ES466679A1 - Un dispositivo semiconductor perfeccionado - Google Patents

Un dispositivo semiconductor perfeccionado

Info

Publication number
ES466679A1
ES466679A1 ES466679A ES466679A ES466679A1 ES 466679 A1 ES466679 A1 ES 466679A1 ES 466679 A ES466679 A ES 466679A ES 466679 A ES466679 A ES 466679A ES 466679 A1 ES466679 A1 ES 466679A1
Authority
ES
Spain
Prior art keywords
semiconductor element
semiconductor device
envelope
synthetic resin
perfected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES466679A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL7701284A external-priority patent/NL7701284A/xx
Priority claimed from NL7701283A external-priority patent/NL7701283A/xx
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES466679A1 publication Critical patent/ES466679A1/es
Expired legal-status Critical Current

Links

Classifications

    • H10W74/121—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C45/0408—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
    • C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
    • H10W74/01—
    • H10W74/47—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C2045/0475—Injection moulding apparatus using movable moulds or mould halves continuously movable moulds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
    • C08J2381/04—Polysulfides
    • H10W72/5449—
    • H10W90/756—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Molding Of Porous Articles (AREA)
ES466679A 1977-02-08 1978-02-06 Un dispositivo semiconductor perfeccionado Expired ES466679A1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL7701284A NL7701284A (nl) 1977-02-08 1977-02-08 Halfgeleiderinrichting.
NL7701283A NL7701283A (nl) 1977-02-08 1977-02-08 Werkwijze voor het vervaardigen van geheel of ge- deeltelijk uit geschuimd thermoplastisch materiaal bestaande voorwerpen, voorwerpen vervaardigd volgens die werkwijze en inrichting voor het uitvoeren van de werkwijze.

Publications (1)

Publication Number Publication Date
ES466679A1 true ES466679A1 (es) 1979-07-01

Family

ID=26645284

Family Applications (1)

Application Number Title Priority Date Filing Date
ES466679A Expired ES466679A1 (es) 1977-02-08 1978-02-06 Un dispositivo semiconductor perfeccionado

Country Status (12)

Country Link
JP (1) JPS53112063A (enExample)
AR (1) AR214553A1 (enExample)
AT (1) ATA87478A (enExample)
AU (1) AU513092B2 (enExample)
BR (1) BR7800732A (enExample)
CA (1) CA1093704A (enExample)
DE (1) DE2804956A1 (enExample)
ES (1) ES466679A1 (enExample)
FR (1) FR2379910A1 (enExample)
GB (1) GB1594892A (enExample)
IT (1) IT1092425B (enExample)
SE (1) SE7801325L (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2930760A1 (de) * 1979-07-28 1981-02-12 Itt Ind Gmbh Deutsche Verfahren zum umhuellen von halbleiterbauelementen mittels spritzgiessens
DE3019239A1 (de) * 1980-05-20 1981-11-26 SIEMENS AG AAAAA, 1000 Berlin und 8000 München Umhuellung fuer halbleiterbauelement
US4460537A (en) * 1982-07-26 1984-07-17 Motorola, Inc. Slot transfer molding apparatus and methods
JPS63112923U (enExample) * 1987-01-16 1988-07-20
DE3922038A1 (de) * 1989-07-05 1991-01-17 Bayer Ag Verwendung von polyarylensulfiden zur herstellung eines hochtemperaturbestaendigen tsg schaumes, verfahren zur herstellung dieses schaumes sowie damit erhaeltliche formkoerper
JP2774906B2 (ja) * 1992-09-17 1998-07-09 三菱電機株式会社 薄形半導体装置及びその製造方法
US6046076A (en) * 1994-12-29 2000-04-04 Tessera, Inc. Vacuum dispense method for dispensing an encapsulant and machine therefor

Also Published As

Publication number Publication date
AU3303878A (en) 1979-08-16
JPS53112063A (en) 1978-09-30
FR2379910B1 (enExample) 1984-05-04
DE2804956A1 (de) 1978-08-10
AR214553A1 (es) 1979-06-29
BR7800732A (pt) 1978-10-10
ATA87478A (de) 1982-07-15
CA1093704A (en) 1981-01-13
IT1092425B (it) 1985-07-12
JPS5722420B2 (enExample) 1982-05-13
SE7801325L (sv) 1978-08-09
IT7819995A0 (it) 1978-02-03
GB1594892A (en) 1981-08-05
FR2379910A1 (fr) 1978-09-01
AU513092B2 (en) 1980-11-13

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