CA1143259A - Methode de nettoyage d'un reacteur - Google Patents

Methode de nettoyage d'un reacteur

Info

Publication number
CA1143259A
CA1143259A CA000360274A CA360274A CA1143259A CA 1143259 A CA1143259 A CA 1143259A CA 000360274 A CA000360274 A CA 000360274A CA 360274 A CA360274 A CA 360274A CA 1143259 A CA1143259 A CA 1143259A
Authority
CA
Canada
Prior art keywords
reactor
cleaning
hydrogen fluoride
dry hydrogen
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000360274A
Other languages
English (en)
Inventor
Everhardus P.G.T. Van De Ven
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of CA1143259A publication Critical patent/CA1143259A/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/08—Reaction chambers; Selection of materials therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Cleaning In General (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • ing And Chemical Polishing (AREA)
CA000360274A 1979-09-20 1980-09-11 Methode de nettoyage d'un reacteur Expired CA1143259A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL7906996A NL7906996A (nl) 1979-09-20 1979-09-20 Werkwijze voor het reinigen van een reaktor.
NL7906996 1979-09-20

Publications (1)

Publication Number Publication Date
CA1143259A true CA1143259A (fr) 1983-03-22

Family

ID=19833876

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000360274A Expired CA1143259A (fr) 1979-09-20 1980-09-11 Methode de nettoyage d'un reacteur

Country Status (7)

Country Link
JP (1) JPS5653740A (fr)
AU (1) AU6247480A (fr)
CA (1) CA1143259A (fr)
DE (1) DE3035379A1 (fr)
FR (1) FR2465791A1 (fr)
GB (1) GB2062689B (fr)
NL (1) NL7906996A (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4512812A (en) * 1983-09-22 1985-04-23 Varian Associates, Inc. Method for reducing phosphorous contamination in a vacuum processing chamber
US4597989A (en) * 1984-07-30 1986-07-01 Burroughs Corporation Method of depositing silicon films with reduced structural defects
US4657616A (en) * 1985-05-17 1987-04-14 Benzing Technologies, Inc. In-situ CVD chamber cleaner
GB2183204A (en) * 1985-11-22 1987-06-03 Advanced Semiconductor Mat Nitrogen trifluoride as an in-situ cleaning agent
US4786352A (en) * 1986-09-12 1988-11-22 Benzing Technologies, Inc. Apparatus for in-situ chamber cleaning
US5755886A (en) * 1986-12-19 1998-05-26 Applied Materials, Inc. Apparatus for preventing deposition gases from contacting a selected region of a substrate during deposition processing
US5000113A (en) * 1986-12-19 1991-03-19 Applied Materials, Inc. Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process
JP2708533B2 (ja) * 1989-03-14 1998-02-04 富士通株式会社 Ｃｖｄ装置の残留ガス除去方法
US5421957A (en) * 1993-07-30 1995-06-06 Applied Materials, Inc. Low temperature etching in cold-wall CVD systems
EP1083592A1 (fr) * 1999-09-10 2001-03-14 Interuniversitair Microelektronica Centrum Vzw Attaque chimique du nitrure de silicium par un gaz halogène anhydre
EP1083593A1 (fr) * 1999-09-10 2001-03-14 Interuniversitair Micro-Elektronica Centrum Vzw Attaque chimique du nitrure de silicium par un gaz halogène anhydre

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1202616B (de) * 1962-02-23 1965-10-07 Siemens Ag Verfahren zum Entfernen der bei der Epitaxie auf dem Heizer abgeschiedenen Halbleiterschicht
DE1240818B (de) * 1963-03-23 1967-05-24 Siemens Ag Verfahren zum Herstellen von hochreinem Halbleitermaterial durch Abscheidung aus derGasphase
CH433206A (de) * 1963-12-14 1967-04-15 Siemens Ag Verfahren zum Reinigen von Halterungen aus Kohlenstoff, welche zur Befestigung von aus Halbleitermaterial bestehenden Trägerstäben dienen
DE1619997A1 (de) * 1967-03-29 1970-03-26 Siemens Ag Verfahren zum serienmaessigen Herstellen von epitaktischen Schichten aus der Gasphase
US3669774A (en) * 1969-11-20 1972-06-13 Rca Corp Low temperature silicon etch
GB1539700A (en) * 1976-05-14 1979-01-31 Int Plasma Corp Process for etching sio2
US4138306A (en) * 1976-08-31 1979-02-06 Tokyo Shibaura Electric Co., Ltd. Apparatus for the treatment of semiconductors

Also Published As

Publication number Publication date
NL7906996A (nl) 1981-03-24
AU6247480A (en) 1981-04-09
DE3035379A1 (de) 1981-04-09
FR2465791B1 (fr) 1984-07-13
JPS5653740A (en) 1981-05-13
GB2062689A (en) 1981-05-28
FR2465791A1 (fr) 1981-03-27
GB2062689B (en) 1984-02-22

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