BR9806147A - Dispositivo, abrangendo um substrato-suporte para componentes de potência e um dissipador térmico, assim como um processo para a fabricação dos mesmos. - Google Patents

Dispositivo, abrangendo um substrato-suporte para componentes de potência e um dissipador térmico, assim como um processo para a fabricação dos mesmos.

Info

Publication number
BR9806147A
BR9806147A BR9806147-0A BR9806147A BR9806147A BR 9806147 A BR9806147 A BR 9806147A BR 9806147 A BR9806147 A BR 9806147A BR 9806147 A BR9806147 A BR 9806147A
Authority
BR
Brazil
Prior art keywords
heat sink
support substrate
conductive
manufacture
well
Prior art date
Application number
BR9806147-0A
Other languages
English (en)
Other versions
BR9806147B1 (pt
Inventor
Bernd Weber
Dietmar Hofsaess
Werner Butschkau
Thomas Dittrich
Peter Schiefer
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of BR9806147A publication Critical patent/BR9806147A/pt
Publication of BR9806147B1 publication Critical patent/BR9806147B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Patente de Invenção: <B>"DISPOSITIVO, ABRANGENDO UM SUBSTRATO SUPORTE PARA COMPONENTES DE POTêNCIA E UM DISSIPADOR TéRMICO, ASSIM COMO UM PROCESSO PARA A FABRICAçãO DOS MESMOS"<D>. Dispositivo que abrange um substrato-suporte e um dissipador térmico, onde o substrato-suporte é provido, em um primeiro lado, com pelo menos um componente de potência disposto em uma trilha condutora de grande superfície e, em um segundo lado confrontante com o componente de potência, com uma segunda trilha condutora de grande superfície que está ligada com a primeira trilha condutora através de contactações diretas condutoras térmicas, onde o substrato-suporte é aplicado, com o segundo lado, sobre o dissipador térmico de forma condutora de calor a fim de realizar um bom acoplamento térmico do substrato-suporte com o dissipador térmico e simutaneamente impedir um contato elétrico indesejável entre trilhas condutoras de potencial e o dissipador térmico, sendo proposto aplicar o substrato-suporte, com elementos espaçadores dispostos no segundo lado, sobre o dissipador térmico e manter o mesmo com um afastamento definido com relacão ao dissipador termico, sendo que a fenda formada pelo afastamento entre o substrato-suporte e o dissipador térmico é preenchida com um material de enchimento condutor térmico.
BRPI9806147-0A 1997-08-25 1998-06-12 disposição, sobretudo para o emprego em um equipamento de comando eletrÈnico, abrangendo uma placa de circuito impresso e um dissipador térmico e processo para a fabricação de uma disposição. BR9806147B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19736962A DE19736962B4 (de) 1997-08-25 1997-08-25 Anordnung, umfassend ein Trägersubstrat für Leistungsbauelemente und einen Kühlkörper sowie Verfahren zur Herstellung derselben
PCT/DE1998/001609 WO1999011107A1 (de) 1997-08-25 1998-06-12 Anordnung, umfassend ein trägersubstrat für leistungsbauelemente und einen kühlkörper sowie verfahren zur herstellung derselben

Publications (2)

Publication Number Publication Date
BR9806147A true BR9806147A (pt) 1999-10-26
BR9806147B1 BR9806147B1 (pt) 2011-10-04

Family

ID=7840102

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI9806147-0A BR9806147B1 (pt) 1997-08-25 1998-06-12 disposição, sobretudo para o emprego em um equipamento de comando eletrÈnico, abrangendo uma placa de circuito impresso e um dissipador térmico e processo para a fabricação de uma disposição.

Country Status (11)

Country Link
US (1) US6226183B1 (pt)
EP (1) EP0934687B1 (pt)
JP (1) JP3897824B2 (pt)
KR (1) KR100503399B1 (pt)
CN (1) CN1134063C (pt)
AU (1) AU727105B2 (pt)
BR (1) BR9806147B1 (pt)
DE (2) DE19736962B4 (pt)
RU (1) RU2201659C2 (pt)
TW (1) TW396560B (pt)
WO (1) WO1999011107A1 (pt)

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Also Published As

Publication number Publication date
WO1999011107A1 (de) 1999-03-04
AU727105B2 (en) 2000-11-30
DE19736962B4 (de) 2009-08-06
AU8531498A (en) 1999-03-16
EP0934687A1 (de) 1999-08-11
JP2001505000A (ja) 2001-04-10
CN1237325A (zh) 1999-12-01
EP0934687B1 (de) 2003-11-05
TW396560B (en) 2000-07-01
US6226183B1 (en) 2001-05-01
BR9806147B1 (pt) 2011-10-04
DE19736962A1 (de) 1999-03-04
DE59810084D1 (de) 2003-12-11
KR100503399B1 (ko) 2005-07-26
RU2201659C2 (ru) 2003-03-27
KR20000068821A (ko) 2000-11-25
CN1134063C (zh) 2004-01-07
JP3897824B2 (ja) 2007-03-28

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Legal Events

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B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 04/10/2011, OBSERVADAS AS CONDICOES LEGAIS.

B21A Patent or certificate of addition expired [chapter 21.1 patent gazette]

Free format text: PATENTE EXTINTA EM 04.10.2021