JPH0638516B2 - Light emitting element array - Google Patents
Light emitting element arrayInfo
- Publication number
- JPH0638516B2 JPH0638516B2 JP12994684A JP12994684A JPH0638516B2 JP H0638516 B2 JPH0638516 B2 JP H0638516B2 JP 12994684 A JP12994684 A JP 12994684A JP 12994684 A JP12994684 A JP 12994684A JP H0638516 B2 JPH0638516 B2 JP H0638516B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- electrode
- element array
- emitting element
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Facsimile Heads (AREA)
- Led Devices (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は光プリントヘツド等に利用される発光素子アレ
ーに関するもので、特にその配線構造に関するものであ
る。The present invention relates to a light emitting element array used for an optical print head or the like, and more particularly to a wiring structure thereof.
第２図は従来のこの種の発光素子アレーを示す正面図、
第３図はそのＡ−Ａ線断面図で、第２図において１は一
直線状に配置された発光部、２はＰ電極、３は該Ｐ電極
２内に設定された外部回路接続用のワイヤボンデイング
エリヤであり、また第３図において４は基板、５は絶縁
膜、６はＰ層、７はＮ層、８はＮ電極を示している。FIG. 2 is a front view showing a conventional light emitting element array of this type,
FIG. 3 is a sectional view taken along the line AA in FIG. 2. In FIG. 2, 1 is a linearly arranged light emitting portion, 2 is a P electrode, and 3 is a wire for connecting an external circuit set in the P electrode 2. In FIG. 3, 4 is a substrate, 5 is an insulating film, 6 is a P layer, 7 is an N layer, and 8 is an N electrode.
この発光素子アレーにおける配線は、ワイヤボンデイン
グエリヤ３を確保するため、Ｐ電極２を千鳥状に配置し
て発光部対応に設けており、またＮ電極８は基板４の背
面全体に形成して電気的に集中した電極構造としてい
る。In order to secure the wire bonding area 3, the wirings in this light emitting element array are arranged in a zigzag pattern with the P electrodes 2 provided corresponding to the light emitting portion, and the N electrodes 8 are formed on the entire back surface of the substrate 4 to provide electrical conductivity. The electrode structure is concentrated.
しかしながら、上述した従来の構造では、発光部の集積
数の増加に伴つてワイヤボンド数が増加すると、実装技
術及び実装状態が複雑化して信頼性が低下するという問
題があり、また発光部の全点灯時におけるＮ電極への電
流集中が大きいため、ダイスボンド技術の安定性が要求
されるという問題もあつた。However, in the above-described conventional structure, when the number of wire bonds increases with the increase in the number of integrated light emitting units, there is a problem that the mounting technology and the mounting state become complicated and the reliability deteriorates. Since the current concentration on the N electrode during lighting is large, there is also a problem that the stability of the die bonding technique is required.
本発明はこれらの問題を解決するもので、発光部の集積
数の増加に対して実装技術を複雑化することなく対処で
き、信頼性の向上を計れると共に、Ｎ電極への電流の集
中を緩和できる発光素子アレーを実現することを目的と
するものである。The present invention solves these problems, and can cope with an increase in the number of integrated light emitting parts without complicating the mounting technique, improve reliability, and alleviate concentration of current to the N electrode. The object is to realize a light emitting element array that can be realized.
この目的を達成するため、本発明は、同一基板上に形成
された発光部を含む複数のＰ電極と、複数のＮ電極とを
有する発光素子アレーにおいて、前記基板上の前記Ｐ電
極を同数づつ区分して成る複数のブロックと、各前記ブ
ロックの１つのＰ電極を各ブロック間にわたる金属複式
配線により接続してなるグループと、各前記グループに
１個含まれるように設けられ、かつ各前記ブロックの１
個の前記Ｐ電極に形成されるワイヤボンディングエリヤ
と、前記Ｐ電極と同一面上に各前記ブロックに対して設
けられる前記Ｎ電極とを有することを特徴とする。To achieve this object, the present invention provides a light emitting element array having a plurality of P electrodes including a light emitting portion formed on the same substrate and a plurality of N electrodes, in which the same number of P electrodes on the substrate are arranged. A plurality of blocks divided into groups, a group in which one P electrode of each of the blocks is connected by a metal double wiring extending between the blocks, and one group is provided in each group, and each block is provided. Of 1
It has a wire bonding area formed on each of the P electrodes, and the N electrode provided for each of the blocks on the same surface as the P electrode.
上述した手段によれば、基板上で面積をかせいでしまう
ワイヤボンディングエリヤを、Ｐ電極を区分して成るブ
ロック数と同数に減少することができるため、発光素子
アレー全体の縮小化を図ることができ、ひいては個々の
ワイヤボンディングエリヤの面積を広げることができる
ので、信頼性を低下することなく発光部の増加に対応可
能となる。According to the above-mentioned means, it is possible to reduce the number of wire bonding areas that occupy a large area on the substrate to the same number as the number of blocks formed by dividing the P electrode. In addition, since the area of each wire bonding area can be increased, it is possible to cope with an increase in the number of light emitting parts without lowering the reliability.
また、Ｎ電極は各ブロック毎に共通電極として形成でき
るので、駆動電流の集中を緩和することも可能となる。In addition, since the N electrode can be formed as a common electrode for each block, it is possible to reduce the concentration of the drive current.
以下図面を参照して実施例を説明する。 Embodiments will be described below with reference to the drawings.
第１図は本発明による発光素子アレーの一実施例を示す
正面図で、図において１ａ，１ｂ・・・１ｎは同一基板
上に一直線状に配置された発光部、２ａはワイヤボンデ
イングエリヤ３を有するＰ電極、２ｂは複式配線用のＰ
電極、８ａ，８ｂ・・・８ｎは前記Ｐ電極２ａ，２ｂと
同一面つまり表面に形成されたＮ電極、９はＰ電極２
ａ，２ｂの下層に印刷された金属複式配線、１０は金属
複式配線９とＰ電極２ａまたは２ｂとの接続部である。1n is a front view showing an embodiment of a light emitting element array according to the present invention. In the figure, 1a, 1b ... 1n are light emitting portions arranged in a straight line on the same substrate, and 2a is a wire bonding area 3. The P electrode 2b has a P for double wiring.
8n is an N electrode formed on the same surface as the P electrodes 2a and 2b, that is, a surface, and 9 is a P electrode 2
Metal compound wiring 10 printed on the lower layer of a and 2b is a connecting portion between the metal compound wiring 9 and the P electrode 2a or 2b.
本実施例の発光素子アレーは、前記発光部１ａ，１ｂ、
・・・１ｎを同数づつ区分して同一基板上に複数のブロ
ツク（例えば発光部の全数を１２８個とすると４つのブ
ロック）を設定しており、各ブロツクには同一方向に延
在するＰ電極２ａ，２ｂを持つ発光部が１ａ，１ｂ・・
・１ｎの如くｉ個（例えば３２個）づつ設けられてい
て、各ブロツクの同一Ｐ電極同志例えば発光部１ａ1，
１ｂ1・・・１ｎ1のグループ、１ａ2，１ｂ2・・・１ｎ
2のグループ、及び１ａi，１ｂi・・・１ｎiのＰ電極同
志が同一基板状でそれぞれ金属複式配線９により接続さ
れている。The light emitting element array of the present embodiment includes the light emitting portions 1a, 1b,
... A plurality of blocks (for example, four blocks when the total number of light emitting parts is 128) are set on the same substrate by dividing 1n into the same number, and each block has a P electrode extending in the same direction. Light emitting parts having 2a, 2b are 1a, 1b ...
.. i pieces (for example, 32 pieces) like 1n are provided, and the same P electrodes of the respective blocks are the same, for example, the light emitting portion 1a 1 ,
1b 1 ... 1n 1 group 1a 2 , 1b 2 ... 1n
The two groups and the P electrodes of 1a i , 1b i ... 1n i are connected to each other by the metal double wiring 9 on the same substrate.
ここで、ワイヤボンデイングエリヤ３を有するＰ電極２
ａは各ブロツクに１個設けられ、かつ同一Ｐ電極のグル
ープに１個含まれるようになつている。つまりワイヤボ
ンデイングエリヤ３を有するＰ電極２ａはＰ電極２ｂの
ｎ個置きに外部に引出される。Here, the P electrode 2 having the wire bonding area 3
One a is provided for each block, and one a is included in the same group of P electrodes. That is, the P electrodes 2a having the wire bonding areas 3 are drawn out every nth P electrode 2b.
また、これらのＰ電極２ａ，２ｂと同一面上にＮ電極が
８ａ，８ｂ・・・８ｎの如く各ブロツク毎に設けられて
おり、これらのＮ電極８ａ，８ｂ・・・８ｎには必要な
数だけのワイヤボンデイングエリヤが得られるように面
積が取られている。Further, N electrodes 8a, 8b ... 8n are provided for each block on the same surface as these P electrodes 2a, 2b, and these N electrodes 8a, 8b. The area is taken so that as many wire bonding areas as possible can be obtained.
以上の構成とすることにより、ｉ入力ｎ出力のマトリク
ス構成の発光素子アレーが実現される。With the above configuration, a light emitting element array having a matrix configuration of i inputs and n outputs is realized.
以上説明したように本発明は、基板上の前記Ｐ電極を同
数づつ区分して成る複数のブロックと、各前記ブロック
の１つのＰ電極を各ブロック間にわたる金属複式配線に
より接続してなるグループと、各前記グループに１個含
まれるように設けられ、かつ各前記ブロックの１個の前
記Ｐ電極に形成されるワイヤボンディングエリヤと、前
記Ｐ電極と同一面上に各前記ブロックに対して設けられ
るＮ電極とを有する構成として、基板上で面積をかせい
でしまうワイヤボンディングエリヤを、Ｐ電極を区分し
て成るブロック数と同数に減少させているため、発光素
子アレー全体の縮小化を図ることができるという効果が
得られる。As described above, according to the present invention, a plurality of blocks formed by dividing the P electrodes on the substrate by the same number and a group formed by connecting one P electrode of each block by a metal double wiring extending between the blocks are provided. , One wire bonding area provided in each group and formed on one P electrode of each block, and provided for each block on the same surface as the P electrode. Since the number of wire bonding areas, which occupy a large area on the substrate, is reduced to the same number as the number of blocks formed by partitioning the P electrode in the configuration including the N electrode, the entire light emitting element array can be downsized. The effect of being able to be obtained is obtained.
また、ワイヤボンディングエリヤの数が減少したこと
で、個々のワイヤボンディングエリヤの面積を広げるこ
とができ、従って外部回路との接続が容易になるという
効果も得られる。Further, since the number of wire bonding areas is reduced, the area of each wire bonding area can be increased, and therefore, the effect of facilitating the connection with the external circuit can be obtained.
また、ワイヤボンディングエリヤの数が減少したこと
で、発光部の数が増加しても、信頼性を低下することな
く発光部の数の増加に対応することが可能となり、しか
も高価なワイヤボンディング数が減少するので、安価に
制作できるという高価も得られる。Further, since the number of wire bonding areas is reduced, even if the number of light emitting parts is increased, it is possible to cope with the increase in the number of light emitting parts without lowering the reliability. The cost is reduced, so there is also the high cost of being able to produce at low cost.
また、Ｎ電極も各ブロツク毎に分割して設けているた
め、Ｎ電極に流れる電流も平均化され、電流集中による
不安定性も減少するという効果があり、更にＮ電極はＰ
電極と同一面上にあるため、ダイスボンデイング等の影
響もなくなり、経済的である等の効果も得られる。Further, since the N electrode is also provided separately for each block, the current flowing through the N electrode is averaged, and there is an effect that instability due to current concentration is reduced.
Since it is on the same surface as the electrodes, the effects of die bonding and the like are eliminated, and it is possible to obtain effects such as economic efficiency.
第１図は本発明による発光素子アレーの一実施例を示す
正面図、第２図は従来の発光素子アレーを示す正面図、
第３図は第２図のＡ−Ａ線断面図である。 １，１ａ，１ｂ・・・１ｎ……発光部、２ａ，２ｂ……
Ｐ電極、３……ワイヤボンデイングエリヤ、８，８ａ，
８ｂ・・・８ｎ……Ｎ電極、９……金属複式配線、１０
……接続部FIG. 1 is a front view showing an embodiment of a light emitting element array according to the present invention, and FIG. 2 is a front view showing a conventional light emitting element array.
FIG. 3 is a sectional view taken along the line AA of FIG. 1, 1a, 1b ... 1n ... Light emitting part, 2a, 2b.
P electrode, 3 ... Wire bonding area, 8, 8a,
8b ... 8n ... N electrode, 9 ... metal double wiring, 10
...... Connection part
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０４Ｎ 1/036 Ａ 8721−5Ｃ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H04N 1/036 A 8721-5C
Claims (1)
のＰ電極と、複数のＮ電極とを有する発光素子アレーに
おいて、 前記基板上の前記Ｐ電極を同数づつ区分して成る複数の
ブロックと、 各前記ブロックの１つのＰ電極を各ブロック間にわたる
金属複式配線により接続してなるグループと、 各前記グループに１個含まれるように設けられ、かつ各
前記ブロックの１個の前記Ｐ電極に形成されるワイヤボ
ンディングエリヤと、 前記Ｐ電極と同一面上に各前記ブロックに対して設けら
れる前記Ｎ電極とを有することを特徴とする発光素子ア
レー。1. A light emitting element array having a plurality of P electrodes including a light emitting portion formed on the same substrate, and a plurality of N electrodes, wherein a plurality of P electrodes on the substrate are divided into the same number. A block, a group in which one P electrode of each block is connected by a metal double wiring between the blocks, and one P electrode of each block is provided so as to be included in each group. A light emitting element array comprising: a wire bonding area formed on an electrode; and the N electrode provided for each block on the same surface as the P electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12994684A JPH0638516B2 (en) | 1984-06-26 | 1984-06-26 | Light emitting element array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12994684A JPH0638516B2 (en) | 1984-06-26 | 1984-06-26 | Light emitting element array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6110283A JPS6110283A (en) | 1986-01-17 |
| JPH0638516B2 true JPH0638516B2 (en) | 1994-05-18 |
Family
ID=15022342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12994684A Expired - Lifetime JPH0638516B2 (en) | 1984-06-26 | 1984-06-26 | Light emitting element array |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0638516B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0881686A3 (en) | 1997-05-28 | 2000-04-19 | Oki Data Corporation | LED array and LED printer head |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1175884A (en) * | 1980-06-25 | 1984-10-09 | Hugh St. L. Dannatt | Light emitting diode assembly |
-
1984
- 1984-06-26 JP JP12994684A patent/JPH0638516B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6110283A (en) | 1986-01-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |