CA1053379A - Lead frames on plastic films - Google Patents

Lead frames on plastic films

Info

Publication number
CA1053379A
CA1053379A CA249,325A CA249325A CA1053379A CA 1053379 A CA1053379 A CA 1053379A CA 249325 A CA249325 A CA 249325A CA 1053379 A CA1053379 A CA 1053379A
Authority
CA
Canada
Prior art keywords
fingers
semiconductor device
supporting sheet
lead frame
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA249,325A
Other languages
English (en)
French (fr)
Inventor
Richard H. Zimmerman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/633,045 external-priority patent/US4048438A/en
Application filed by AMP Inc filed Critical AMP Inc
Application granted granted Critical
Publication of CA1053379A publication Critical patent/CA1053379A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
CA249,325A 1975-11-18 1976-03-31 Lead frames on plastic films Expired CA1053379A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/633,045 US4048438A (en) 1974-10-23 1975-11-18 Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips

Publications (1)

Publication Number Publication Date
CA1053379A true CA1053379A (en) 1979-04-24

Family

ID=24538059

Family Applications (1)

Application Number Title Priority Date Filing Date
CA249,325A Expired CA1053379A (en) 1975-11-18 1976-03-31 Lead frames on plastic films

Country Status (8)

Country Link
JP (1) JPS5261963A (de)
BR (1) BR7602449A (de)
CA (1) CA1053379A (de)
DE (1) DE2614930A1 (de)
ES (1) ES447245A1 (de)
FR (1) FR2332620A1 (de)
GB (1) GB1509142A (de)
IT (1) IT1059111B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2753236C2 (de) * 1977-11-29 1982-05-27 Siemens AG, 1000 Berlin und 8000 München Einbaurahmen für eine gehäuselose integrierte Halbleiterschaltungsanordnung
FR2518813A1 (fr) * 1981-12-22 1983-06-24 Socapex Support d'interconnexion d'un boitier de circuit integre sur un circuit imprime et systeme d'interconnexion utilisant un tel support
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
EP0641019A3 (de) * 1993-08-27 1995-12-20 Poly Flex Circuits Inc Flexibler, auf einem Polymer gedruckter Leiterrahmen.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7014131A (de) * 1970-09-24 1972-03-28
US3777365A (en) * 1972-03-06 1973-12-11 Honeywell Inf Systems Circuit chips having beam leads attached by film strip process
US3778686A (en) * 1972-08-18 1973-12-11 Motorola Inc Carrier for beam lead integrated circuits

Also Published As

Publication number Publication date
FR2332620B1 (de) 1982-11-12
IT1059111B (it) 1982-05-31
FR2332620A1 (fr) 1977-06-17
DE2614930A1 (de) 1977-06-02
GB1509142A (en) 1978-04-26
BR7602449A (pt) 1977-05-10
ES447245A1 (es) 1977-06-16
JPS5261963A (en) 1977-05-21

Similar Documents

Publication Publication Date Title
US4048438A (en) Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips
US6603209B1 (en) Compliant integrated circuit package
US5518964A (en) Microelectronic mounting with multiple lead deformation and bonding
US4721993A (en) Interconnect tape for use in tape automated bonding
US5768776A (en) Method for forming a controlled impedance flex circuit
US5673479A (en) Method for mounting a microelectronic circuit peripherally-leaded package including integral support member with spacer
US5477082A (en) Bi-planar multi-chip module
US5286679A (en) Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer
US4903114A (en) Resin-molded semiconductor
JPH1084057A (ja) メタルキャリヤフレームを用いたｂｇａ半導体パッケージの製造方法及びそのｂｇａ半導体パッケージ
US5923538A (en) Support member for mounting a microelectronic circuit package
US5508558A (en) High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion
US5361490A (en) Method for making tape automated bonding (TAB) semiconductor device
CA1053379A (en) Lead frames on plastic films
JP3093960B2 (ja) 半導体回路素子搭載基板フレームの製造方法
US4380566A (en) Radiation protection for integrated circuits utilizing tape automated bonding
JPH04233244A (ja) 集積回路アセンブリ
JP3235586B2 (ja) 半導体装置及び半導体装置の製造方法
JPS60120543A (ja) 半導体装置およびそれに用いるリ−ドフレ−ム
JPH02209742A (ja) テープ自動化ボンディングプロセス用の金／錫共晶ボンディング
JPS61279141A (ja) 可撓性テ−パリ−ドを有したリ−ドフレ−ムと機械的ダイ支持体の直接接続装置及び方法
JPS623978B2 (de)
JPH0236556A (ja) ピングリッドアレイおよび半導体素子塔載方法
JPS59143352A (ja) バンプ付フイルムキヤリヤとその製造方法
JP2986661B2 (ja) 半導体装置の製造方法