JPS62201783U - - Google Patents
Info
- Publication number
- JPS62201783U JPS62201783U JP1986090862U JP9086286U JPS62201783U JP S62201783 U JPS62201783 U JP S62201783U JP 1986090862 U JP1986090862 U JP 1986090862U JP 9086286 U JP9086286 U JP 9086286U JP S62201783 U JPS62201783 U JP S62201783U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting
- mask plate
- display
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
第1図は本考案発光表示体の一実施例を示す斜
視図、第2図は第1図の―線拡大断面図、第
3図は同実施に用いるマスク板の底面図、第4図
は本考案に用いる他の態様のマスク板の底面図、
第5図は本考案発光表示体の一使用例を示す斜視
図、第6図は本考案の他の実施例を示す断面図、
第7図は従来例の斜視図、第8図は第7図の―
線拡大断面図である。
1……発光表示体、2……発光部、3……表示
体基板、6……発光素子(LEDチツプ)、8…
…透孔、9……マスク板、12……空気流通路。
Fig. 1 is a perspective view showing one embodiment of the light emitting display of the present invention, Fig. 2 is an enlarged sectional view taken along the line - - in Fig. 1, Fig. 3 is a bottom view of a mask plate used in the same implementation, and Fig. 4 is A bottom view of another embodiment of the mask plate used in the present invention,
FIG. 5 is a perspective view showing an example of the use of the light emitting display of the present invention, and FIG. 6 is a sectional view showing another embodiment of the present invention.
Figure 7 is a perspective view of the conventional example, and Figure 8 is the same as in Figure 7.
It is a line enlarged sectional view. DESCRIPTION OF SYMBOLS 1... Light emitting display body, 2... Light emitting part, 3... Display body board, 6... Light emitting element (LED chip), 8...
...Through hole, 9...Mask plate, 12...Air flow path.
Claims (1)
素子に対応する透孔を形成したマスク板を重ね合
わせ、各発光素子を各透孔内に収納して発光部を
形成した発光表示体において、上記表示体基板と
マスク板との間に、両端が外部へ通じる空気流通
路を形成したことを特徴とする発光表示体。 In a light-emitting display in which a display substrate on which a plurality of light-emitting elements are arranged is laminated with a mask plate in which through-holes corresponding to each light-emitting element are formed, and each light-emitting element is accommodated in each through-hole to form a light-emitting part. . A light-emitting display, characterized in that an air flow path is formed between the display substrate and the mask plate, both ends of which communicate with the outside.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986090862U JPH0339819Y2 (en) | 1986-06-13 | 1986-06-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986090862U JPH0339819Y2 (en) | 1986-06-13 | 1986-06-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62201783U true JPS62201783U (en) | 1987-12-23 |
JPH0339819Y2 JPH0339819Y2 (en) | 1991-08-21 |
Family
ID=30951120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986090862U Expired JPH0339819Y2 (en) | 1986-06-13 | 1986-06-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0339819Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100496066B1 (en) * | 2002-06-04 | 2005-06-16 | 에이피전자 주식회사 | A cap to minutely inject sealing into LED board |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2005013246A1 (en) * | 2003-08-04 | 2006-09-28 | 株式会社光波 | Display device |
WO2006098799A2 (en) * | 2005-03-12 | 2006-09-21 | 3M Innovative Properties Company | Illumination devices and methods for making the same |
US8525402B2 (en) | 2006-09-11 | 2013-09-03 | 3M Innovative Properties Company | Illumination devices and methods for making the same |
-
1986
- 1986-06-13 JP JP1986090862U patent/JPH0339819Y2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100496066B1 (en) * | 2002-06-04 | 2005-06-16 | 에이피전자 주식회사 | A cap to minutely inject sealing into LED board |
Also Published As
Publication number | Publication date |
---|---|
JPH0339819Y2 (en) | 1991-08-21 |