CA1110778A - Hybrid circuit having a semiconductor circuit - Google Patents

Hybrid circuit having a semiconductor circuit

Info

Publication number
CA1110778A
CA1110778A CA302,144A CA302144A CA1110778A CA 1110778 A CA1110778 A CA 1110778A CA 302144 A CA302144 A CA 302144A CA 1110778 A CA1110778 A CA 1110778A
Authority
CA
Canada
Prior art keywords
substrate
foil
spacers
semiconductor element
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA302,144A
Other languages
English (en)
French (fr)
Inventor
Gijsbertus J.H. Schermer
Hubertus H.A. Winters
Willem C. Hildering
Karl F. Nickl Von Nikelsberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of CA1110778A publication Critical patent/CA1110778A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W72/701—
    • H10W70/68—
    • H10W70/688—
    • H10W90/00—

Landscapes

  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Die Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CA302,144A 1977-05-02 1978-04-27 Hybrid circuit having a semiconductor circuit Expired CA1110778A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL7704773 1977-05-02
NL7704773A NL7704773A (nl) 1977-05-02 1977-05-02 Hybrideschakeling voorzien van een halfgeleider- schakeling.

Publications (1)

Publication Number Publication Date
CA1110778A true CA1110778A (en) 1981-10-13

Family

ID=19828470

Family Applications (1)

Application Number Title Priority Date Filing Date
CA302,144A Expired CA1110778A (en) 1977-05-02 1978-04-27 Hybrid circuit having a semiconductor circuit

Country Status (9)

Country Link
US (1) US4180828A (enExample)
JP (1) JPS593855B2 (enExample)
AU (1) AU515259B2 (enExample)
CA (1) CA1110778A (enExample)
DE (1) DE2817480C2 (enExample)
FR (1) FR2390006B1 (enExample)
GB (1) GB1553559A (enExample)
IT (1) IT1094979B (enExample)
NL (1) NL7704773A (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2435883A1 (fr) * 1978-06-29 1980-04-04 Materiel Telephonique Circuit integre hybride et son procede de fabrication
JPS5568659A (en) * 1978-11-20 1980-05-23 Hitachi Ltd Semiconductor device and manufacturing method thereof
JPS57103430A (en) * 1980-12-18 1982-06-28 Sony Corp Dpcm encoding device
DE3378870D1 (en) * 1982-09-09 1989-02-09 Siemens Ag Cooling device for a plurality of integrated components assembled as a flat structure
ATE39788T1 (de) * 1982-09-09 1989-01-15 Siemens Ag Einrichtung zum kuehlen einer mehrzahl von zu flachbaugruppen zusammengefassten integrierten bausteinen.
JPS6080357A (ja) * 1983-10-08 1985-05-08 Ricoh Co Ltd 電子回路担持装置
US4607276A (en) * 1984-03-08 1986-08-19 Olin Corporation Tape packages
GB2167228B (en) * 1984-10-11 1988-05-05 Anamartic Ltd Integrated circuit package
JPS62169434A (ja) * 1986-01-22 1987-07-25 Sharp Corp Ｌｓｉ搭載方式
DE3727389A1 (de) * 1987-08-17 1989-03-02 Heidenhain Gmbh Dr Johannes Elektrische verbindung
GB2218847B (en) * 1988-05-16 1991-04-24 Gen Electric Co Plc Carrier for semiconductor devices
DE4132947C2 (de) * 1991-10-04 1998-11-26 Export Contor Ausenhandelsgese Elektronische Schaltungsanordnung
JPH0750762B2 (ja) * 1992-12-18 1995-05-31 山一電機株式会社 Ｉｃキャリア
DE4418679A1 (de) * 1994-05-28 1995-11-30 Telefunken Microelectron Vorrichtung zur Kontaktierung zweier Schaltungsteile
US5512780A (en) * 1994-09-09 1996-04-30 Sun Microsystems, Inc. Inorganic chip-to-package interconnection circuit
DE19529237C1 (de) * 1995-08-09 1996-08-29 Semikron Elektronik Gmbh Schaltungsanordnung
US6168971B1 (en) 1998-05-05 2001-01-02 Fujitsu Limited Method of assembling thin film jumper connectors to a substrate
DE10121970B4 (de) * 2001-05-05 2004-05-27 Semikron Elektronik Gmbh Leistungshalbleitermodul in Druckkontaktierung
JP6858688B2 (ja) * 2017-10-24 2021-04-14 三菱電機株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2021484A1 (enExample) * 1968-10-24 1970-07-24 Inst Halvledarfors
US3811186A (en) * 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate
US3916435A (en) * 1974-09-09 1975-10-28 Gen Motors Corp Heat sink assembly for button diode rectifiers
US4009485A (en) * 1974-12-23 1977-02-22 General Electric Company Semiconductor pellet assembly mounted on ceramic substrate

Also Published As

Publication number Publication date
US4180828A (en) 1979-12-25
GB1553559A (en) 1979-09-26
JPS593855B2 (ja) 1984-01-26
DE2817480A1 (de) 1978-11-09
FR2390006B1 (enExample) 1985-05-17
FR2390006A1 (enExample) 1978-12-01
JPS53136481A (en) 1978-11-29
AU3556978A (en) 1979-11-01
AU515259B2 (en) 1981-03-26
IT1094979B (it) 1985-08-10
IT7822877A0 (it) 1978-04-28
NL7704773A (nl) 1978-11-06
DE2817480C2 (de) 1984-02-16

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Legal Events

Date Code Title Description
MKEX Expiry