CA1075368A - Method for mounting chip type circuit elements on a printed circuit board and apparatus for performing the same - Google Patents
Method for mounting chip type circuit elements on a printed circuit board and apparatus for performing the sameInfo
- Publication number
- CA1075368A CA1075368A CA276,147A CA276147A CA1075368A CA 1075368 A CA1075368 A CA 1075368A CA 276147 A CA276147 A CA 276147A CA 1075368 A CA1075368 A CA 1075368A
- Authority
- CA
- Canada
- Prior art keywords
- magazine
- tubular
- magazines
- circuit board
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000012790 adhesive layer Substances 0.000 claims abstract description 51
- 238000012937 correction Methods 0.000 claims description 21
- 230000006835 compression Effects 0.000 claims description 18
- 238000007906 compression Methods 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 230000000875 corresponding effect Effects 0.000 claims 31
- 235000020004 porter Nutrition 0.000 claims 1
- 230000008859 change Effects 0.000 abstract description 5
- 239000011295 pitch Substances 0.000 description 35
- 239000004020 conductor Substances 0.000 description 6
- 238000013461 design Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 208000003251 Pruritus Diseases 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 210000005239 tubule Anatomy 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- De-Stacking Of Articles (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4313376A JPS52126764A (en) | 1976-04-15 | 1976-04-15 | Device for assembling electronic device circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1075368A true CA1075368A (en) | 1980-04-08 |
Family
ID=12655337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA276,147A Expired CA1075368A (en) | 1976-04-15 | 1977-04-14 | Method for mounting chip type circuit elements on a printed circuit board and apparatus for performing the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS52126764A (en, 2012) |
| CA (1) | CA1075368A (en, 2012) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5497980U (en, 2012) * | 1977-12-22 | 1979-07-11 | ||
| JPS5830211B2 (ja) * | 1978-01-23 | 1983-06-28 | 株式会社日立製作所 | 基板供給装置 |
| JPS54113866A (en) * | 1978-02-24 | 1979-09-05 | Toko Inc | Automatic electronic component insertion system |
| JPS5722460Y2 (en, 2012) * | 1978-04-19 | 1982-05-15 | ||
| JPS54163367A (en) * | 1978-06-14 | 1979-12-25 | Sanyo Electric Co | Die bonding method of chips for hybrid integrated circuit board |
| JPS643616Y2 (en, 2012) * | 1979-08-18 | 1989-01-31 | ||
| JPS5653400U (en, 2012) * | 1979-09-29 | 1981-05-11 | ||
| JPS6144480Y2 (en, 2012) * | 1979-11-30 | 1986-12-15 | ||
| JPS58187000A (ja) * | 1982-04-26 | 1983-11-01 | 松下電器産業株式会社 | チップ形電子部品の実装方法 |
| JP2007234723A (ja) * | 2006-02-28 | 2007-09-13 | Toyota Industries Corp | 電子部品の実装方法及び電子部品の実装装置並びに半導体装置の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1746988A (en) * | 1927-04-08 | 1930-02-11 | Mcdonald Engineering Corp | Labeling machine |
| US1946878A (en) * | 1931-11-03 | 1934-02-13 | Pazziani Auguste | Process and apparatus for constructing fabric pattern cards |
| US3710479A (en) * | 1971-03-01 | 1973-01-16 | Ibm | Component insertion apparatus |
| DE2119436B2 (de) * | 1971-04-21 | 1973-11-15 | Siemens Ag, 1000 Berlin U. 8000 Muenchen | Verfahren zum Hybndieren von Dunn und Dickschichtschaltungen |
| JPS499824A (en, 2012) * | 1972-05-25 | 1974-01-28 | ||
| JPS5031006A (en, 2012) * | 1973-07-24 | 1975-03-27 |
-
1976
- 1976-04-15 JP JP4313376A patent/JPS52126764A/ja active Granted
-
1977
- 1977-04-14 CA CA276,147A patent/CA1075368A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52126764A (en) | 1977-10-24 |
| JPS5528239B2 (en, 2012) | 1980-07-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |