CA1157128A - Automatic wafer focusing and flattening system - Google Patents

Automatic wafer focusing and flattening system

Info

Publication number
CA1157128A
CA1157128A CA000373754A CA373754A CA1157128A CA 1157128 A CA1157128 A CA 1157128A CA 000373754 A CA000373754 A CA 000373754A CA 373754 A CA373754 A CA 373754A CA 1157128 A CA1157128 A CA 1157128A
Authority
CA
Canada
Prior art keywords
wafer
platen
backing plate
focal plane
actuators
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000373754A
Other languages
English (en)
French (fr)
Inventor
Fred C. Gabriel
David A. Markle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Biosystems Inc
Original Assignee
Perkin Elmer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perkin Elmer Corp filed Critical Perkin Elmer Corp
Application granted granted Critical
Publication of CA1157128A publication Critical patent/CA1157128A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CA000373754A 1980-05-02 1981-03-24 Automatic wafer focusing and flattening system Expired CA1157128A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/146,532 US4344160A (en) 1980-05-02 1980-05-02 Automatic wafer focusing and flattening system
US146,532 1980-05-02

Publications (1)

Publication Number Publication Date
CA1157128A true CA1157128A (en) 1983-11-15

Family

ID=22517814

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000373754A Expired CA1157128A (en) 1980-05-02 1981-03-24 Automatic wafer focusing and flattening system

Country Status (5)

Country Link
US (1) US4344160A (OSRAM)
EP (1) EP0039407B1 (OSRAM)
JP (1) JPS571229A (OSRAM)
CA (1) CA1157128A (OSRAM)
DE (1) DE3173046D1 (OSRAM)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58156937A (ja) * 1982-03-12 1983-09-19 Hitachi Ltd 露光装置
US4504144A (en) * 1982-07-06 1985-03-12 The Perkin-Elmer Corporation Simple electromechanical tilt and focus device
JPS5975625A (ja) * 1982-10-22 1984-04-28 Fujitsu Ltd 基板支持方法
JPS6022319A (ja) * 1983-07-18 1985-02-04 Canon Inc 半導体露光装置
US4560880A (en) * 1983-09-19 1985-12-24 Varian Associates, Inc. Apparatus for positioning a workpiece in a localized vacuum processing system
US4600282A (en) * 1983-11-14 1986-07-15 Canon Kabushiki Kaisha Alignment apparatus
US4682159A (en) * 1984-06-20 1987-07-21 Personics Corporation Apparatus and method for controlling a cursor on a computer display
JPS61259170A (ja) * 1985-05-14 1986-11-17 Olympus Optical Co Ltd 超音波顕微鏡における試料の傾き調整装置
ATE74214T1 (de) * 1985-08-13 1992-04-15 Edelhoff Polytechnik System zur bestimming der lage eines objekts relativ zu einer handhabungseinrichtung.
US4669069A (en) * 1985-10-18 1987-05-26 Cathodochromic Partners, Ltd. Dual reflected energy beam alignment system
AT391772B (de) * 1986-05-16 1990-11-26 Ims Ionen Mikrofab Syst Anordnung zum positionieren der abbildung der struktur einer maske auf ein substrat
AT393925B (de) * 1987-06-02 1992-01-10 Ims Ionen Mikrofab Syst Anordnung zur durchfuehrung eines verfahrens zum positionieren der abbildung der auf einer maske befindlichen struktur auf ein substrat, und verfahren zum ausrichten von auf einer maske angeordneten markierungen auf markierungen, die auf einem traeger angeordnet sind
AT391773B (de) * 1987-10-12 1990-11-26 Thallner Erich Vorrichtung zum exponieren eines halbleitersubstrates gegen ein strahlungsmuster
JP2536059B2 (ja) * 1988-05-19 1996-09-18 株式会社ニコン 物体の表面状態測定装置及び表面の高さ測定装置
DE3822598C2 (de) * 1988-07-04 1997-09-04 Siemens Ag Justieranordnung und Verfahren zum Justieren einer Greifvorrichtung eines Roboterarms zum Handhaben einer Halbleiterscheibe
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
AT404523B (de) * 1997-02-03 1998-12-28 Thallner Erich Verfahren zum ausrichten von insbesondere scheibenförmigen halbleitersubstraten und vorrichtung zur durchführung des verfahrens
US6205870B1 (en) 1997-10-10 2001-03-27 Applied Komatsu Technology, Inc. Automated substrate processing systems and methods
US5948986A (en) * 1997-12-26 1999-09-07 Applied Materials, Inc. Monitoring of wafer presence and position in semiconductor processing operations
US6247368B1 (en) * 1999-01-04 2001-06-19 International Business Machines Corporation CMP wet application wafer sensor
US6488565B1 (en) 2000-08-29 2002-12-03 Applied Materials, Inc. Apparatus for chemical mechanical planarization having nested load cups
US7596425B2 (en) * 2003-06-13 2009-09-29 Dainippon Screen Mfg. Co., Ltd. Substrate detecting apparatus and method, substrate transporting apparatus and method, and substrate processing apparatus and method
DE102007049103B4 (de) * 2007-10-11 2011-03-31 Vistec Semiconductor Systems Gmbh System zum Bestimmen der lagerichtigen Position einer Maske in einer Ablage einer Koordinaten-Messmaschine
JP5029786B2 (ja) * 2010-03-12 2012-09-19 パナソニック株式会社 アライメント方法およびフラットパネルディスプレイの製造方法
CN105785724B (zh) * 2016-05-20 2017-06-30 中国科学院微电子研究所 一种掩膜图形的优化方法、最佳焦平面位置测量方法及系统

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3557773A (en) * 1969-09-05 1971-01-26 Rheem Mfg Co Combustion chamber locating and securing attachment
US3729966A (en) * 1972-02-02 1973-05-01 Ibm Apparatus for contouring the surface of thin elements
FR2330030A1 (fr) * 1975-10-31 1977-05-27 Thomson Csf Nouvel appareil photorepeteur de masques de haute precision
JPS52108776A (en) * 1976-03-09 1977-09-12 Nippon Telegr & Teleph Corp <Ntt> Pattern sticking device
JPS52119927A (en) * 1976-04-02 1977-10-07 Hitachi Ltd Device for automatic focus control
US4093378A (en) * 1976-11-01 1978-06-06 International Business Machines Corporation Alignment apparatus
JPS5555529A (en) * 1978-10-20 1980-04-23 Hitachi Ltd Method of positioning wafer
US4280354A (en) * 1980-02-12 1981-07-28 Tencor Instruments Acoustic method and apparatus for measuring surfaces of wafers and similar articles
JPS56130738A (en) * 1980-03-19 1981-10-13 Hitachi Ltd Method and device for exposure

Also Published As

Publication number Publication date
EP0039407A2 (en) 1981-11-11
DE3173046D1 (en) 1986-01-09
US4344160A (en) 1982-08-10
JPH0370365B2 (OSRAM) 1991-11-07
EP0039407A3 (en) 1982-02-03
EP0039407B1 (en) 1985-11-27
JPS571229A (en) 1982-01-06

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Legal Events

Date Code Title Description
MKEX Expiry
MKEX Expiry

Effective date: 20001115