CA1083714A - Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte - Google Patents

Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte

Info

Publication number
CA1083714A
CA1083714A CA268,082A CA268082A CA1083714A CA 1083714 A CA1083714 A CA 1083714A CA 268082 A CA268082 A CA 268082A CA 1083714 A CA1083714 A CA 1083714A
Authority
CA
Canada
Prior art keywords
card
card according
conductors
aforementioned
ribbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA268,082A
Other languages
English (en)
French (fr)
Inventor
Bernard Badet
Karel Kurzweil
Francois Guillaume
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INTERNATIONALE POUR L'INFORMATIQUE CII-HONEYWELL BULL Cie
Original Assignee
INTERNATIONALE POUR L'INFORMATIQUE CII-HONEYWELL BULL Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INTERNATIONALE POUR L'INFORMATIQUE CII-HONEYWELL BULL Cie filed Critical INTERNATIONALE POUR L'INFORMATIQUE CII-HONEYWELL BULL Cie
Application granted granted Critical
Publication of CA1083714A publication Critical patent/CA1083714A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01063—Europium [Eu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01094—Plutonium [Pu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
  • Handling Of Sheets (AREA)
  • Audible And Visible Signals (AREA)
  • Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
CA268,082A 1975-12-31 1976-12-16 Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte Expired CA1083714A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR7540361A FR2337381A1 (fr) 1975-12-31 1975-12-31 Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
FR7540361 1975-12-31

Publications (1)

Publication Number Publication Date
CA1083714A true CA1083714A (fr) 1980-08-12

Family

ID=9164418

Family Applications (1)

Application Number Title Priority Date Filing Date
CA268,082A Expired CA1083714A (fr) 1975-12-31 1976-12-16 Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte

Country Status (11)

Country Link
JP (2) JPS5283132A (enrdf_load_stackoverflow)
BR (1) BR7608831A (enrdf_load_stackoverflow)
CA (1) CA1083714A (enrdf_load_stackoverflow)
CH (1) CH619310A5 (enrdf_load_stackoverflow)
DE (1) DE2659573C2 (enrdf_load_stackoverflow)
ES (1) ES454567A1 (enrdf_load_stackoverflow)
FR (1) FR2337381A1 (enrdf_load_stackoverflow)
GB (1) GB1567784A (enrdf_load_stackoverflow)
IT (1) IT1124741B (enrdf_load_stackoverflow)
NL (1) NL190131C (enrdf_load_stackoverflow)
SE (1) SE415304B (enrdf_load_stackoverflow)

Families Citing this family (90)

* Cited by examiner, † Cited by third party
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FR2379949A1 (fr) * 1977-02-07 1978-09-01 Cii Honeywell Bull Dispositif de controle d'un contact insere entre un circuit emetteur et un circuit recepteur pour la transmission de signaux electriques
FR2415378A1 (fr) * 1978-01-24 1979-08-17 Moreno Roland Procede et dispositif pour connecter electriquement un objet amovible notamment une carte electronique portative
FR2439478A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Boitier plat pour dispositifs a circuits integres
JPS5562591A (en) * 1978-10-30 1980-05-12 Fujitsu Ltd Memory card
DE2919649A1 (de) * 1979-05-16 1980-11-20 Bbc Brown Boveri & Cie Sicherheitspapier
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DE2926867C2 (de) * 1979-07-03 1986-01-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Schaltungseinheit
FR2477303B1 (fr) * 1980-02-28 1986-09-26 Dassault Electronique Dispositif de lecture de cartes electroniques
FR2480008A1 (fr) * 1980-04-04 1981-10-09 Flonic Sa Perfectionnements aux cartes a memoire
DE3019206A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Verfahren zur kontaktierung von galvanischen kontakten einer ausweiskarte mit eingebettetem ic-baustein
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
FR2486685B1 (fr) * 1980-07-09 1985-10-31 Labo Electronique Physique Carte de paiement electronique et procede de realisation
DE3051195C2 (de) * 1980-08-05 1997-08-28 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
DE3033881A1 (de) * 1980-09-09 1982-04-15 Siemens AG, 1000 Berlin und 8000 München Gehaeuseloses schaltungsmodul und verfahren zu seiner herstellung
US4549247A (en) * 1980-11-21 1985-10-22 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for IC-modules
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DE3111516A1 (de) * 1981-03-24 1982-12-23 GAO Gesellschaft für Automation und Organisation mbH, 8000 München "ausweiskarte mit ic-baustein"
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DE3153769C2 (de) * 1981-04-14 1995-10-26 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
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DE3130324A1 (de) * 1981-07-31 1983-02-17 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
FR2511544A1 (fr) * 1981-08-14 1983-02-18 Dassault Electronique Module electronique pour carte de transactions automatiques et carte equipee d'un tel module
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DE3151408C1 (de) * 1981-12-24 1983-06-01 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit einem IC-Baustein
FR2520541A1 (fr) * 1982-01-22 1983-07-29 Flonic Sa Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede
JPS58110474U (ja) * 1982-01-22 1983-07-27 凸版印刷株式会社 カ−ド
FR2523335A1 (fr) * 1982-03-10 1983-09-16 Flonic Sa Procede pour surelever les plages de contact electrique d'une carte a memoire
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JPS58221478A (ja) * 1982-06-16 1983-12-23 Kyodo Printing Co Ltd Ｉｃカ−ド
JPS5944067U (ja) * 1982-09-16 1984-03-23 大日本印刷株式会社 Ｉｃカ−ド
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JPS5958949U (ja) * 1982-10-08 1984-04-17 凸版印刷株式会社 Ｉｃ等を内蔵するカ−ド
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FR2548857B1 (fr) * 1983-07-04 1987-11-27 Cortaillod Cables Sa Procede de fabrication en continu d'une carte imprimee
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DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
FR2554275B1 (fr) * 1983-10-26 1986-09-05 Radiotechnique Compelec Dispositif de connexion pour un semi-conducteur de puissance
JPS59108581A (ja) * 1983-11-17 1984-06-23 株式会社ソフイア カ−ド式パチンコ機
JPS59108580A (ja) * 1983-11-17 1984-06-23 株式会社ソフイア 遊技装置の遊技情報管理媒体
FR2557715B1 (fr) * 1983-12-30 1987-07-17 Bull Sa Procede et systeme pour traiter de facon confidentielle des informations stockees sur une piste d'enregistrement a lecture optique d'un support portatif
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FR2575566B1 (fr) * 1984-12-28 1990-06-22 Bull Sa Procede pour personnaliser des supports portatifs tels que des cartes
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FR2584236B1 (fr) * 1985-06-26 1988-04-29 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
FR2584862B1 (fr) * 1985-07-12 1988-05-20 Eurotechnique Sa Procede de fabrication en continu de micromodules pour cartes contenant des composants, bande continue de micromodules et micromodules realises selon un tel procede
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FR2590052B1 (fr) * 1985-11-08 1991-03-01 Eurotechnique Sa Procede de recyclage d'une carte comportant un composant, carte prevue pour etre recyclee
FR2590051B1 (fr) * 1985-11-08 1991-05-17 Eurotechnique Sa Carte comportant un composant et micromodule a contacts de flanc
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FR2599165A1 (fr) * 1986-05-21 1987-11-27 Michot Gerard Objet associe a un element electronique et procede d'obtention
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US4931623A (en) * 1987-11-14 1990-06-05 Kabushiki Kaisha Toshiba Portable storage medium
JPH01152098A (ja) * 1988-09-08 1989-06-14 Dainippon Printing Co Ltd Ｉｃカード用カード基材
DE3924439A1 (de) * 1989-07-24 1991-04-18 Edgar Schneider Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente
JP2543235B2 (ja) * 1990-06-29 1996-10-16 松下電器産業株式会社 Ｉｃカ―ドアダプタ
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FR2299724A1 (fr) * 1975-01-29 1976-08-27 Honeywell Bull Soc Ind Perfectionnements aux supports de conditionnement de micro-plaquettes de circuits integres
FR2311406A1 (fr) * 1975-05-13 1976-12-10 Honeywell Bull Soc Ind Perfectionnements aux procedes de fabrication de supports de conditionnement de micro-plaquettes de circuits integres
JPS591463B2 (ja) * 1976-07-01 1984-01-12 鐘淵化学工業株式会社 起泡性組成物

Also Published As

Publication number Publication date
JPS6130315B2 (enrdf_load_stackoverflow) 1986-07-12
FR2337381A1 (fr) 1977-07-29
JPS625894A (ja) 1987-01-12
JPS6313840B2 (enrdf_load_stackoverflow) 1988-03-28
CH619310A5 (en) 1980-09-15
BR7608831A (pt) 1977-10-25
ES454567A1 (es) 1977-12-16
NL7614637A (nl) 1977-07-04
SE415304B (sv) 1980-09-22
NL190131B (nl) 1993-06-01
IT1124741B (it) 1986-05-14
FR2337381B1 (enrdf_load_stackoverflow) 1979-07-06
GB1567784A (en) 1980-05-21
JPS5283132A (en) 1977-07-11
DE2659573A1 (de) 1977-07-14
DE2659573C2 (de) 1986-02-27
SE7614622L (sv) 1977-07-02
NL190131C (nl) 1993-11-01

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