WO2008153178A1 - 半導体レーザ用エージングボード - Google Patents
半導体レーザ用エージングボード Download PDFInfo
- Publication number
- WO2008153178A1 WO2008153178A1 PCT/JP2008/060976 JP2008060976W WO2008153178A1 WO 2008153178 A1 WO2008153178 A1 WO 2008153178A1 JP 2008060976 W JP2008060976 W JP 2008060976W WO 2008153178 A1 WO2008153178 A1 WO 2008153178A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor laser
- aging board
- high accuracy
- simple structure
- laser element
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/0014—Measuring characteristics or properties thereof
- H01S5/0021—Degradation or life time measurements
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
放熱板に対するCAN型パッケージ(半導体レーザ素子)の接触、ソケットに対する電気的導通などを、簡素な構造で精度良くなすことができるエージングボードを提供する。 押え部材7がCAN型パッケージ100を押圧する弾性押圧面部10を備えるので、スプリングや取付ネジ、ゴム製ワッシャなどの別部材が不要となり、簡素な構造で精度良く半導体レーザ素子100を固定することができる。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009519331A JP5292290B2 (ja) | 2007-06-14 | 2008-06-16 | 半導体レーザ用エージングボード |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007157447 | 2007-06-14 | ||
JP2007-157447 | 2007-06-14 | ||
JP2008-062730 | 2008-03-12 | ||
JP2008062730 | 2008-03-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008153178A1 true WO2008153178A1 (ja) | 2008-12-18 |
Family
ID=40129779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/060976 WO2008153178A1 (ja) | 2007-06-14 | 2008-06-16 | 半導体レーザ用エージングボード |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5292290B2 (ja) |
WO (1) | WO2008153178A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010122181A (ja) * | 2008-11-21 | 2010-06-03 | Daitron Technology Co Ltd | 押さえ板及びそれを用いた検査装置 |
JP2011253967A (ja) * | 2010-06-02 | 2011-12-15 | Chichibu Fuji Co Ltd | 半導体レーザ素子用エージングボード |
JP2011253966A (ja) * | 2010-06-02 | 2011-12-15 | Chichibu Fuji Co Ltd | 半導体レーザ素子用エージングボード |
JP2012156233A (ja) * | 2011-01-25 | 2012-08-16 | Seiko Epson Corp | 光源装置及びプロジェクター |
US8811439B2 (en) | 2009-11-23 | 2014-08-19 | Seminex Corporation | Semiconductor laser assembly and packaging system |
CN111757586A (zh) * | 2019-03-28 | 2020-10-09 | 松下知识产权经营株式会社 | 布线基板及其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6413169U (ja) * | 1987-07-14 | 1989-01-24 | ||
JPH01124580U (ja) * | 1988-02-17 | 1989-08-24 |
-
2008
- 2008-06-16 JP JP2009519331A patent/JP5292290B2/ja active Active
- 2008-06-16 WO PCT/JP2008/060976 patent/WO2008153178A1/ja active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6413169U (ja) * | 1987-07-14 | 1989-01-24 | ||
JPH01124580U (ja) * | 1988-02-17 | 1989-08-24 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010122181A (ja) * | 2008-11-21 | 2010-06-03 | Daitron Technology Co Ltd | 押さえ板及びそれを用いた検査装置 |
US8811439B2 (en) | 2009-11-23 | 2014-08-19 | Seminex Corporation | Semiconductor laser assembly and packaging system |
US9537284B2 (en) | 2009-11-23 | 2017-01-03 | Seminex Corporation | Semiconductor laser assembly and packaging system |
US10686293B2 (en) | 2009-11-23 | 2020-06-16 | Seminex Corporation | Semiconductor laser assembly and packaging system |
JP2011253967A (ja) * | 2010-06-02 | 2011-12-15 | Chichibu Fuji Co Ltd | 半導体レーザ素子用エージングボード |
JP2011253966A (ja) * | 2010-06-02 | 2011-12-15 | Chichibu Fuji Co Ltd | 半導体レーザ素子用エージングボード |
JP2012156233A (ja) * | 2011-01-25 | 2012-08-16 | Seiko Epson Corp | 光源装置及びプロジェクター |
CN111757586A (zh) * | 2019-03-28 | 2020-10-09 | 松下知识产权经营株式会社 | 布线基板及其制造方法 |
CN111757586B (zh) * | 2019-03-28 | 2023-09-26 | 松下知识产权经营株式会社 | 布线基板及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008153178A1 (ja) | 2010-08-26 |
JP5292290B2 (ja) | 2013-09-18 |
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