. On the contrary, when the plus lead wire La is electrically connected to the first to third bus bars B1 to B3, the head 33b is turned counterclockwise to turn the tip of the plus lead wire La. The part is released from the head 33b of the connection screw 33 and the first to third bus bars B1 to B3, and the tip of the plus lead wire La can be easily removed from the screw part 33a.

  On the other hand, the second fixed connector CNa2 is a male connector and has a number of contact terminals corresponding to the eight ultraviolet light-emitting diodes D mounted on the circuit board 31, and each contact terminal corresponds to a corresponding ultraviolet light-emitting diode. The cathode terminals of D are electrically connected to each other. The second fixed connector CNa2 is a female connector and is detachably connected to the second mounting connector CNb2. The second attachment connector CNb2 has the number of contact terminals of the second fixed connector CNa2 (the number corresponding to the eight ultraviolet light-emitting diodes D mounted on the circuit board 31). Each of the negative lead wires Lb provided corresponding to the light emitting diodes D is electrically connected. And each minus side lead wire Lb is inserted through the through-hole 25a formed in the connection board 25, and each front-end | tip is electrically connected to 4th bus bar B4.

  The fourth bus bar B4 is provided with the same connection screws 33 as the first to third bus bars B1 to B3 that connect the tip portions of the minus lead wires Lb so as to be able to contact and separate. And the 4th bus bar B4 and the front-end | tip part of each minus side lead wire Lb are connected via the connection screw 33 so that contact / separation is possible.

  Accordingly, each ultraviolet light-emitting diode D mounted on the circuit board 31 of the irradiation module 30 is applied with a DC power supply voltage via the corresponding plus-side lead wire La and minus-side lead wire Lb, and emits ultraviolet rays. .

  At this time, each ultraviolet light-emitting diode D is supplied with the power supply voltages V1, V2, and V2 depending on which one of the first to third bus bars B1 to B3 is electrically connected to the corresponding plus-side lead wire La. Since the value of V3 is different, the illuminance of the emitted ultraviolet light can be adjusted.

  In this embodiment, before the ultraviolet irradiation device 2 is shipped, each plus-side lead wire La is connected to the first bus bar B1 to which the lowest power supply voltage V1 is applied. This is because each ultraviolet light emitting diode D that has not changed with time before use is used, and therefore, all the ultraviolet light emitting diodes D emit ultraviolet rays having a desired illuminance when the lowest power supply voltage V3 is applied. It is because it has become.

  A hemispherical lens 35 is disposed below each ultraviolet light emitting diode D mounted on the circuit board 31 in a straight line, and each hemispherical lens 35 receives ultraviolet light emitted from the corresponding ultraviolet light emitting diode D. Each hemispherical lens 35 emits downward while suppressing the diffusion of the incident ultraviolet rays.

  Under the eight hemispherical lenses 35 arranged corresponding to the respective ultraviolet light emitting diodes D, rod-shaped cylindrical lenses 36 covering the entire hemispherical lenses 35 are arranged along the Y direction. The cylindrical lens 36 receives the ultraviolet rays, which are emitted from the respective hemispherical lenses 35 and suppressed from being diffused. The cylindrical lens 36 is configured to converge and emit the ultraviolet rays incident from the respective hemispherical lenses 35 in the X direction so as to be condensed into an elliptical shape.

  More specifically, as shown in FIGS. 7A and 7B, the ultraviolet light emitted from each ultraviolet light-emitting diode D is emitted with its diffusion suppressed by a hemispherical lens 35 disposed immediately below. Then, the ultraviolet light emitted from each hemispherical lens 35 is converged only in the X direction by the cylindrical lens 36 and condensed into an elliptical shape. As a result, the irradiation region T of the ultraviolet light emitted from each ultraviolet light-emitting diode D on the substrate W2 has an oblong shape having a long axis in the Y direction. Then, the long-axis direction end portions Te of the respective irradiation regions T overlap with each other, and linear ultraviolet rays are irradiated onto the substrate W2 from the ultraviolet irradiation device 2.

  Each hemispherical lens 35 and cylindrical lens 36 are held by a holding member 40 that is formed on the lower surface of the circuit board 31 so as to extend in the Y direction. When the circuit board 31 is fixed to the lower surface of the connecting plate 25 with the bolt 32, the holding member 40 is also fixed to the circuit board 31 with the bolt 32.

An accommodation groove 41 is formed in the center of the lower surface of the holding member 40 along the Y direction so that the cylindrical lens 36 is accommodated in the accommodation groove 41.
In addition, through holes 42 are formed at equal intervals on the bottom surface of the receiving groove 41 provided in the holding member 40 at positions corresponding to the respective hemispherical lenses 35. The diameter of the through hole 42 is slightly shorter than the diameter of the hemispherical lens 35, and a part of the hemispherical lens 35 disposed in each ultraviolet light emitting diode D mounted on the circuit board 31 is fitted into the through hole 42. When the holding member 40 is fixed to the circuit board 31, the hemispherical lens 35 is sandwiched and fixed between the holding member 40 and the ultraviolet light emitting diode D mounted on the circuit board 31.

  A pair of dropout prevention plates 43 are disposed on both sides of the holding member 40 in the lower surface X direction. When the holding member 40 is fixed to the lower surface of the circuit board 31 with the bolt 32, the pair of drop-off prevention plates 43 are fixed to the holding member 40 with the bolt 32.

  The pair of dropout prevention plates 43 have elastic locking claws 43a extending at positions facing each other at a predetermined interval, and the cylindrical lenses 36 received in the receiving grooves 41 by the elastic locking claws 43a. The cylindrical lens 36 is prevented from falling out of the receiving groove 41 by being elastically locked from below.

  A plurality of cooling fans 45 are arranged and fixed at predetermined intervals in the Y direction between the pair of side plates 22a and 22b and in the first to fourth bus bars B1 to B4, the connecting plate 25, and the intermediate position. Yes. The plurality of cooling fans 45 radiate the heat generated by each ultraviolet light emitting diode D mounted on the circuit board 31.

Next, the effect | action of the ultraviolet irradiation device 2 provided in the board | substrate bonding apparatus 1 is demonstrated.
(UV irradiation)
The ultraviolet irradiation device 2 is moved in the X direction with respect to the substrates W1 and W2 placed and positioned on the stage ST1, and arranged at an upper position facing the linear sealing material S formed between the substrates W1 and W2. To do. Then, all ultraviolet light emitting diodes D of the respective irradiation modules 30 of the ultraviolet irradiation device 2 emit light to emit ultraviolet rays.

The ultraviolet rays emitted from the all-ultraviolet light-emitting diodes D become linear ultraviolet beams through the respective hemispherical lenses 35 and cylindrical lenses 36 and are radiated to the substrates W1 and W2 (linear sealing material S). Is cured. Then, when the sealing material S is cured, both the substrates W1, W2 are bonded together.
(Illuminance adjustment)
It is known that when the ultraviolet irradiation device 2 is used for a long time, each ultraviolet light emitting diode D mounted on the circuit board 31 changes with time, and the ultraviolet illuminance with respect to the applied voltage decreases. Further, it is known that the degree of the decrease in ultraviolet illuminance with respect to the applied voltage due to the secular change of the ultraviolet light emitting diode D differs depending on the individual difference of the ultraviolet light emitting diode D.

  Therefore, an illuminance inspection is periodically performed on each ultraviolet light-emitting diode D. The illuminance inspection is performed using an inspection device (not shown). First, the first mounting connector CNb1 is removed from the first fixed connector CNa1, and the second mounting connector CNb2 is removed from the second fixed connector CNa2.

  Next, a first inspection connector (not shown) in which a lead wire for applying an inspection voltage for inspection is connected to the first fixed connector CNa1 from the inspection device to the anode of each ultraviolet light-emitting diode D from the inspection device. Installing. On the other hand, a second female connector for inspection (not shown) to which a lead wire for grounding the cathode of each ultraviolet light-emitting diode D is connected from the inspection device to the second fixed connector CNa2.

  Then, an inspection voltage is applied between the anode and cathode of each ultraviolet light emitting diode D mounted on the circuit board 31, and the ultraviolet illuminance at that time is measured. Based on the result of the measurement, the degree of decrease in ultraviolet illuminance is obtained for each ultraviolet light-emitting diode D and grouped.

  More specifically, even if the UV illuminance does not decrease or has decreased, the degree of decrease is small in the first rank of the A rank, and the UV illuminance is significantly lower than the first group. It is divided into a second group of B rank and a third group of C rank in which the difference in illuminance is remarkably reduced as compared with the second group.

  The A-rank ultraviolet light-emitting diode D belonging to the first group has very little secular change, and even if the power supply voltage V1 having the lowest value is continuously applied by connecting the positive lead wire La to the first bus bar B1 as it is, It is an ultraviolet light emitting diode in which no decrease is observed.

  The B rank ultraviolet light-emitting diode D belonging to the second group is aged, and the positive lead wire La is connected from the first bus bar B1 to the second bus bar B2, so that the power supply voltage V2 (> V2) having a medium voltage value is obtained. Is an ultraviolet light emitting diode whose illuminance can be increased to the same level as the ultraviolet illuminance of the first group of ultraviolet light emitting diodes D.

  The C rank ultraviolet light-emitting diode D belonging to the third group has a large secular change, and the power supply with the highest value is obtained by connecting the positive lead wire La from the second bus bar B2 (or the first bus bar B1) to the third bus bar B3. By applying the voltage V3 (> V2), the illuminance can be increased to the same level as the ultraviolet illuminance of the ultraviolet light-emitting diodes D of the first group.

  When grouping is completed for each ultraviolet light emitting diode D, the first female connector for inspection is removed from the first fixed connector CNa1, and the second female connector for inspection is removed from the second fixed connector CNa2. Subsequently, the first attached connector CNb1 removed first is attached to the first fixed connector CNa1, and the second attached connector CNb2 removed first is attached to the second fixed connector CNa2.

  Next, the plus lead wire La of the ultraviolet light emitting diode D belonging to the second group is removed from the first bus bar B1 and connected to the second bus bar B2. That is, the ultraviolet light emitting diode D belonging to the second group is applied with the power supply voltage V2 having a medium potential from the second bus bar B2, and a drive current relative to the power supply voltage V2 flows. It can be increased to the same level as the ultraviolet illuminance of the ultraviolet light emitting diode D.

  Further, the plus lead wire La of the ultraviolet light emitting diode D belonging to the third group is disconnected from the second bus bar B2 (or the first bus bar B1) and connected to the third bus bar B3. That is, the ultraviolet light emitting diode D belonging to the third group is applied with the highest power supply voltage V3 from the third bus bar B3, and a large driving current relative to the power supply voltage V3 flows. It can be increased to the same level as the ultraviolet illuminance of the ultraviolet light emitting diode D.

  Note that the positive lead line La of the ultraviolet light-emitting diode D belonging to the first group maintains its state without being removed from the first bus bar B1. That is, the ultraviolet light emitting diode D belonging to the first group is applied with the lowest power supply voltage V1 from the first bus bar B1 as before, and emits ultraviolet rays with the same illuminance as before.

  Therefore, by connecting to the corresponding first to third bus bars B1 to B3 for each group in this way, the illuminance of ultraviolet rays emitted from each ultraviolet light emitting diode D can be made substantially uniform, and the substrate The illuminance of the linear light beam irradiated on the linear sealing material S formed between W1 and W2 is uniform in the entire irradiation region.

Next, effects of the embodiment configured as described above will be described below.
(1) According to the above embodiment, the different power supply voltages V1, V2, and V3 can be selected and applied to each ultraviolet light emitting diode D mounted on the circuit board 31 of the irradiation module 30. And, when each UV light emitting diode D, where the illuminance of the emitted ultraviolet light was uniform at first, due to secular change, when the illuminance of the ultraviolet light emitted by each of the ultraviolet light emitting diodes D is not uniform, The power supply voltage to be applied was changed so that the illuminance of ultraviolet rays emitted from each ultraviolet light-emitting diode D was made uniform.

Therefore, the ultraviolet irradiation device 2 can make the illuminance of the linear ultraviolet rays irradiated on the linear sealing material S interposed between the substrates W1 and W2 uniform in the entire irradiation region.
As a result, even if the mounted ultraviolet light emitting diodes D are individually reduced in illuminance, the illuminance can be individually adjusted with respect to the ultraviolet light emitting diodes D, so that all the mounted ultraviolet light emitting diodes D are not wasted. The lifetime of the ultraviolet irradiation device 2 can be extended.

  (2) According to the above embodiment, the first to third bus bars B1 to B3 having different power supply voltages are provided, and the corresponding lead wires La are provided to the respective ultraviolet light emitting diodes D. Then, the corresponding lead wires are connected to the first to third bus bars B1 to B3 according to the decrease in the illuminance of the ultraviolet light emitting diode D.

Therefore, the illuminance can be changed by simply changing the power supply voltage applied to the plurality of ultraviolet light emitting diodes D mounted on the circuit board 31.
(3) According to the embodiment, the first fixed connector CNa1 that is electrically connected to the anode terminal of each mounted light emitting diode D is mounted on the circuit board 31, and the first fixed connector CNa1 is mounted on the fixed connector. Thus, the first mounting connector CNb1 connecting the corresponding lead wire La to each ultraviolet light emitting diode D is detachably connected.

  Accordingly, when performing the illuminance inspection using the inspection device, the first mounting connector CNb1 is removed from the first fixed connector CNa1, and the first mounting for inspection in which the lead wire for applying the inspection voltage of the inspection device is connected. A measurement test can be performed with a simple operation by simply attaching the connector.

In addition, you may change the said embodiment as follows.
-In the said embodiment, although implemented with the four bus bars B1-B4 in the ultraviolet irradiation device 2, the number may be changed suitably.

-In the said embodiment, although the four ultraviolet irradiation devices 2 were provided in the board | substrate bonding apparatus 1, you may implement by changing that number suitably.
In the above embodiment, twelve irradiation modules 30 are arranged in the ultraviolet irradiation device 2, but the number may be changed as appropriate.

In the above embodiment, eight ultraviolet light-emitting diodes D are mounted on the circuit board 31 of the irradiation module 30, but the number may be changed as appropriate.
In the above embodiment, the negative lead wire Lb is provided for each ultraviolet light emitting diode D, but this may be used with a single lead wire.

The perspective view of the bonding apparatus provided with the ultraviolet irradiation device of this embodiment. Similarly sectional drawing of a bonding apparatus. The principal part sectional drawing of an ultraviolet irradiation device. The principal part sectional drawing of the irradiation module of an ultraviolet irradiation device. The figure which shows the arrangement | positioning state of a bus bar. The figure which shows the arrangement | positioning state of an irradiation module. (A) (b) The schematic diagram for demonstrating the irradiation area | region of the ultraviolet-ray radiate | emitted from an ultraviolet irradiation device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Board | substrate bonding apparatus, 2 ... Ultraviolet irradiation apparatus, 22a, 22b ... Side plate, 24 ... Insulation board, 25 ... Connection board, 26 ..., 30 ... Irradiation module, 31 ... Circuit board, 32 ... Bolt, 33 ... Connection screw 35 ... Hemispherical lens, 36 ... Cylindrical lens, 40 ... Holding member, 41 ... Housing groove, 42 ... Through hole, 43 ... Drop-off prevention plate, 43a ... Elastic locking claw, B1 ... First bus bar, B2 ... No. 2 busbars, B3 ... 3rd busbar, B4 ... 4th busbar, CNa1 ... 1st fixed connector, CNa2 ... 2nd fixed connector, CNb1 ... 1st mounting connector, CNb2 ... 2nd mounting connector, D ... UV light emitting diode, La ... plus-side lead wire, Lb ... minus-side lead wire, S ... sealing material, V1, V2, V3 ... power supply voltage, W1 ... lower substrate, W2 ... upper substrate.

Claims (5)

A light irradiation device that irradiates light emitted from a plurality of optical elements arranged in one direction onto a linear sealing material made of a photocurable resin interposed between bonded substrates,
A lead wire provided for each of the plurality of optical elements, for supplying a power supply voltage to the corresponding optical element;
A plurality of bus bars each having a different power supply voltage applied thereto;
A light irradiating apparatus comprising a connecting means for connecting the lead wires to the bus bars so as to be electrically connected to and separated from each other. In the light irradiation apparatus of Claim 1,
The light irradiation apparatus, wherein the connection means is provided for each of the plurality of lead wires. In the light irradiation apparatus of Claim 1 or 2,
The plurality of optical elements are ultraviolet light emitting diodes, and the plurality of ultraviolet light emitting diodes are mounted on the circuit board in a straight line in one direction with respect to the circuit board,
The plurality of circuit boards are arranged in the one direction, and the ultraviolet light emitting diodes mounted on the circuit boards are arranged in a straight line in the one direction. In the light irradiation apparatus of Claim 3,
On the circuit board, for each of a plurality of mounted ultraviolet light-emitting diodes, a fixing connector having an external connection terminal electrically connected to the anode terminal is mounted.
An optical connector characterized in that a mounting connector having an external connection terminal electrically connected to a lead wire provided for each of the plurality of ultraviolet light-emitting diodes is detachably connected to the fixing connector. Irradiation device. In the light irradiation apparatus of Claim 3 or 4,
A hemispherical lens is disposed on the ultraviolet light emitting side of the plurality of ultraviolet light emitting diodes mounted on the circuit board,
A light irradiation apparatus characterized in that a cylindrical lens shared with other hemispherical lenses is disposed on the ultraviolet emission side of the hemispherical lenses.

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