JPS6053463B2 - 半導体装置用ギヤングボンデイング接続金属テ−プの製造方法 - Google Patents

半導体装置用ギヤングボンデイング接続金属テ−プの製造方法

Info

Publication number
JPS6053463B2
JPS6053463B2 JP51075373A JP7537376A JPS6053463B2 JP S6053463 B2 JPS6053463 B2 JP S6053463B2 JP 51075373 A JP51075373 A JP 51075373A JP 7537376 A JP7537376 A JP 7537376A JP S6053463 B2 JPS6053463 B2 JP S6053463B2
Authority
JP
Japan
Prior art keywords
tape
metal
pattern
lead
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51075373A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5210076A (en
Inventor
カーメン・デイー・バーンズ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of JPS5210076A publication Critical patent/JPS5210076A/ja
Publication of JPS6053463B2 publication Critical patent/JPS6053463B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/047—Attaching leadframes to insulating supports, e.g. for tape automated bonding [TAB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP51075373A 1975-07-07 1976-06-25 半導体装置用ギヤングボンデイング接続金属テ−プの製造方法 Expired JPS6053463B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59347775A 1975-07-07 1975-07-07
US593477 1975-07-07

Publications (2)

Publication Number Publication Date
JPS5210076A JPS5210076A (en) 1977-01-26
JPS6053463B2 true JPS6053463B2 (ja) 1985-11-26

Family

ID=24374872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51075373A Expired JPS6053463B2 (ja) 1975-07-07 1976-06-25 半導体装置用ギヤングボンデイング接続金属テ−プの製造方法

Country Status (6)

Country Link
JP (1) JPS6053463B2 (ref)
BR (1) BR7603581A (ref)
CA (1) CA1052912A (ref)
DE (1) DE2630269A1 (ref)
FR (1) FR2317853A1 (ref)
GB (1) GB1522408A (ref)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4231154A (en) * 1979-01-10 1980-11-04 International Business Machines Corporation Electronic package assembly method
GB2137805B (en) * 1982-11-19 1987-01-28 Stanley Bracey Chip carrier
US4505225A (en) * 1983-08-31 1985-03-19 National Semiconductor Corporation Self-aligning apparatus for semiconductor lead frame processing means
EP0190642B1 (en) * 1985-01-31 1992-05-06 Hitachi, Ltd. Magnetic bubble memory module
DE3686990T2 (de) * 1985-08-23 1993-04-22 Nippon Electric Co Verfahren zum herstellen einer halbleiteranordnung wobei ein filmtraegerband angewendet wird.
GB2205683B (en) * 1987-04-08 1990-08-22 Casio Computer Co Ltd An electronic apparatus and a method for manufacturing the same
KR910004797B1 (ko) * 1987-04-08 1991-07-13 가시오 게이상기 가부시기가이샤 소형 전자기기 및 그 제조방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3763404A (en) * 1968-03-01 1973-10-02 Gen Electric Semiconductor devices and manufacture thereof
US3859718A (en) * 1973-01-02 1975-01-14 Texas Instruments Inc Method and apparatus for the assembly of semiconductor devices
DE2414297C3 (de) * 1974-03-25 1980-01-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur teilautomatischen Herstellung von Zwischenträgern für Halbleiterbauelemente

Also Published As

Publication number Publication date
DE2630269A1 (de) 1977-01-27
BR7603581A (pt) 1977-06-28
CA1052912A (en) 1979-04-17
FR2317853A1 (fr) 1977-02-04
FR2317853B1 (ref) 1982-03-12
GB1522408A (en) 1978-08-23
JPS5210076A (en) 1977-01-26

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