FR2390006B1 - - Google Patents
Info
- Publication number
- FR2390006B1 FR2390006B1 FR7812641A FR7812641A FR2390006B1 FR 2390006 B1 FR2390006 B1 FR 2390006B1 FR 7812641 A FR7812641 A FR 7812641A FR 7812641 A FR7812641 A FR 7812641A FR 2390006 B1 FR2390006 B1 FR 2390006B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1027—IV
- H01L2924/10272—Silicon Carbide [SiC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7704773A NL7704773A (nl) | 1977-05-02 | 1977-05-02 | Hybrideschakeling voorzien van een halfgeleider- schakeling. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2390006A1 FR2390006A1 (fr) | 1978-12-01 |
FR2390006B1 true FR2390006B1 (fr) | 1985-05-17 |
Family
ID=19828470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7812641A Expired FR2390006B1 (fr) | 1977-05-02 | 1978-04-28 |
Country Status (9)
Country | Link |
---|---|
US (1) | US4180828A (fr) |
JP (1) | JPS593855B2 (fr) |
AU (1) | AU515259B2 (fr) |
CA (1) | CA1110778A (fr) |
DE (1) | DE2817480C2 (fr) |
FR (1) | FR2390006B1 (fr) |
GB (1) | GB1553559A (fr) |
IT (1) | IT1094979B (fr) |
NL (1) | NL7704773A (fr) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2435883A1 (fr) * | 1978-06-29 | 1980-04-04 | Materiel Telephonique | Circuit integre hybride et son procede de fabrication |
JPS5568659A (en) * | 1978-11-20 | 1980-05-23 | Hitachi Ltd | Semiconductor device and manufacturing method thereof |
JPS57103430A (en) * | 1980-12-18 | 1982-06-28 | Sony Corp | Dpcm encoding device |
EP0103067B1 (fr) * | 1982-09-09 | 1989-01-04 | Siemens Aktiengesellschaft | Dispositif de refroidissement pour une pluralité de composants intégrés, assemblés comme structure plane |
EP0103068B1 (fr) * | 1982-09-09 | 1989-01-04 | Siemens Aktiengesellschaft | Dispositif de refroidissement pour une pluralité de composants intégrés, assemblés comme structure plane |
JPS6080357A (ja) * | 1983-10-08 | 1985-05-08 | Ricoh Co Ltd | 電子回路担持装置 |
US4607276A (en) * | 1984-03-08 | 1986-08-19 | Olin Corporation | Tape packages |
GB2167228B (en) * | 1984-10-11 | 1988-05-05 | Anamartic Ltd | Integrated circuit package |
JPS62169434A (ja) * | 1986-01-22 | 1987-07-25 | Sharp Corp | Lsi搭載方式 |
DE3727389A1 (de) * | 1987-08-17 | 1989-03-02 | Heidenhain Gmbh Dr Johannes | Elektrische verbindung |
GB2218847B (en) * | 1988-05-16 | 1991-04-24 | Gen Electric Co Plc | Carrier for semiconductor devices |
DE4132947C2 (de) * | 1991-10-04 | 1998-11-26 | Export Contor Ausenhandelsgese | Elektronische Schaltungsanordnung |
JPH0750762B2 (ja) * | 1992-12-18 | 1995-05-31 | 山一電機株式会社 | Icキャリア |
DE4418679A1 (de) * | 1994-05-28 | 1995-11-30 | Telefunken Microelectron | Vorrichtung zur Kontaktierung zweier Schaltungsteile |
US5512780A (en) * | 1994-09-09 | 1996-04-30 | Sun Microsystems, Inc. | Inorganic chip-to-package interconnection circuit |
DE19529237C1 (de) * | 1995-08-09 | 1996-08-29 | Semikron Elektronik Gmbh | Schaltungsanordnung |
US6168971B1 (en) | 1998-05-05 | 2001-01-02 | Fujitsu Limited | Method of assembling thin film jumper connectors to a substrate |
DE10121970B4 (de) * | 2001-05-05 | 2004-05-27 | Semikron Elektronik Gmbh | Leistungshalbleitermodul in Druckkontaktierung |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6915992A (fr) * | 1968-10-24 | 1970-04-28 | ||
US3811186A (en) * | 1972-12-11 | 1974-05-21 | Ibm | Method of aligning and attaching circuit devices on a substrate |
US3916435A (en) * | 1974-09-09 | 1975-10-28 | Gen Motors Corp | Heat sink assembly for button diode rectifiers |
US4009485A (en) * | 1974-12-23 | 1977-02-22 | General Electric Company | Semiconductor pellet assembly mounted on ceramic substrate |
-
1977
- 1977-05-02 NL NL7704773A patent/NL7704773A/xx not_active Application Discontinuation
-
1978
- 1978-04-21 DE DE2817480A patent/DE2817480C2/de not_active Expired
- 1978-04-24 US US05/899,070 patent/US4180828A/en not_active Expired - Lifetime
- 1978-04-27 CA CA302,144A patent/CA1110778A/fr not_active Expired
- 1978-04-28 FR FR7812641A patent/FR2390006B1/fr not_active Expired
- 1978-04-28 JP JP53050200A patent/JPS593855B2/ja not_active Expired
- 1978-04-28 AU AU35569/78A patent/AU515259B2/en not_active Expired
- 1978-04-28 GB GB16953/78A patent/GB1553559A/en not_active Expired
- 1978-04-28 IT IT7822877A patent/IT1094979B/it active
Also Published As
Publication number | Publication date |
---|---|
IT7822877A0 (it) | 1978-04-28 |
NL7704773A (nl) | 1978-11-06 |
AU3556978A (en) | 1979-11-01 |
DE2817480C2 (de) | 1984-02-16 |
FR2390006A1 (fr) | 1978-12-01 |
JPS53136481A (en) | 1978-11-29 |
JPS593855B2 (ja) | 1984-01-26 |
AU515259B2 (en) | 1981-03-26 |
CA1110778A (fr) | 1981-10-13 |
US4180828A (en) | 1979-12-25 |
GB1553559A (en) | 1979-09-26 |
IT1094979B (it) | 1985-08-10 |
DE2817480A1 (de) | 1978-11-09 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |