JPS59150486A - Light source device for illumination - Google Patents
Light source device for illuminationInfo
- Publication number
- JPS59150486A JPS59150486A JP58018309A JP1830983A JPS59150486A JP S59150486 A JPS59150486 A JP S59150486A JP 58018309 A JP58018309 A JP 58018309A JP 1830983 A JP1830983 A JP 1830983A JP S59150486 A JPS59150486 A JP S59150486A
- Authority
- JP
- Japan
- Prior art keywords
- groove
- filler
- light emitting
- aperture
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005286 illumination Methods 0.000 title claims description 6
- 239000000945 filler Substances 0.000 claims abstract description 22
- 230000005540 biological transmission Effects 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 101100454194 Caenorhabditis elegans mei-1 gene Proteins 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241000254158 Lampyridae Species 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Facsimile Heads (AREA)
- Facsimile Scanning Arrangements (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分・杼〕
この発明は１画像読み取り装置等において原稿を読みと
るときに用いられる照明用光源装置に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Technical Portion of the Invention/Shuttle] The present invention relates to a light source device for illumination used when reading a document in a single image reading device or the like.
最近、ファクシミリ、複写機、オフィスのオートメーシ
ョン機器等において、原稿の読み取りを行なう画像読み
取り装置の照明用光源として螢光灯に換えて発光ダイオ
ードアレイゲＣ源を用いることが提駕されている。Recently, it has been proposed to use a light emitting diode Alley C source instead of a fluorescent lamp as a light source for illuminating an image reading device that reads a document in facsimiles, copying machines, office automation equipment, and the like.
発光ダイオードアレイ光源は螢に灯に比べてちらつきが
なく、長寿命で取り扱い易い等の特徴をもっている。現
在考えられている発光ダイオードアレイ光源として茗１
図およびｉ＊ ２１１ （こ示すものがある。図におい
で１は矩形状に形成した金属屈極基体で、この基体１上
に複数個の発光ダイオードチップ２−１〜２．を−列を
こ配設して発光ダイオードアレイ２を構成する。この発
光ダイオードアレイ２と対向する位置に溝３ａを形成し
たシリンダー型レンズ３を金属電極基体１１こ吸着等の
手段を用いて一体に形成する。最後に、レンズ３の端面
に設けられた開口部４から充填剤５を注入して溝３ａ内
に充填する。Compared to firefly lights, light emitting diode array light sources have features such as no flicker, long lifespan, and ease of handling. Mei 1 is currently being considered as a light emitting diode array light source.
Figure and i* 211 (This is what is shown. In the figure, 1 is a metal polar base formed in a rectangular shape. On this base 1, a plurality of light emitting diode chips 2-1 to 2. are arranged in - rows. A cylindrical lens 3 having a groove 3a formed at a position facing the light emitting diode array 2 is formed integrally with the metal electrode base 11 by means of suction or the like.Finally. Next, a filler 5 is injected from an opening 4 provided on the end surface of the lens 3 to fill the groove 3a.
このようｔこして、溝３ａの中力）ら屈折率の小さな空
気を抜き出し、換わりに発光ダイオードチップｌ、〜２
．内外での屈折率の変化カＳ小さくなるような充填剤５
を充填するこ吉により、全反射によって光の伝達効率が
低下することを防＋ｈすることかできる。In this way, air with a small refractive index is extracted from the groove 3a (center force) and replaced with light emitting diode chips l, ~2.
．． Filler 5 that reduces the change in refractive index between the inside and outside
It is possible to prevent the light transmission efficiency from decreasing due to total internal reflection.
しか七ながら、レンズ３の一方端面に設けた狭Ｇ）開口
部４より充填剤５を注入すると、１葎３ａ内の空気は基
体１とレンズ３により包囲さｔｔ逃げ道がふさがれてい
るので、粘度の高い充填剤５の流り助とともに、その内
部に取り込まれて気泡を生じ、歩留りが低下してコスト
高を招く原因となっていた。また、充填剤５に気泡が封
入されると、気泡の部分で屈折率が変化するため、光の
伝１室効率が低下してしまう欠点があった。However, when the filler 5 is injected through the narrow aperture 4 provided on one end surface of the lens 3, the air within the pod 3a is surrounded by the base 1 and the lens 3, and the escape route is blocked. As the highly viscous filler 5 flows, it is taken into the interior of the filler to form bubbles, resulting in a decrease in yield and an increase in costs. Furthermore, when air bubbles are enclosed in the filler 5, the refractive index changes at the air bubbles, resulting in a reduction in light transmission efficiency.
この発明は上記の問題点を解消するためになされたもの
で、充填剤に対する空気の混入を抑制し歩留りが高くか
つ光の伝達効率のよい照明用光源装置を提供しようとす
るものである。The present invention has been made to solve the above-mentioned problems, and aims to provide a light source device for illumination that suppresses the mixing of air into the filler, has a high yield, and has good light transmission efficiency.
この発明は長手方向の溝を備えたシリンダー型レンズに
より１発光ダイオードアレイを蔽う、構成をとるときも
に、このシリング−型レンズの一側面の長手方向略全域
にわたり開口部を形成して。When the present invention is configured to cover one light emitting diode array with a cylindrical lens provided with a longitudinal groove, an opening is formed over substantially the entire length of one side of the Schilling-shaped lens in the longitudinal direction.
この開口部より充填剤を注入するこきを特徴とするもの
である。The feature is that the filler is injected through this opening.
この発明によれば、開口部を通じて空気を充分に逃つ（
すことができるので充填剤中に空気が混入して気泡を生
じることがなく歩留りを高めで価格の低減を計るととも
に、ｉＭ品の品質を高め光の伝達効率を良好にすること
ができる。According to this invention, air can escape sufficiently through the opening (
Since air can be mixed into the filler and bubbles are not generated, the yield can be increased and the price can be reduced, and the quality of the iM product can be improved and the light transmission efficiency can be improved.
以下図面を参照してこの発明の一実施例を説明ｒる。 An embodiment of the present invention will be described below with reference to the drawings.
第３図および・Ａ４１図において１１は薙冊状に形成し
た金属電極基体で、この基体１１の長手方向に複数個の
発光ダイオードチップ１２−〜１２−ｎを一列に配設し
、マウント等の手段を用いて固着させて発光ダイオード
アレイ１２を構成する。In Fig. 3 and Fig. A41, reference numeral 11 denotes a metal electrode base formed in a rectangular shape, and a plurality of light emitting diode chips 12- to 12-n are arranged in a row in the longitudinal direction of this base 11, and a mount, etc. The light emitting diode array 12 is constructed by fixing the light emitting diode array 12 using means.
一方２発光ダイオードアレイ１２の上方に発光ダイオー
ドチップ１２−３〜１２−ｎからの光を線状光に集束さ
せるシリンダー型レンズ１３を設ける。On the other hand, a cylindrical lens 13 is provided above the two light emitting diode array 12 to focus the light from the light emitting diode chips 12-3 to 12-n into linear light.
このシリンダー型レンズ１３には上記発光ダイオードア
レイ１２と対向する位１４に発光ダイオードアレイ１２
を保護するための長手方向の膚１３ａが設けらＩ″Ｌ、
この溝１３ａに対応しその一側面略全域にわたる開口部
１４を形成する。この開口部１４からディスペンサー等
を用いて充ｊＩｉ剤１５を注入して溝１３ａ内に充填ｒ
る。充填剤１５さしては。This cylindrical lens 13 has a light emitting diode array 12 at a position 14 opposite to the light emitting diode array 12.
A longitudinal skin 13a is provided for protecting I″L,
An opening 14 is formed corresponding to this groove 13a and extending over substantially the entire area on one side thereof. Filler 15 is injected from this opening 14 using a dispenser or the like to fill the groove 13a.
Ru. Filler 15 especially.
例えばエポキシ系あるいはアクリル系の合成樹脂よりな
るものが用いら、ｒシる。For example, a material made of epoxy or acrylic synthetic resin may be used.
このようｌこ、充填剤１５を注入すると、充填剤１５は
比較的流動抵抗が高いため、従来の構成であれば発光ダ
イオードチップ１２−８〜１２ 周辺のｎ
空気を巻き込んで気泡を形成するおそれがあるが。When the filler 15 is injected in this way, the filler 15 has a relatively high flow resistance, so if the conventional configuration is used, there is a risk that air around the light emitting diode chips 12-8 to 12 will be drawn in and bubbles formed. Although there is.
この装置の場合には開口部１４があるので＆ 溝１３ａ
中の空気はこの開口部１４を通じて充分に排出される。In the case of this device, since there is an opening 14 & groove 13a
The air inside is sufficiently exhausted through this opening 14.
したがって、溝１３ａ内における光１！ｆ４剤１５の流
動がよく、これを均一に充填することができるとともに
、この際気泡を生じることがない。このように、従来の
ものに比べて光の伝達効率を高めることができるととも
に６歩留りを丁げることがなく製品の品質を向上させる
ことができる。Therefore, the light 1! in the groove 13a! The f4 agent 15 flows well, and can be filled uniformly without producing bubbles. In this way, the light transmission efficiency can be increased compared to the conventional one, and the quality of the product can be improved without reducing the yield.
次に第５図は、金属電極基体２１上に配設された発光ダ
イオードアレイ２２の上方にシリンダー型レンズ２３を
配設し、このシリンダー型レンズ２３に発光ダイオード
アレイ２２を保護する溝２３ａを形成するとともに、レ
ンズ２３の側ｍｌの略全域にわたり複・数個の開口部２
４−重〜２４−Ｉ＋を分散して形成し、この開口部２４
−１〜２４−３より充填剤２５をの例えば３０％以上と
なるように設定する。Next, in FIG. 5, a cylindrical lens 23 is disposed above the light emitting diode array 22 disposed on the metal electrode base 21, and a groove 23a for protecting the light emitting diode array 22 is formed in the cylindrical lens 23. At the same time, a plurality of openings 2 are formed over substantially the entire area of the side ml of the lens 23.
4-heavy to 24-I+ are dispersed and formed, and this opening 24
-1 to 24-3, the filler 25 is set to, for example, 30% or more.
したがって、このような構成によれば、充填剤２５に混
入するおそれのある空気を開口部２４．、Ｊ〜２４−Ｉ
＋より充分に排出することができるため、上述と同様の
効果を挙げることができる。Therefore, according to such a configuration, air that may be mixed into the filler 25 is removed from the opening 24. , J~24-I
Since it can be discharged more fully than +, the same effect as described above can be achieved.
なお、この発明は上記実施例に限定されるものではなく
、要旨を変更しない範囲に君いて種々変形して実施する
ことができる。Note that the present invention is not limited to the above-mentioned embodiments, and can be implemented with various modifications without changing the gist.
第１図および哨２図は従来の照明用光源装「嘆を示し第
１図は斜視図、第２図は同装祷の縦断面図、第３図およ
び第４１．９はこの発明の一実施例を示し第３図は斜視
図、第４図は同実梅例の縦断面図、第５図はこの発明の
他の実施例を示す斜視図である。
１・・・金＠成極基体 ２・・・発光ダイオードア
レイ２−１〜２．、、ｏ ・・・発光ダイオードチッ
プ３・・・シリンダー型レンズ ３ａ・・・溝４・・
・開口部 ５・・・充填剤１１・・・金属戒啄
基体
１２・・・発光ダイオードアレイ
１２−４〜１２−ｎ・・・発光ダイオードチップ１３・
・・シリンダー型レンズ １３ａ・・・溝１４・・・
開口部 １５・・・充填剤２１・・・金属成極基
体
２２・・・発光ダイオードアレイ1 and 2 show a conventional illumination light source system; FIG. 1 is a perspective view, FIG. 2 is a longitudinal sectional view of the same equipment, and FIGS. Fig. 3 is a perspective view showing an embodiment, Fig. 4 is a vertical cross-sectional view of an example of the same fruit, and Fig. 5 is a perspective view showing another embodiment of the present invention. Substrate 2...Light emitting diode array 2-1~2., o...Light emitting diode chip 3...Cylinder type lens 3a...Groove 4...
・Opening portion 5...Filler 11...Metal bullet base 12...Light emitting diode array 12-4 to 12-n...Light emitting diode chip 13.
...Cylinder type lens 13a...Groove 14...
Opening 15... Filler 21... Metal polarized base 22... Light emitting diode array
Claims (1)
ドを配列して形を戊した発光ダイオードアレイと、長手
方向の溝を有するとともに前記発光ダイオードアレイを
蔽って設けられたシリンダー型レンズと、前記レンズの
一方の側面に前記溝に対応しその長手力向略全域にわた
り形成された１個または複数個の開口部とを備え、この
開口部を通じ前記溝内に透光性の充填剤を注入されて成
ることを特徴とする照明用光源装置面。 （２） 開口部は１面積の、、＝ 跨りが溝の一側面
の面構の３０％以上であることを特徴とする特許請求の
範囲第１項記載の照明用光源装置。[Scope of Claims] fil A base body, a light-emitting diode array having a hollow shape by arranging a plurality of light-emitting diodes on the base body, and a groove having a longitudinal direction and provided to cover the light-emitting diode array. a cylindrical lens; and one or more openings formed on one side surface of the lens to correspond to the grooves and to cover substantially the entire length of the grooves, and to transmit light into the grooves through the openings. A surface of a light source device for illumination, characterized in that it is injected with a filler. (2) The illumination light source device according to claim 1, wherein the opening has one area, and the straddling is 30% or more of the surface structure of one side of the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58018309A JPS59150486A (en) | 1983-02-07 | 1983-02-07 | Light source device for illumination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58018309A JPS59150486A (en) | 1983-02-07 | 1983-02-07 | Light source device for illumination |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59150486A true JPS59150486A (en) | 1984-08-28 |
Family
ID=11968009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58018309A Pending JPS59150486A (en) | 1983-02-07 | 1983-02-07 | Light source device for illumination |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59150486A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62271765A (en) * | 1986-05-20 | 1987-11-26 | Kyocera Corp | Optical printer head |
| JPS6339962U (en) * | 1986-08-29 | 1988-03-15 | ||
| JPS63131157U (en) * | 1987-02-19 | 1988-08-26 | ||
| EP1484802A3 (en) * | 2003-06-06 | 2010-02-17 | Stanley Electric Co., Ltd. | Optical semiconductor device |
-
1983
- 1983-02-07 JP JP58018309A patent/JPS59150486A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62271765A (en) * | 1986-05-20 | 1987-11-26 | Kyocera Corp | Optical printer head |
| JPS6339962U (en) * | 1986-08-29 | 1988-03-15 | ||
| JPS63131157U (en) * | 1987-02-19 | 1988-08-26 | ||
| EP1484802A3 (en) * | 2003-06-06 | 2010-02-17 | Stanley Electric Co., Ltd. | Optical semiconductor device |
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