JP2001505000A - 電力構造部品のための支持体基板と冷却部材を含む装置及びその製造方法 - Google Patents
電力構造部品のための支持体基板と冷却部材を含む装置及びその製造方法Info
- Publication number
- JP2001505000A JP2001505000A JP51374299A JP51374299A JP2001505000A JP 2001505000 A JP2001505000 A JP 2001505000A JP 51374299 A JP51374299 A JP 51374299A JP 51374299 A JP51374299 A JP 51374299A JP 2001505000 A JP2001505000 A JP 2001505000A
- Authority
- JP
- Japan
- Prior art keywords
- support substrate
- cooling member
- conductor
- solder
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.支持体基板(2)が、第1の側(8)に、大きな面積の第1の導体路(10 )上に配置された少なくとも1つの電力構造部品(3)を備え、かつ電力構造部 品(3)に対向する第2の側(9)に、大きな面積の第2の導体路(11)を備 え、その際、大きな面積の第1の導体路(10)及び大きな面積の第2の導体路 (11)が、少なくとも1つのスルー接触部(4)を介して互いに熱伝導するよ うに結合されており、かつその際、支持体基板(1)が、第2の側(9)によっ て冷却部材(1)上に熱伝導するように取付けられている、支持体基板(2)と 冷却部材(1)を含む、とくに電子制御装置に使用する装置において、支持体基 板(2)が、支持体基板(2)の第2の側(9)に配置されたスペーサ部材(1 7,18)を用いて、冷却部材(1)上に配置されており、かつ冷却部材(1) に対して決められた間隔に保持され、その際、支持体基板(2)と冷却部材(1 )との間に間隔によって形成されたギャップが、熱伝導する充填材料(7)によ って満たされていることを特徴とする、支持体基板(2)と冷却部材(1)を含 む、とくに電子制御装置に使用する装置。 2.スペーサ部材として導体扁平片(17)が設けら れており、これらの導体扁平片が、支持体基板(2)の第2の側(9)に配置さ れており、かつ決められた量のはんだ(18)によって覆われていることを特徴 とする、請求項1に記載の装置。 3.支持体基板(2)の第2の側(9)が、少なくとも導体扁平片(17)を切 り欠いたはんだ停止ラッカー(15)によって覆われていることを特徴とする、 請求項2に記載の装置。 4.電力構造部品(3)及び冷却部材(1)が、同じ電位にあり、かつ導体扁平 片(17)が、大きな面積の第2の導体路(11)に統合されていることを特徴 とする(図3)、請求項3に記載の装置。 5.熱伝導充填材料(7)が、硬化可能な熱伝導接着剤又は両面接着熱伝導フィ ルムであることを特徴とする、請求項1に記載の装置。 6.はんだ(18)によって覆われた導体扁平片(17)と冷却部材(1)との 間の接触が、同時に冷却部材への支持体基板(2)のアース端子として使われる ことを特徴とする、請求項2に記載の装置。 7.支持体基板(2)が、第1の側(8)に、大きな面積の第1の導体路(10 )上に配置された少なくとも1つの電力構造部品(3)を備え、かつ電力構造部 品(3)に対向する第2の側(9)に、大きな面積の第2の導体路(11)を備 え、その際、大きな面積の第1の導体路(10)及び大きな面積の第 2の導体路(11)を、少なくとも1つのスルー接触部(4)を介して互いに熱 伝導するように結合し、かつ支持体基板(2)の第2の側(9)を冷却部材(1 )に熱伝導するように結合する、支持体基板(2)と冷却部材(1)からなる装 置の製造方法において、 ・支持体基板の第2の側(9)に導体扁平片(17)を用意し、 ・支持体基板(2)の第2の側(9)に少なくとも導体扁平片(17)を切り欠 いたはんだ停止ラッカー(15)を取付け、 ・決められた量のはんだ(18)によって導体扁平片(17)を覆い、かつ取付 けられたはんだ量によって決められた高さを有するスペーサ部材(17,18) を製造し、 ・冷却部材(1)上にスペーサ部材(17,18)を用いて支持体基板(2)を 配置し、その際、支持体基板(2)の第2の側(9)と冷却部材(1)との間に 熱伝導する充填材料(7)を挿入する 工程を有することを特徴とする、支持体基板(2)と冷却部材(1)からなる装 置の製造方法。 8.はんだペーストプリント位置に、導体扁平片(17)上に、はんだ(18) をプリントし、かつリフローはんだ付け位置に支持体基板(2)のそれに続くリ フローはんだ付けによってスペーサ部材(17 ,18)を製造することを特徴とする、請求項7に記載の方法。 9.熱伝導充填材料(7)としてまず熱伝導する硬化可能な接着剤又は両面接着 熱伝導フィルムを、冷却部材(1)上に取付け、かつ続いて支持体基板(2)を 、スペーサ部材(17,18)が接着剤(7)内に押込まれるように、接着剤( 7)によって覆われた冷却部材上に配置し、その際、そのはんだ層(18)を冷 却部材(1)に接触させることができることを特徴とする、請求項7に記載の方 法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19736962A DE19736962B4 (de) | 1997-08-25 | 1997-08-25 | Anordnung, umfassend ein Trägersubstrat für Leistungsbauelemente und einen Kühlkörper sowie Verfahren zur Herstellung derselben |
DE19736962.6 | 1997-08-25 | ||
PCT/DE1998/001609 WO1999011107A1 (de) | 1997-08-25 | 1998-06-12 | Anordnung, umfassend ein trägersubstrat für leistungsbauelemente und einen kühlkörper sowie verfahren zur herstellung derselben |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2001505000A true JP2001505000A (ja) | 2001-04-10 |
JP2001505000A5 JP2001505000A5 (ja) | 2006-01-05 |
JP3897824B2 JP3897824B2 (ja) | 2007-03-28 |
Family
ID=7840102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51374299A Expired - Lifetime JP3897824B2 (ja) | 1997-08-25 | 1998-06-12 | 電力構造部品のための支持体基板と冷却部材を含む装置及びその製造方法 |
Country Status (11)
Country | Link |
---|---|
US (1) | US6226183B1 (ja) |
EP (1) | EP0934687B1 (ja) |
JP (1) | JP3897824B2 (ja) |
KR (1) | KR100503399B1 (ja) |
CN (1) | CN1134063C (ja) |
AU (1) | AU727105B2 (ja) |
BR (1) | BR9806147B1 (ja) |
DE (2) | DE19736962B4 (ja) |
RU (1) | RU2201659C2 (ja) |
TW (1) | TW396560B (ja) |
WO (1) | WO1999011107A1 (ja) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6191477B1 (en) * | 1999-02-17 | 2001-02-20 | Conexant Systems, Inc. | Leadless chip carrier design and structure |
DE19919781A1 (de) * | 1999-04-30 | 2000-11-09 | Wuerth Elektronik Gmbh | Leiterplatte und Verfahren zu ihrer Anbringung |
FI117717B (fi) * | 1999-07-09 | 2007-01-31 | Ciba Sc Holding Ag | Pintaliimakoostumus |
JP3923703B2 (ja) * | 2000-03-29 | 2007-06-06 | ローム株式会社 | 放熱手段を有するプリント配線板 |
DE10033352B4 (de) * | 2000-07-08 | 2010-08-19 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektronischen Baugruppe und elektronische Baugruppe |
US6477054B1 (en) * | 2000-08-10 | 2002-11-05 | Tektronix, Inc. | Low temperature co-fired ceramic substrate structure having a capacitor and thermally conductive via |
US6960824B1 (en) | 2000-11-15 | 2005-11-01 | Skyworks Solutions, Inc. | Structure and method for fabrication of a leadless chip carrier |
US6710433B2 (en) | 2000-11-15 | 2004-03-23 | Skyworks Solutions, Inc. | Leadless chip carrier with embedded inductor |
US6611055B1 (en) | 2000-11-15 | 2003-08-26 | Skyworks Solutions, Inc. | Leadless flip chip carrier design and structure |
US6582979B2 (en) | 2000-11-15 | 2003-06-24 | Skyworks Solutions, Inc. | Structure and method for fabrication of a leadless chip carrier with embedded antenna |
US6867493B2 (en) * | 2000-11-15 | 2005-03-15 | Skyworks Solutions, Inc. | Structure and method for fabrication of a leadless multi-die carrier |
DE10102353B4 (de) * | 2001-01-19 | 2007-11-15 | Siemens Ag | LED-Signalmodul |
US6414847B1 (en) * | 2001-04-09 | 2002-07-02 | Agilent Technologies, Inc. | Integral dielectric heatspreader |
DE10200066A1 (de) * | 2002-01-03 | 2003-07-17 | Siemens Ag | Leistungselektronikeinheit |
JP2003289191A (ja) * | 2002-03-28 | 2003-10-10 | Denso Corp | 電子制御装置 |
DE10214363A1 (de) * | 2002-03-30 | 2003-10-16 | Bosch Gmbh Robert | Kühlanordnung und Elektrogerät mit einer Kühlanordnung |
US20050284607A1 (en) * | 2002-06-27 | 2005-12-29 | Eastman Kodak Company | Cooling-assisted, heat-generating electrical component and method of manufacturing same |
US6671176B1 (en) * | 2002-06-27 | 2003-12-30 | Eastman Kodak Company | Method of cooling heat-generating electrical components |
DE10343429B4 (de) * | 2002-10-14 | 2007-08-16 | Heidelberger Druckmaschinen Ag | Anordnung zum Kühlen eines auf einer Leiterplatte angeordneten elektrischen Bauelementes |
JP3748253B2 (ja) | 2002-11-14 | 2006-02-22 | 三菱電機株式会社 | 車載電子機器の筐体構造 |
KR100488518B1 (ko) * | 2002-11-14 | 2005-05-11 | 삼성전자주식회사 | 반도체 장치의 방열 시스템 |
US6882537B2 (en) * | 2002-12-23 | 2005-04-19 | Eastman Kodak Company | Electrical assemblage and method for removing heat locally generated therefrom |
TW559461U (en) * | 2003-01-20 | 2003-10-21 | Power Mate Technology Corp | Heat conducting structure for circuit board |
DE20301773U1 (de) * | 2003-02-05 | 2003-04-17 | Kostal Leopold Gmbh & Co Kg | Elektrische Einrichtung |
JP2007516592A (ja) * | 2003-06-30 | 2007-06-21 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 発光ダイオード熱管理システム |
SE529673C2 (sv) * | 2004-09-20 | 2007-10-16 | Danaher Motion Stockholm Ab | Kretsarrangemang för kylning av ytmonterade halvledare |
US7269017B2 (en) * | 2004-11-19 | 2007-09-11 | Delphi Technologies, Inc. | Thermal management of surface-mount circuit devices on laminate ceramic substrate |
US20060256533A1 (en) * | 2005-05-13 | 2006-11-16 | Lear Corporation | Thermally dissipating and power dispersing adhesively bonded metal-printed circuit board structure |
KR20080011392A (ko) * | 2005-05-19 | 2008-02-04 | 파커-한니핀 코포레이션 | 써멀 라미네이션 모듈 |
US7176707B1 (en) | 2006-02-23 | 2007-02-13 | Lockheed Martin Corporation | Back side component placement and bonding |
JP5142119B2 (ja) * | 2006-09-20 | 2013-02-13 | 住友電装株式会社 | 放熱構造を備えたプリント基板の製造方法および該方法で製造されたプリント基板の放熱構造 |
KR101340512B1 (ko) * | 2006-12-01 | 2013-12-12 | 삼성디스플레이 주식회사 | 반도체 칩 패키지 및 이를 포함하는 인쇄 회로 기판어셈블리 |
JP4962228B2 (ja) * | 2006-12-26 | 2012-06-27 | 株式会社ジェイテクト | 多層回路基板およびモータ駆動回路基板 |
US20080218979A1 (en) * | 2007-03-08 | 2008-09-11 | Jong-Ho Park | Printed circuit (PC) board module with improved heat radiation efficiency |
DE102007025958B4 (de) * | 2007-06-04 | 2019-03-21 | Robert Bosch Gmbh | Baugruppe mit geklebtem Leistungsbaustein und Verfahren zur Herstellung einer solchen Baugruppe |
KR100896883B1 (ko) * | 2007-08-16 | 2009-05-14 | 주식회사 동부하이텍 | 반도체칩, 이의 제조방법 및 이를 가지는 적층 패키지 |
JP4489112B2 (ja) | 2007-11-16 | 2010-06-23 | 三菱電機株式会社 | 電子基板の取付構造 |
JP5236377B2 (ja) * | 2008-07-16 | 2013-07-17 | シャープ株式会社 | 半導体装置および表示装置 |
JP2010245174A (ja) * | 2009-04-02 | 2010-10-28 | Denso Corp | 電子制御ユニット及びその製造方法 |
US9887338B2 (en) * | 2009-07-28 | 2018-02-06 | Intellectual Discovery Co., Ltd. | Light emitting diode device |
WO2011122981A1 (ru) * | 2010-03-31 | 2011-10-06 | Bortkyevich Andryej Borisovich | Модуль автоматики |
DE102010062944A1 (de) * | 2010-12-13 | 2012-06-14 | Zf Friedrichshafen Ag | Leiterplatte und Verfahren zur Herstellung einer solchen |
IT1403805B1 (it) * | 2011-02-01 | 2013-10-31 | Gs Plastics S A S Di Giovanni Gervasio & C | Lampada a led |
RU2519925C2 (ru) * | 2012-06-26 | 2014-06-20 | Открытое акционерное общество "Научно-производственное предприятие "Алмаз" (ОАО "НПП "Алмаз") | Устройство для отвода тепла от тепловыделяющих радиоэлементов |
ITMI20130520A1 (it) * | 2013-04-05 | 2014-10-06 | St Microelectronics Srl | Realizzazione di un dissipatore di calore tramite saldatura ad onda |
US20140327126A1 (en) * | 2013-05-01 | 2014-11-06 | Microsoft Corporation | Cooling integrated circuit packages from below |
DE102013016464A1 (de) * | 2013-10-04 | 2015-04-09 | Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Hallstadt | Verfahren zur Montage einer elektrischen Baugruppe und elektrische Baugruppe |
US9480143B2 (en) * | 2013-10-09 | 2016-10-25 | Uusi, Llc | Motor control device |
US20150305192A1 (en) * | 2014-04-16 | 2015-10-22 | Tesla Motors, Inc. | Dielectric thermal pad using dual-sided thermally conductive adhesive on ceramic |
US20160088720A1 (en) * | 2014-09-24 | 2016-03-24 | Hiq Solar, Inc. | Transistor thermal and emi management solution for fast edge rate environment |
DE102014223862A1 (de) | 2014-11-24 | 2016-05-25 | Robert Bosch Gmbh | Anordnung mit einem Trägersubstrat und einem Leistungsbauelement |
JP6903051B2 (ja) * | 2015-10-07 | 2021-07-14 | セラムテック ゲゼルシャフト ミット ベシュレンクテル ハフツングCeramTec GmbH | 二面冷却式回路 |
CN105472871A (zh) * | 2015-12-23 | 2016-04-06 | 联想(北京)有限公司 | 一种线路板及电子设备 |
DE102016202171A1 (de) * | 2016-02-12 | 2017-08-17 | Continental Teves Ag & Co. Ohg | Leiterplattenanordnung mit einem abstandshalter zwischen einer platine und einem kühlkörper sowie verfahren und verwendung hierzu |
DE102016219116A1 (de) * | 2016-09-30 | 2018-04-05 | Robert Bosch Gmbh | Verfahren zum Herstellen einer elektronischen Baugruppe und elektronische Baugruppe, insbesondere für ein Getriebesteuermodul |
RU2677633C1 (ru) * | 2017-12-12 | 2019-01-18 | Федеральное государственное унитарное предприятие "Научно-производственный центр автоматики и приборостроения имени академика Н.А. Пилюгина" (ФГУП "НПЦАП") | Конструкция многослойных печатных плат со встроенным теплоотводом |
DE102017129707A1 (de) * | 2017-12-13 | 2019-06-13 | Semikron Elektronik Gmbh & Co. Kg | Verfahren zur Herstellung eines leistungselektronischen Systems |
US11477889B2 (en) | 2018-06-28 | 2022-10-18 | Black & Decker Inc. | Electronic switch module with an integrated flyback diode |
DE102018217607A1 (de) * | 2018-10-15 | 2020-04-16 | Continental Automotive Gmbh | Halbleiterbauelement-Anordnung, Verfahren zu deren Herstellung sowie Entwärmungseinrichtung |
RU2729606C1 (ru) * | 2019-11-25 | 2020-08-11 | Акционерное общество «Информационные спутниковые системы» имени академика М.Ф.Решетнёва» | Способ совместного монтажа электрорадиоизделий и печатных плат радиоэлектронной аппаратуры |
JP2022120923A (ja) * | 2021-02-08 | 2022-08-19 | 株式会社アイシン | 回路基板 |
DE202022106958U1 (de) | 2022-12-13 | 2023-01-04 | Webasto SE | Elektronische Baugruppe mit Abstandshalter für ein elektronisches Bauteil auf einem Substrat |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2528000B2 (de) * | 1975-06-24 | 1979-12-20 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur Herstellung einer Lötfläche relativ großer Abmessungen |
US4628407A (en) * | 1983-04-22 | 1986-12-09 | Cray Research, Inc. | Circuit module with enhanced heat transfer and distribution |
US4626478A (en) * | 1984-03-22 | 1986-12-02 | Unitrode Corporation | Electronic circuit device components having integral spacers providing uniform thickness bonding film |
US5261593A (en) * | 1992-08-19 | 1993-11-16 | Sheldahl, Inc. | Direct application of unpackaged integrated circuit to flexible printed circuit |
DE4232575A1 (de) * | 1992-09-29 | 1994-03-31 | Bosch Gmbh Robert | Anordnung mit einer Leiterplatte, mindestens einem Leistungsbauelement und einem Kühlkörper |
US5352926A (en) * | 1993-01-04 | 1994-10-04 | Motorola, Inc. | Flip chip package and method of making |
DE9308842U1 (ja) | 1993-06-14 | 1993-07-22 | Blaupunkt-Werke Gmbh, 31139 Hildesheim, De | |
US5467251A (en) * | 1993-10-08 | 1995-11-14 | Northern Telecom Limited | Printed circuit boards and heat sink structures |
US5541450A (en) | 1994-11-02 | 1996-07-30 | Motorola, Inc. | Low-profile ball-grid array semiconductor package |
US5646826A (en) * | 1995-01-26 | 1997-07-08 | Northern Telecom Limited | Printed circuit board and heat sink arrangement |
DE19528632A1 (de) * | 1995-08-04 | 1997-02-06 | Bosch Gmbh Robert | Steuergerät bestehend aus mindestens zwei Gehäuseteilen |
DE19723409A1 (de) * | 1997-06-04 | 1998-12-10 | Bosch Gmbh Robert | Steuergerät |
-
1997
- 1997-08-25 DE DE19736962A patent/DE19736962B4/de not_active Expired - Lifetime
-
1998
- 1998-06-12 WO PCT/DE1998/001609 patent/WO1999011107A1/de active IP Right Grant
- 1998-06-12 EP EP98936156A patent/EP0934687B1/de not_active Expired - Lifetime
- 1998-06-12 KR KR10-1999-7003561A patent/KR100503399B1/ko not_active IP Right Cessation
- 1998-06-12 RU RU99109972/09A patent/RU2201659C2/ru active
- 1998-06-12 CN CNB988012332A patent/CN1134063C/zh not_active Expired - Lifetime
- 1998-06-12 US US09/297,037 patent/US6226183B1/en not_active Expired - Lifetime
- 1998-06-12 JP JP51374299A patent/JP3897824B2/ja not_active Expired - Lifetime
- 1998-06-12 DE DE59810084T patent/DE59810084D1/de not_active Expired - Lifetime
- 1998-06-12 AU AU85314/98A patent/AU727105B2/en not_active Expired
- 1998-06-12 BR BRPI9806147-0A patent/BR9806147B1/pt not_active IP Right Cessation
- 1998-06-23 TW TW087110057A patent/TW396560B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO1999011107A1 (de) | 1999-03-04 |
AU727105B2 (en) | 2000-11-30 |
DE19736962B4 (de) | 2009-08-06 |
AU8531498A (en) | 1999-03-16 |
EP0934687A1 (de) | 1999-08-11 |
CN1237325A (zh) | 1999-12-01 |
EP0934687B1 (de) | 2003-11-05 |
TW396560B (en) | 2000-07-01 |
US6226183B1 (en) | 2001-05-01 |
BR9806147B1 (pt) | 2011-10-04 |
DE19736962A1 (de) | 1999-03-04 |
DE59810084D1 (de) | 2003-12-11 |
KR100503399B1 (ko) | 2005-07-26 |
BR9806147A (pt) | 1999-10-26 |
RU2201659C2 (ru) | 2003-03-27 |
KR20000068821A (ko) | 2000-11-25 |
CN1134063C (zh) | 2004-01-07 |
JP3897824B2 (ja) | 2007-03-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2001505000A (ja) | 電力構造部品のための支持体基板と冷却部材を含む装置及びその製造方法 | |
JPH11345921A (ja) | プリント基板上に配置された、熱を発生する構成素子のための冷却装置 | |
US5159532A (en) | Electronic control unit with multiple hybrid circuit assemblies integrated on a single common ceramic carrier | |
US6344973B1 (en) | Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same | |
US20120236504A1 (en) | Electronic device for switching currents and method for producing the same | |
US20090126980A1 (en) | Printed wiring board | |
JPH09223820A (ja) | 表示装置 | |
US5481241A (en) | Film-type heat sink-mounted power resistor combination having only a thin encapsulant, and having an enlarged internal heat sink | |
JPH05267511A (ja) | 電子装置パッケージおよびその作製方法 | |
JP2003303932A (ja) | 冷却装置および冷却装置を有する電気装置 | |
EP0812015A1 (en) | A heat dissipator for integrated circuits | |
EP0766506A3 (en) | A multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area | |
EP1528847B1 (en) | Heat dissipating insert, circuit comprising said insert and production method | |
JPH06268341A (ja) | 電子部品の放熱方法、および同放熱構造 | |
US6292368B1 (en) | Electrical power component mounted by brazing on a support and corresponding mounting process | |
JPH1197818A (ja) | 実装配線基板 | |
EP1149419B1 (en) | Multi-chip module for use in high-power applications | |
JPH0777288B2 (ja) | プリント回路基板 | |
US6905361B2 (en) | Electrical device | |
CA2368057A1 (en) | A method and an arrangement for the electrical contact of components | |
US6846987B2 (en) | Power electronics component | |
US10559912B2 (en) | Method for producing and electrical assembly | |
JPH0677283A (ja) | 配線基板へのic素子の実装方法 | |
US11955402B2 (en) | Power semiconductor component and method for producing a power semiconductor component | |
US20050254220A1 (en) | Electronics unit |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050613 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050613 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060411 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20060707 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20060821 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061004 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20061121 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20061220 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110105 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120105 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130105 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130105 Year of fee payment: 6 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |