CA1093704A - Semiconductor device and method of enveloping the semiconductor device - Google Patents

Semiconductor device and method of enveloping the semiconductor device

Info

Publication number
CA1093704A
CA1093704A CA296,495A CA296495A CA1093704A CA 1093704 A CA1093704 A CA 1093704A CA 296495 A CA296495 A CA 296495A CA 1093704 A CA1093704 A CA 1093704A
Authority
CA
Canada
Prior art keywords
mould
envelope
semiconductor device
synthetic resin
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA296,495A
Other languages
English (en)
French (fr)
Inventor
Gerard J. Scholten
Johannes Brandsma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL7701284A external-priority patent/NL7701284A/xx
Priority claimed from NL7701283A external-priority patent/NL7701283A/xx
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of CA1093704A publication Critical patent/CA1093704A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W74/121—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C45/0408—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
    • C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
    • H10W74/01—
    • H10W74/47—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C2045/0475—Injection moulding apparatus using movable moulds or mould halves continuously movable moulds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
    • C08J2381/04—Polysulfides
    • H10W72/5449—
    • H10W90/756—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Molding Of Porous Articles (AREA)
CA296,495A 1977-02-08 1978-02-08 Semiconductor device and method of enveloping the semiconductor device Expired CA1093704A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
NL7701284 1977-02-08
NL7701283 1977-02-08
NL7701284A NL7701284A (nl) 1977-02-08 1977-02-08 Halfgeleiderinrichting.
NL7701283A NL7701283A (nl) 1977-02-08 1977-02-08 Werkwijze voor het vervaardigen van geheel of ge- deeltelijk uit geschuimd thermoplastisch materiaal bestaande voorwerpen, voorwerpen vervaardigd volgens die werkwijze en inrichting voor het uitvoeren van de werkwijze.

Publications (1)

Publication Number Publication Date
CA1093704A true CA1093704A (en) 1981-01-13

Family

ID=26645284

Family Applications (1)

Application Number Title Priority Date Filing Date
CA296,495A Expired CA1093704A (en) 1977-02-08 1978-02-08 Semiconductor device and method of enveloping the semiconductor device

Country Status (12)

Country Link
JP (1) JPS53112063A (enExample)
AR (1) AR214553A1 (enExample)
AT (1) ATA87478A (enExample)
AU (1) AU513092B2 (enExample)
BR (1) BR7800732A (enExample)
CA (1) CA1093704A (enExample)
DE (1) DE2804956A1 (enExample)
ES (1) ES466679A1 (enExample)
FR (1) FR2379910A1 (enExample)
GB (1) GB1594892A (enExample)
IT (1) IT1092425B (enExample)
SE (1) SE7801325L (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5520863A (en) * 1992-09-17 1996-05-28 Mitsubishi Denki Kabushiki Kaisha Method of making IC card

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2930760A1 (de) * 1979-07-28 1981-02-12 Itt Ind Gmbh Deutsche Verfahren zum umhuellen von halbleiterbauelementen mittels spritzgiessens
DE3019239A1 (de) * 1980-05-20 1981-11-26 SIEMENS AG AAAAA, 1000 Berlin und 8000 München Umhuellung fuer halbleiterbauelement
US4460537A (en) * 1982-07-26 1984-07-17 Motorola, Inc. Slot transfer molding apparatus and methods
JPS63112923U (enExample) * 1987-01-16 1988-07-20
DE3922038A1 (de) * 1989-07-05 1991-01-17 Bayer Ag Verwendung von polyarylensulfiden zur herstellung eines hochtemperaturbestaendigen tsg schaumes, verfahren zur herstellung dieses schaumes sowie damit erhaeltliche formkoerper
US6046076A (en) * 1994-12-29 2000-04-04 Tessera, Inc. Vacuum dispense method for dispensing an encapsulant and machine therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5520863A (en) * 1992-09-17 1996-05-28 Mitsubishi Denki Kabushiki Kaisha Method of making IC card

Also Published As

Publication number Publication date
AU3303878A (en) 1979-08-16
ES466679A1 (es) 1979-07-01
JPS53112063A (en) 1978-09-30
FR2379910B1 (enExample) 1984-05-04
DE2804956A1 (de) 1978-08-10
AR214553A1 (es) 1979-06-29
BR7800732A (pt) 1978-10-10
ATA87478A (de) 1982-07-15
IT1092425B (it) 1985-07-12
JPS5722420B2 (enExample) 1982-05-13
SE7801325L (sv) 1978-08-09
IT7819995A0 (it) 1978-02-03
GB1594892A (en) 1981-08-05
FR2379910A1 (fr) 1978-09-01
AU513092B2 (en) 1980-11-13

Similar Documents

Publication Publication Date Title
CA1093704A (en) Semiconductor device and method of enveloping the semiconductor device
US5204122A (en) Mold for use in resin encapsulation molding
EP2447986B1 (en) Resin encapsulation molding method and apparatus for electrical circuit component
JPH05226396A (ja) 樹脂モールド型半導体装置の製造方法
US5723156A (en) Mold for molding a semiconductor package
JPH0976282A (ja) 電気・電子部品の樹脂封止成形方法及びそれに用いる金型
JPH05198611A (ja) 独立した封止キャビティを持つモールディング組立体
US6696006B2 (en) Mold for flashless injection molding to encapsulate an integrated circuit chip
JP2002506287A (ja) 成形型部品、成形型およびキャリア上に配設された電子部品を封止する方法
JPH02109343A (ja) 電子部品の樹脂封止成形方法及び装置
JP2598988B2 (ja) 電子部品の樹脂封止成形方法
JP2002506287A5 (enExample)
JP3795684B2 (ja) 電子部品の樹脂封止成形方法
JP2000232116A (ja) 電子部品の樹脂封止成形方法
JP3795670B2 (ja) 電子部品の樹脂封止成形方法
CN116945494A (zh) 一种芯片塑封装置用塑封料装填结构
US20030080404A1 (en) Semiconductor device and manufacturing method thereof
JP2665668B2 (ja) 電子部品の樹脂封止成形方法及びその樹脂封止成形用金型
CN117457302B (zh) 高精度电阻器、电阻器封装装置及封装工艺
CN218429577U (zh) 一种包封模具结构
EP0435091A2 (en) Isothermal injection molding process
JP2003309137A (ja) 電子部品の樹脂封止成形方法
EP4379781A1 (en) Method of manufacturing semiconductor devices and corresponding semiconductor device
IE50182B1 (en) Process of encapsulating semiconductor devices by injection moulding
JP3192957B2 (ja) 半導体封止方法

Legal Events

Date Code Title Description
MKEX Expiry