BRPI0800886A2 - módulo de semicondutor de potência em execução de contato de pressão e processo para a produção do mesmo - Google Patents

módulo de semicondutor de potência em execução de contato de pressão e processo para a produção do mesmo

Info

Publication number
BRPI0800886A2
BRPI0800886A2 BRPI0800886-8A BRPI0800886A BRPI0800886A2 BR PI0800886 A2 BRPI0800886 A2 BR PI0800886A2 BR PI0800886 A BRPI0800886 A BR PI0800886A BR PI0800886 A2 BRPI0800886 A2 BR PI0800886A2
Authority
BR
Brazil
Prior art keywords
pressure contact
semiconductor module
producing
power semiconductor
substrates
Prior art date
Application number
BRPI0800886-8A
Other languages
English (en)
Inventor
Juergen Steger
Frank Ebersberger
Original Assignee
Semikron Elektronik Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik Gmbh & Co Kg filed Critical Semikron Elektronik Gmbh & Co Kg
Publication of BRPI0800886A2 publication Critical patent/BRPI0800886A2/pt
Publication of BRPI0800886B1 publication Critical patent/BRPI0800886B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Abstract

MóDULO DE SEMICONDUTOR DE POTENCIA EM EXECUçãO DE CONTATO DE PRESSãO E PROCESSO PARA A PRODUçãO DO MESMO. A presente invenção refere-se a um módulo de semicondutor de potência (10) em execução como contato de pressão para ser disposto em um componente de refrigeração. O módulo de semicondutor de potência (10) possui pelo menos um substrato (12) que possui vias condutoras (18) e componentes de semicondutor de potência (20). O módulo de semicondutor de potência (10) possui um corpo básico de montagem (22) em cujo lado inferior (24) está posicionado o pelo menos um substrato (12) e que possui desbastes (26) previstos para a passagem de pés de contato (28) através de vias condutoras (18) que se projetam para longe de segmentos de fita (30) com os quais são formados elementos de conexão de carga (38) do módulo de semicondutor de potência (10). O módulo de semicondutor de potência (10) possui ainda uma tampa (48) não-deformável que cobre o corpo básico de montagem (22) em todos os lados e que é conectado ao corpo básico de montagem (22) por meio de junções de engate (50). A tampa (48) possui furos de fixação (52). Pelo menos um elemento de almofada (42) é assentado de modo forçado entre a tampa (48) e os segmentos de fita (30) dos elementos de conexão de carga (38).
BRPI0800886-8A 2007-04-04 2008-04-04 Módulo de semicondutor de potência em execução de contato de pressão e processo para a produção do mesmo BRPI0800886B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007016222.9 2007-04-04
DE102007016222A DE102007016222B3 (de) 2007-04-04 2007-04-04 Leistungshalbleitermodul in Druckkontaktausführung sowie Verfahren zur Herstellung desselben

Publications (2)

Publication Number Publication Date
BRPI0800886A2 true BRPI0800886A2 (pt) 2009-11-17
BRPI0800886B1 BRPI0800886B1 (pt) 2018-08-07

Family

ID=39410259

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0800886-8A BRPI0800886B1 (pt) 2007-04-04 2008-04-04 Módulo de semicondutor de potência em execução de contato de pressão e processo para a produção do mesmo

Country Status (10)

Country Link
US (1) US8368207B2 (pt)
EP (1) EP1978557B1 (pt)
JP (1) JP5028317B2 (pt)
KR (1) KR101419059B1 (pt)
CN (1) CN101281890B (pt)
AT (1) ATE512463T1 (pt)
BR (1) BRPI0800886B1 (pt)
DE (1) DE102007016222B3 (pt)
DK (1) DK1978557T3 (pt)
ES (1) ES2368413T3 (pt)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009002993B4 (de) 2009-05-11 2012-10-04 Infineon Technologies Ag Leistungshalbleitermodul mit beabstandeten Schaltungsträgern
DE102009037257B4 (de) * 2009-08-12 2014-07-31 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Schaltungsträger und Lastanschlusselement sowie Herstellungsverfahren hierzu
DE102009028814B4 (de) * 2009-08-21 2018-04-26 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Montage eines Leistungshalbleitermoduls
DE102009029476B4 (de) 2009-09-15 2012-11-08 Lisa Dräxlmaier GmbH Elektronische Vorrichtung zum Schalten von Strömen und Herstellungsverfahren für dieselbe
DE102011004491A1 (de) * 2011-02-22 2012-08-23 Semikron Elektronik Gmbh & Co. Kg Schaltungsanordnung
US8897010B2 (en) * 2011-08-22 2014-11-25 General Electric Company High performance liquid cooled heatsink for IGBT modules
DE102013209444A1 (de) * 2013-05-22 2014-11-27 Siemens Aktiengesellschaft Leistungshalbleitermodul, Verfahren zum Betrieb eines Leistungshalbleitermoduls und Verfahren zur Herstellung eines Leistungshalbleitermoduls
US9420724B2 (en) * 2014-11-04 2016-08-16 Ge Aviation Systems Llc Power converter assembly
DE102016112777B4 (de) * 2016-07-12 2021-03-18 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung
WO2019053256A1 (en) 2017-09-15 2019-03-21 Finar Module Sagl PACKAGING METHOD AND ASSEMBLY TECHNOLOGY FOR AN ELECTRONIC DEVICE

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US3808471A (en) * 1972-10-26 1974-04-30 Borg Warner Expandible pressure mounted semiconductor assembly
US4414562A (en) * 1980-07-24 1983-11-08 Thermal Associates, Inc. Semiconductor heat sink assembly including thermally responsive means for increasing compression as the temperature of said assembly increases
US4679118A (en) * 1984-08-07 1987-07-07 Aavid Engineering, Inc. Electronic chip-carrier heat sinks
US4748495A (en) * 1985-08-08 1988-05-31 Dypax Systems Corporation High density multi-chip interconnection and cooling package
EP0476322B1 (en) * 1990-09-10 1996-04-17 Yokogawa Electric Corporation Casing assembly for electronic equipment.
JP2882143B2 (ja) * 1991-12-10 1999-04-12 富士電機株式会社 半導体装置の内部配線構造
WO1993023825A1 (en) * 1992-05-20 1993-11-25 Seiko Epson Corporation Cartridge for electronic apparatus
US5479319A (en) * 1992-12-30 1995-12-26 Interconnect Systems, Inc. Multi-level assemblies for interconnecting integrated circuits
US5397245A (en) * 1993-10-29 1995-03-14 Texas Instruments Incorporated Non-destructive interconnect system for semiconductor devices
US5468157A (en) * 1993-10-29 1995-11-21 Texas Instruments Incorporated Non-destructive interconnect system for semiconductor devices
JP3316714B2 (ja) * 1994-05-31 2002-08-19 三菱電機株式会社 半導体装置
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US6401807B1 (en) * 1997-04-03 2002-06-11 Silent Systems, Inc. Folded fin heat sink and fan attachment
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DE10231219C1 (de) * 2002-07-11 2003-05-22 Semikron Elektronik Gmbh Druckkontaktiertes Halbleiterrelais
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JP4278680B2 (ja) * 2006-12-27 2009-06-17 三菱電機株式会社 電子制御装置
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Also Published As

Publication number Publication date
DK1978557T3 (da) 2011-09-12
JP2008258626A (ja) 2008-10-23
CN101281890A (zh) 2008-10-08
CN101281890B (zh) 2011-08-03
EP1978557A3 (de) 2010-11-17
KR20080090301A (ko) 2008-10-08
ES2368413T3 (es) 2011-11-17
JP5028317B2 (ja) 2012-09-19
EP1978557A2 (de) 2008-10-08
US20080266812A1 (en) 2008-10-30
ATE512463T1 (de) 2011-06-15
DE102007016222B3 (de) 2008-11-06
US8368207B2 (en) 2013-02-05
KR101419059B1 (ko) 2014-08-13
BRPI0800886B1 (pt) 2018-08-07
EP1978557B1 (de) 2011-06-08

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Legal Events

Date Code Title Description
B03A Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]
B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 13A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2622 DE 06-04-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.