CA1052912A - Gang bonding interconnect tape for semiconductive devices and method of making same - Google Patents

Gang bonding interconnect tape for semiconductive devices and method of making same

Info

Publication number
CA1052912A
CA1052912A CA250,139A CA250139A CA1052912A CA 1052912 A CA1052912 A CA 1052912A CA 250139 A CA250139 A CA 250139A CA 1052912 A CA1052912 A CA 1052912A
Authority
CA
Canada
Prior art keywords
row
tape
patterns
interconnect
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA250,139A
Other languages
English (en)
French (fr)
Inventor
Carmen D. Burns
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Application granted granted Critical
Publication of CA1052912A publication Critical patent/CA1052912A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/047—Attaching leadframes to insulating supports, e.g. for tape automated bonding [TAB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
CA250,139A 1975-07-07 1976-04-13 Gang bonding interconnect tape for semiconductive devices and method of making same Expired CA1052912A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59347775A 1975-07-07 1975-07-07

Publications (1)

Publication Number Publication Date
CA1052912A true CA1052912A (en) 1979-04-17

Family

ID=24374872

Family Applications (1)

Application Number Title Priority Date Filing Date
CA250,139A Expired CA1052912A (en) 1975-07-07 1976-04-13 Gang bonding interconnect tape for semiconductive devices and method of making same

Country Status (6)

Country Link
JP (1) JPS6053463B2 (ref)
BR (1) BR7603581A (ref)
CA (1) CA1052912A (ref)
DE (1) DE2630269A1 (ref)
FR (1) FR2317853A1 (ref)
GB (1) GB1522408A (ref)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4231154A (en) * 1979-01-10 1980-11-04 International Business Machines Corporation Electronic package assembly method
GB2137805B (en) * 1982-11-19 1987-01-28 Stanley Bracey Chip carrier
US4505225A (en) * 1983-08-31 1985-03-19 National Semiconductor Corporation Self-aligning apparatus for semiconductor lead frame processing means
EP0190642B1 (en) * 1985-01-31 1992-05-06 Hitachi, Ltd. Magnetic bubble memory module
DE3686990T2 (de) * 1985-08-23 1993-04-22 Nippon Electric Co Verfahren zum herstellen einer halbleiteranordnung wobei ein filmtraegerband angewendet wird.
GB2205683B (en) * 1987-04-08 1990-08-22 Casio Computer Co Ltd An electronic apparatus and a method for manufacturing the same
KR910004797B1 (ko) * 1987-04-08 1991-07-13 가시오 게이상기 가부시기가이샤 소형 전자기기 및 그 제조방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3763404A (en) * 1968-03-01 1973-10-02 Gen Electric Semiconductor devices and manufacture thereof
US3859718A (en) * 1973-01-02 1975-01-14 Texas Instruments Inc Method and apparatus for the assembly of semiconductor devices
DE2414297C3 (de) * 1974-03-25 1980-01-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur teilautomatischen Herstellung von Zwischenträgern für Halbleiterbauelemente

Also Published As

Publication number Publication date
DE2630269A1 (de) 1977-01-27
BR7603581A (pt) 1977-06-28
FR2317853A1 (fr) 1977-02-04
FR2317853B1 (ref) 1982-03-12
GB1522408A (en) 1978-08-23
JPS5210076A (en) 1977-01-26
JPS6053463B2 (ja) 1985-11-26

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