BR9301501A - Processo e dispositivo para soldagem topo a topo de chapas para formar plantinas por meio de laser - Google Patents

Processo e dispositivo para soldagem topo a topo de chapas para formar plantinas por meio de laser

Info

Publication number
BR9301501A
BR9301501A BR9301501A BR9301501A BR9301501A BR 9301501 A BR9301501 A BR 9301501A BR 9301501 A BR9301501 A BR 9301501A BR 9301501 A BR9301501 A BR 9301501A BR 9301501 A BR9301501 A BR 9301501A
Authority
BR
Brazil
Prior art keywords
sheet
laser
plates
gap
welded
Prior art date
Application number
BR9301501A
Other languages
English (en)
Inventor
Markus Meier
Werner Urech
Karl Wueger
Original Assignee
Elpatronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH00573/93A external-priority patent/CH687598A5/de
Application filed by Elpatronic Ag filed Critical Elpatronic Ag
Publication of BR9301501A publication Critical patent/BR9301501A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/26—Seam welding of rectilinear seams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K33/00—Specially-profiled edge portions of workpieces for making soldering or welding connections; Filling the seams formed thereby
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Butt Welding And Welding Of Specific Article (AREA)
BR9301501A 1992-04-12 1993-04-12 Processo e dispositivo para soldagem topo a topo de chapas para formar plantinas por meio de laser BR9301501A (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH117392 1992-04-12
CH121192 1992-04-13
CH00573/93A CH687598A5 (de) 1993-02-25 1993-02-25 Verfahren und Vorrichtung zum Schweissen von Blechen zu Platinen mittels Laser.

Publications (1)

Publication Number Publication Date
BR9301501A true BR9301501A (pt) 1993-10-19

Family

ID=27172217

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9301501A BR9301501A (pt) 1992-04-12 1993-04-12 Processo e dispositivo para soldagem topo a topo de chapas para formar plantinas por meio de laser

Country Status (13)

Country Link
US (2) US5550345A (pt)
EP (1) EP0565846B1 (pt)
JP (1) JP2857011B2 (pt)
KR (1) KR970010885B1 (pt)
CN (1) CN1066375C (pt)
AT (1) ATE137151T1 (pt)
AU (1) AU3516393A (pt)
BR (1) BR9301501A (pt)
CA (1) CA2093070C (pt)
CZ (1) CZ290110B6 (pt)
DE (1) DE59302322D1 (pt)
ES (1) ES2086805T3 (pt)
SK (1) SK283381B6 (pt)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0565846B1 (de) * 1992-04-12 1996-04-24 Elpatronic Ag Verfahren und Vorrichtung zum Schweissen von Blechen zu Platinen mittels Laser
IT1267155B1 (it) * 1994-11-22 1997-01-28 Stola Spa Apparecchiatura e procedimento per la saldatura di testa di lamiere metalliche piane di diverso spessore mediante fascio laser.
EP0743134B1 (de) * 1995-05-15 2001-02-21 Elpatronic Ag Verfahren und Vorrichtung zum Verbinden von zwei Werkstücken
EP0743129A3 (de) * 1995-05-15 1997-02-05 Elpatronic Ag Verfahren zum Verbinden von Werkstücken
EP0743135B1 (de) * 1995-05-15 1999-07-14 Elpatronic Ag Verfahren zum Verbinden von zwei Werkstücken
ATE206649T1 (de) * 1995-05-15 2001-10-15 Elpatronic Ag Verfahren und vorrichtung zum verbinden von zwei metallischen werkstücken
EP0761365B1 (de) * 1995-09-04 2000-10-18 Elpatronic Ag Verfahren und Vorrichtung zum Rollnahtschweissen von Behältern
US5957369A (en) * 1996-05-09 1999-09-28 Elpatronic Ag Method for connecting two workpieces together
DE19624776C1 (de) * 1996-06-21 1997-09-04 Krupp Ag Hoesch Krupp Verfahren zum Herstellen geschweißter Stahlblechplatinen
US5823417A (en) * 1996-07-09 1998-10-20 Johnson; Jeffrey Don Laser pressure foot
US6031199A (en) * 1997-10-28 2000-02-29 Worthington Machine Technology Combination laser cutting and blank welding apparatus and method
US6205160B1 (en) 1998-09-24 2001-03-20 Branson Ultrasonics Corporation Laser diode array
KR100655525B1 (ko) * 1998-11-18 2006-12-07 엘파트로닉 아게 레이저에 의한 강판의 용접 장치 및 그 용접 장치의 용도
US6204469B1 (en) * 1999-03-04 2001-03-20 Honda Giken Kogyo Kabushiki Kaisha Laser welding system
KR100624241B1 (ko) * 1999-03-08 2006-09-13 엘파트로닉 아게 박판 용접 방법 및 장치
JP2003536075A (ja) * 2000-06-08 2003-12-02 ボード・オブ・リージェンツ，ザ・ユニヴァーシティ・オヴ・テキサス・システム Ｃ反応性タンパク質誘導性炎症のインヒビター
AU2001293605A1 (en) * 2000-10-25 2002-05-06 Elpatronic A.G. Method and device for closing the gap during the welding of tailored blanks
JP4056217B2 (ja) 2000-12-26 2008-03-05 ダイワ精工株式会社 魚釣用スピニングリール
JP3884360B2 (ja) * 2002-02-12 2007-02-21 菊池プレス工業株式会社 突き合わせ溶接装置及び突き合わせ溶接方法並びに突き合わせ溶接製品
CN1293984C (zh) * 2003-03-06 2007-01-10 陈佩芳 板金接合方法
US20080272112A1 (en) * 2004-06-01 2008-11-06 Soutec Soudronic Ag Hard-Soldering Method and Device
DE102004055083B4 (de) * 2004-11-15 2008-01-17 Trw Automotive Electronics & Components Gmbh & Co. Kg Schweißteil für das Verschweißen mittels einer Kehlnaht und elektrische Baueinheit
US7638731B2 (en) * 2005-10-18 2009-12-29 Electro Scientific Industries, Inc. Real time target topography tracking during laser processing
FR2906171B1 (fr) * 2006-09-22 2009-05-15 Vai Clecim Sa Dispositif de raboutage par soudure de bandes de toles
JP4500884B2 (ja) * 2008-07-11 2010-07-14 三菱日立製鉄機械株式会社 金属板の接合方法及び接合装置
CN102089111B (zh) * 2008-07-11 2014-02-12 三菱日立制铁机械株式会社 压薄滚焊方法及装置
DE102009003655B4 (de) * 2009-03-23 2012-01-19 Thyssenkrupp Steel Europe Ag Verfahren zum Herstellen einer Blechplatine, sowie eine Blechplatine und das Umformwerkzeug zum Herstellen eines Bleches mit einem Dickenübergang an einer Verbindungskante
WO2014026297A1 (de) 2012-08-15 2014-02-20 Soutec Ag Verfahren zur überwachung der kantenposition von zwei platinen und eine anwendung des verfahrens
CN103394812A (zh) * 2013-05-14 2013-11-20 昆山宝锦激光拼焊有限公司 激光拼焊焊缝控制装置
WO2015162445A1 (fr) 2014-04-25 2015-10-29 Arcelormittal Investigación Y Desarrollo Sl Procede et dispositif de preparation de toles d'acier aluminiees destinees a etre soudees puis durcies sous presse; flan soude correspondant
US10821548B2 (en) * 2015-03-20 2020-11-03 Honda Motor Co., Ltd. Plate-material abutting device
CN105269167B (zh) * 2015-11-20 2017-06-23 辽宁忠旺特种车辆制造有限公司 全承载厢式车前厢板焊接工艺
JP7027122B2 (ja) * 2017-10-27 2022-03-01 シロキ工業株式会社 車両用ドアサッシュのシーム溶接方法
CN111215791B (zh) * 2018-11-26 2021-11-09 晟通科技集团有限公司 用于板材焊接的滚焊机
DE102019103734A1 (de) * 2019-02-14 2020-08-20 Precitec Gmbh & Co. Kg Laserbearbeitungssystem zur Bearbeitung eines Werkstücks mittels eines Laserstrahls und Verfahren zum Steuern eines Laserbearbeitungssystems
CN114473278B (zh) * 2022-01-29 2024-06-28 中建钢构股份有限公司 具有z向性能的钢材的焊接方法
CN116372323B (zh) * 2023-06-05 2023-08-18 四川吉埃智能科技有限公司 一种工业智能焊接机器人及驱控方法
DE102024001348A1 (de) 2024-04-25 2024-06-13 Mercedes-Benz Group AG Verfahren zum Fügen von zumindest zwei Bauteilen
DE102024001670A1 (de) 2024-05-23 2024-07-18 Mercedes-Benz Group AG Verfahren und Vorrichtung zum Verschweißen von Bauteilen

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US4354090A (en) * 1979-10-23 1982-10-12 Sws Incorporated Z-bar guide apparatus and method of butt welding
JPS58163587A (ja) * 1982-03-23 1983-09-28 Toshiba Corp レ−ザ溶接用ノズル
DE3304717A1 (de) * 1983-02-11 1984-08-16 BIAS Forschungs- und Entwicklungs-Labor für angewandte Strahltechnik GmbH, 2820 Bremen Verfahren und vorrichtung zum schweissen plastisch verformbarer werkstoffe
JPS60106684A (ja) * 1983-11-15 1985-06-12 Agency Of Ind Science & Technol 薄板用レ−ザ溶接治具
JPS61202789A (ja) * 1985-03-05 1986-09-08 Kishimoto Akira 溶接缶胴の製造方法および装置
JPS61279383A (ja) * 1985-06-03 1986-12-10 Toyo Seikan Kaisha Ltd 溶接缶胴の製造方法と装置
JPS61279385A (ja) * 1985-06-05 1986-12-10 Mitsubishi Heavy Ind Ltd 薄板のレ−ザ溶接方法
DE3723611A1 (de) * 1987-07-17 1989-01-26 Thyssen Stahl Ag Vorrichtung zum kontinuierlichen verschweissen von baendern und/oder blechen
JPH01118389A (ja) * 1987-10-29 1989-05-10 Mazda Motor Corp レーザ溶接方法およびその装置
DE3909620A1 (de) * 1989-03-23 1990-09-27 Bernd Buedenbender Verfahren zum stumpfschweissen von blechen
EP0565846B1 (de) * 1992-04-12 1996-04-24 Elpatronic Ag Verfahren und Vorrichtung zum Schweissen von Blechen zu Platinen mittels Laser

Also Published As

Publication number Publication date
ES2086805T3 (es) 1996-07-01
EP0565846B1 (de) 1996-04-24
US5550345A (en) 1996-08-27
AU3516393A (en) 1993-10-14
CN1066375C (zh) 2001-05-30
SK283381B6 (sk) 2003-06-03
CZ290110B6 (cs) 2002-06-12
CN1103823A (zh) 1995-06-21
DE59302322D1 (de) 1996-05-30
EP0565846A1 (de) 1993-10-20
CA2093070A1 (en) 1993-10-13
SK31993A3 (en) 1993-11-10
ATE137151T1 (de) 1996-05-15
CZ62593A3 (en) 1993-11-17
CA2093070C (en) 1999-02-02
KR930021312A (ko) 1993-11-22
JP2857011B2 (ja) 1999-02-10
US5977511A (en) 1999-11-02
KR970010885B1 (ko) 1997-07-02
JPH0615469A (ja) 1994-01-25

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Legal Events

Date Code Title Description
EE Request for examination
HIFB Technical and formal requirements: requirement cancelled
FF Decision: intention to grant
FG9A Patent or certificate of addition granted
B21A Patent or certificate of addition expired [chapter 21.1 patent gazette]

Free format text: PATENTE EXTINTA EM 12/04/2013