WO2008153178A1 - 半導体レーザ用エージングボード - Google Patents

半導体レーザ用エージングボード Download PDF

Info

Publication number
WO2008153178A1
WO2008153178A1 PCT/JP2008/060976 JP2008060976W WO2008153178A1 WO 2008153178 A1 WO2008153178 A1 WO 2008153178A1 JP 2008060976 W JP2008060976 W JP 2008060976W WO 2008153178 A1 WO2008153178 A1 WO 2008153178A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor laser
aging board
high accuracy
simple structure
laser element
Prior art date
Application number
PCT/JP2008/060976
Other languages
English (en)
French (fr)
Inventor
Nobuaki Kishi
Nobuhisa Arai
Ichirou Matsuo
Original Assignee
Chichibu Fuji Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chichibu Fuji Co., Ltd. filed Critical Chichibu Fuji Co., Ltd.
Priority to JP2009519331A priority Critical patent/JP5292290B2/ja
Publication of WO2008153178A1 publication Critical patent/WO2008153178A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/0014—Measuring characteristics or properties thereof
    • H01S5/0021—Degradation or life time measurements

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

　放熱板に対するＣＡＮ型パッケージ（半導体レーザ素子）の接触、ソケットに対する電気的導通などを、簡素な構造で精度良くなすことができるエージングボードを提供する。 　押え部材７がＣＡＮ型パッケージ１００を押圧する弾性押圧面部１０を備えるので、スプリングや取付ネジ、ゴム製ワッシャなどの別部材が不要となり、簡素な構造で精度良く半導体レーザ素子１００を固定することができる。
PCT/JP2008/060976 2007-06-14 2008-06-16 半導体レーザ用エージングボード WO2008153178A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009519331A JP5292290B2 (ja) 2007-06-14 2008-06-16 半導体レーザ用エージングボード

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007157447 2007-06-14
JP2007-157447 2007-06-14
JP2008-062730 2008-03-12
JP2008062730 2008-03-12

Publications (1)

Publication Number Publication Date
WO2008153178A1 true WO2008153178A1 (ja) 2008-12-18

Family

ID=40129779

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060976 WO2008153178A1 (ja) 2007-06-14 2008-06-16 半導体レーザ用エージングボード

Country Status (2)

Country Link
JP (1) JP5292290B2 (ja)
WO (1) WO2008153178A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010122181A (ja) * 2008-11-21 2010-06-03 Daitron Technology Co Ltd 押さえ板及びそれを用いた検査装置
JP2011253967A (ja) * 2010-06-02 2011-12-15 Chichibu Fuji Co Ltd 半導体レーザ素子用エージングボード
JP2011253966A (ja) * 2010-06-02 2011-12-15 Chichibu Fuji Co Ltd 半導体レーザ素子用エージングボード
JP2012156233A (ja) * 2011-01-25 2012-08-16 Seiko Epson Corp 光源装置及びプロジェクター
US8811439B2 (en) 2009-11-23 2014-08-19 Seminex Corporation Semiconductor laser assembly and packaging system
CN111757586A (zh) * 2019-03-28 2020-10-09 松下知识产权经营株式会社 布线基板及其制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6413169U (ja) * 1987-07-14 1989-01-24
JPH01124580U (ja) * 1988-02-17 1989-08-24

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6413169U (ja) * 1987-07-14 1989-01-24
JPH01124580U (ja) * 1988-02-17 1989-08-24

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010122181A (ja) * 2008-11-21 2010-06-03 Daitron Technology Co Ltd 押さえ板及びそれを用いた検査装置
US8811439B2 (en) 2009-11-23 2014-08-19 Seminex Corporation Semiconductor laser assembly and packaging system
US9537284B2 (en) 2009-11-23 2017-01-03 Seminex Corporation Semiconductor laser assembly and packaging system
US10686293B2 (en) 2009-11-23 2020-06-16 Seminex Corporation Semiconductor laser assembly and packaging system
JP2011253967A (ja) * 2010-06-02 2011-12-15 Chichibu Fuji Co Ltd 半導体レーザ素子用エージングボード
JP2011253966A (ja) * 2010-06-02 2011-12-15 Chichibu Fuji Co Ltd 半導体レーザ素子用エージングボード
JP2012156233A (ja) * 2011-01-25 2012-08-16 Seiko Epson Corp 光源装置及びプロジェクター
CN111757586A (zh) * 2019-03-28 2020-10-09 松下知识产权经营株式会社 布线基板及其制造方法
CN111757586B (zh) * 2019-03-28 2023-09-26 松下知识产权经营株式会社 布线基板及其制造方法

Also Published As

Publication number Publication date
JPWO2008153178A1 (ja) 2010-08-26
JP5292290B2 (ja) 2013-09-18

Similar Documents

Publication Publication Date Title
WO2008153178A1 (ja) 半導体レーザ用エージングボード
WO2006129291A3 (en) Led assembly and module
WO2010025694A3 (de) Optoelektronisches bauteil
WO2009028283A1 (ja) 半導体歪みセンサー
WO2013009049A3 (en) Lighting device
WO2008099554A1 (ja) 半導体パッケージの実装構造
WO2009142675A3 (en) Solid state lighting component
ATE532400T1 (de) Wärmeleitendes montageelement zur anbringung einer bestückten leiterplatte an einem kühlkörper
WO2009143796A3 (de) Optoelektronisches halbleiterbauteil und leiterplatte
EP2397752A3 (en) Light emitting device and illumination apparatus
ATE430987T1 (de) Leistungshalbleitermodul mit kontaktfedern
WO2012135877A3 (de) Vorrichtung zum befestigen und kontaktieren eines leuchtmittels und/oder eines leuchtmoduls, sowie leuchte
WO2009074264A3 (en) Solder connection element
WO2011003997A9 (en) Thermally mounting electronics to a photovoltaic panel
EP2194769A3 (de) Leistungshalbleitermodul mit vorgespannter Hilfskontaktfeder
GB2465660B (en) A parallel optical transceiver module
EP2688080A3 (en) Electronic switching module for a power tool
BRPI0800886A2 (pt) módulo de semicondutor de potência em execução de contato de pressão e processo para a produção do mesmo
WO2010054841A3 (de) Photovoltaik-komponenten
WO2012091364A3 (ko) Ｌｅｄ 조명장치 및 그 제조방법
WO2005106954A3 (de) Leistungshalbleiterschaltung und verfahren zum herstellen einer leistungshalbleiterschaltung
WO2009025462A3 (en) Light emitting device
EP2246908A4 (en) LIGHT EMITTING ELEMENT
WO2008090833A1 (ja) 光電変換接続装置
WO2009051679A3 (en) Process for placing, securing and interconnecting electronic components

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08765659

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009519331

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08765659

Country of ref document: EP

Kind code of ref document: A1