JPS59195757U - multicolor light emitting diode lamp - Google Patents
multicolor light emitting diode lampInfo
- Publication number
- JPS59195757U JPS59195757U JP9109383U JP9109383U JPS59195757U JP S59195757 U JPS59195757 U JP S59195757U JP 9109383 U JP9109383 U JP 9109383U JP 9109383 U JP9109383 U JP 9109383U JP S59195757 U JPS59195757 U JP S59195757U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- emitting diodes
- attached
- substrate electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の単色発光ダイオードランプの斜視図であ
り、第２図は該単色発光ダイオードランプのリードフレ
ームの構造を模式的に示した図である。第３図は本考案
の第１実施例で用いるリードフレームの構造を模式的に
示した図であり、第４図は本考案の第２実施例で用いる
リードフレームの構造を模式的に示した図であり、第５
図は本考案の第３実施例で用いるリードフレームの構造
を模式的に示した図である。
１・・・リードフレーム、１１・・・リードフレームの
端子、１５・・・共通基板電極部、１６・・・ランド部
、３・・・ＬＥＤ、 ５・・・支持部材、７・・・金線
。
第１図
ＩＡ
↓ −５１
ｒｃニ
ー −、−−第２−図
１−−２．５４−＋−２，５４−＝−１ｆ
７
十 十 十 ｆ＋−
＋ ＋ ＋＋＋十十FIG. 1 is a perspective view of a conventional monochrome light emitting diode lamp, and FIG. 2 is a diagram schematically showing the structure of a lead frame of the monochrome light emitting diode lamp. FIG. 3 is a diagram schematically showing the structure of a lead frame used in the first embodiment of the present invention, and FIG. 4 is a diagram schematically showing the structure of the lead frame used in the second embodiment of the present invention. Figure 5.
The figure is a diagram schematically showing the structure of a lead frame used in a third embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Lead frame, 11... Terminal of lead frame, 15... Common board electrode part, 16... Land part, 3... LED, 5... Support member, 7... Gold line. Fig. 1 IA ↓ -51 rc knee -, - Fig. 2 1--2.54-+-2,54-=-1f
7 ten ten ten f+-
＋ ＋ ＋＋＋10
Claims (3)
るリードフレームと、該リードフレーム上に取着された
発光色の異なる複数種類の発光ダイオードと、前記リー
ドフレームを支持する支持部材とから成る多色発光ダイ
オードランプにおいて、 前記リードフレームは、前記複数種類の発光ダイオード
の陰極又は陽極が取着され共通の陰極又は陽極となる共
通基板電極部と、 前記発光ダイオードの前記共通基板電極部に取着された
極と対向する陽極又は陰極とワイアボンディングされ、
多色発光ダイオードランプの陽極又は陰極となるランド
部と、 前記共通基板電極部及び前記ランド部に接続する端子と
から成り、 前記ランド部の少なくとも１は、少なくとも１種類の発
光ダイオードについて共通化されていることを特徴とす
る多色発光ダイオードランプ。(1) A multi-layer structure consisting of a lead frame that serves as a terminal for supplying power to the light emitting diode from the outside, multiple types of light emitting diodes that emit light of different colors attached to the lead frame, and a support member that supports the lead frame. In the color light emitting diode lamp, the lead frame includes: a common substrate electrode portion to which the cathodes or anodes of the plurality of types of light emitting diodes are attached and serve as a common cathode or anode; and a common substrate electrode portion attached to the common substrate electrode portion of the light emitting diodes. wire bonded to the anode or cathode opposite the pole
It consists of a land part that becomes an anode or a cathode of a multicolor light emitting diode lamp, and a terminal connected to the common substrate electrode part and the land part, and at least one of the land parts is shared by at least one type of light emitting diode. A multicolor light emitting diode lamp.
軸に対し対称的に配設された複数の突起部とを有する蛇
管形状を成し、前記各突起部には、複数種の発光ダイオ
ードが取着され、そのうち少な（とも１種類の発光ダイ
オードは、前記隣接する突起部間において、それぞれ相
対向する位置に対称的に取着されている実用新案登録請
求の範囲第１項記載の多色発光ダイオードランプ。(2) The common substrate electrode part has a serpentine shape having a spine part and a plurality of protrusions arranged symmetrically with respect to the central axis of the spine part, and each of the protrusions has a plurality of types. Claim 1: A utility model in which light emitting diodes are attached, and a small number of the light emitting diodes (at least one type of light emitting diodes are attached symmetrically at opposing positions between the adjacent protrusions). Multicolor light emitting diode lamp as described.
し、その一部には複数種の発光ダイオードが取・着され
る取着部を有し、そのうち隣り合う取着部には少なくと
も同一種類の発光ダイオードが取着されている特許請求
の範囲第１項記載の多色発光ダイオードランプ。(3) The common substrate electrode portion has a periodic waveform shape, and has a mounting portion on a part thereof to which a plurality of types of light emitting diodes are attached, and adjacent mounting portions have at least one mounting portion. A multicolor light emitting diode lamp according to claim 1, wherein the same type of light emitting diodes are installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9109383U JPS59195757U (en) | 1983-06-14 | 1983-06-14 | multicolor light emitting diode lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9109383U JPS59195757U (en) | 1983-06-14 | 1983-06-14 | multicolor light emitting diode lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59195757U true JPS59195757U (en) | 1984-12-26 |
Family
ID=30221066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9109383U Pending JPS59195757U (en) | 1983-06-14 | 1983-06-14 | multicolor light emitting diode lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59195757U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014038989A (en) * | 2012-08-20 | 2014-02-27 | Toshiba Corp | Semiconductor light-emitting device and lighting device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5626036A (en) * | 1980-04-14 | 1981-03-13 | Kazuhiko Kodama | Apparatus for producing special fabric having bias texture |
| JPS5632796A (en) * | 1979-08-24 | 1981-04-02 | Matsushita Electric Works Ltd | Method of forming electric path onto insulating substrate |
-
1983
- 1983-06-14 JP JP9109383U patent/JPS59195757U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5632796A (en) * | 1979-08-24 | 1981-04-02 | Matsushita Electric Works Ltd | Method of forming electric path onto insulating substrate |
| JPS5626036A (en) * | 1980-04-14 | 1981-03-13 | Kazuhiko Kodama | Apparatus for producing special fabric having bias texture |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014038989A (en) * | 2012-08-20 | 2014-02-27 | Toshiba Corp | Semiconductor light-emitting device and lighting device |
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