ES2086805T3 - Procedimiento y dispositivo para soldar chapas para formar llantones por medio de rayo laser. - Google Patents

Procedimiento y dispositivo para soldar chapas para formar llantones por medio de rayo laser.

Info

Publication number
ES2086805T3
ES2086805T3 ES93103438T ES93103438T ES2086805T3 ES 2086805 T3 ES2086805 T3 ES 2086805T3 ES 93103438 T ES93103438 T ES 93103438T ES 93103438 T ES93103438 T ES 93103438T ES 2086805 T3 ES2086805 T3 ES 2086805T3
Authority
ES
Spain
Prior art keywords
sheet
procedure
laser beam
gap
welding sheets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93103438T
Other languages
English (en)
Inventor
Markus Meier
Werner Urech
Karl Wueger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Elpatronic AG
Original Assignee
Elpatronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH00573/93A external-priority patent/CH687598A5/de
Application filed by Elpatronic AG filed Critical Elpatronic AG
Application granted granted Critical
Publication of ES2086805T3 publication Critical patent/ES2086805T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/26—Seam welding of rectilinear seams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K33/00—Specially-profiled edge portions of workpieces for making soldering or welding connections; Filling the seams formed thereby
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Butt Welding And Welding Of Specific Article (AREA)

Abstract

LAS CHAPAS (1, 2) SE DEBEN SOLDAR EN JUNTAS A TOPE MEDIANTE LA SUPERPOSICION DE LAS MISMAS, HACIENDO COINCIDIR SUS SUPERFICIES FRONTALES. PARA REDUCIR LOS RESQUICIOS DE UNION EN LAS MASAS PRESENTABLES PARA SOLDAR CON LASER, SE DEFORMA PLASTICAMENTE UNA CHAPA (2) A LO LARGO DE LA UNION POR SOLDADURA PARA QUE EL MATERIAL CIRCULE EN LA DIRECCION DEL RESQUICIO Y SE REDUCE POR ELLO LA ANCHURA DEL RESQUICIO Y SE CARACTERIZA PORQUE SEGUN LO MENCIONADO ANTERIORMENTE PUEDEN SOLDARSE UNAS CHAPAS CORTADAS CON PEQUEÑA PRECISION.
ES93103438T 1992-04-12 1993-03-04 Procedimiento y dispositivo para soldar chapas para formar llantones por medio de rayo laser. Expired - Lifetime ES2086805T3 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH117392 1992-04-12
CH121192 1992-04-13
CH00573/93A CH687598A5 (de) 1993-02-25 1993-02-25 Verfahren und Vorrichtung zum Schweissen von Blechen zu Platinen mittels Laser.

Publications (1)

Publication Number Publication Date
ES2086805T3 true ES2086805T3 (es) 1996-07-01

Family

ID=27172217

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93103438T Expired - Lifetime ES2086805T3 (es) 1992-04-12 1993-03-04 Procedimiento y dispositivo para soldar chapas para formar llantones por medio de rayo laser.

Country Status (13)

Country Link
US (2) US5550345A (es)
EP (1) EP0565846B1 (es)
JP (1) JP2857011B2 (es)
KR (1) KR970010885B1 (es)
CN (1) CN1066375C (es)
AT (1) ATE137151T1 (es)
AU (1) AU3516393A (es)
BR (1) BR9301501A (es)
CA (1) CA2093070C (es)
CZ (1) CZ290110B6 (es)
DE (1) DE59302322D1 (es)
ES (1) ES2086805T3 (es)
SK (1) SK283381B6 (es)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE137151T1 (de) * 1992-04-12 1996-05-15 Elpatronic Ag Verfahren und vorrichtung zum schweissen von blechen zu platinen mittels laser
IT1267155B1 (it) * 1994-11-22 1997-01-28 Stola Spa Apparecchiatura e procedimento per la saldatura di testa di lamiere metalliche piane di diverso spessore mediante fascio laser.
EP0743129A3 (de) * 1995-05-15 1997-02-05 Elpatronic Ag Verfahren zum Verbinden von Werkstücken
DE59602422D1 (de) * 1995-05-15 1999-08-19 Elpatronic Ag Verfahren zum Verbinden von zwei Werkstücken
PT743133E (pt) * 1995-05-15 2002-04-29 Elpatronic Ag Processo e dispositivo para a uniao de duas pecas metalicas em bruto
EP0743134B1 (de) * 1995-05-15 2001-02-21 Elpatronic Ag Verfahren und Vorrichtung zum Verbinden von zwei Werkstücken
EP0761365B1 (de) * 1995-09-04 2000-10-18 Elpatronic Ag Verfahren und Vorrichtung zum Rollnahtschweissen von Behältern
US5957369A (en) * 1996-05-09 1999-09-28 Elpatronic Ag Method for connecting two workpieces together
DE19624776C1 (de) * 1996-06-21 1997-09-04 Krupp Ag Hoesch Krupp Verfahren zum Herstellen geschweißter Stahlblechplatinen
US5823417A (en) * 1996-07-09 1998-10-20 Johnson; Jeffrey Don Laser pressure foot
US6031199A (en) * 1997-10-28 2000-02-29 Worthington Machine Technology Combination laser cutting and blank welding apparatus and method
US6205160B1 (en) 1998-09-24 2001-03-20 Branson Ultrasonics Corporation Laser diode array
ES2237162T3 (es) * 1998-11-18 2005-07-16 Elpatronic Ag Procedimiento y dispositivo para la soldadura de chapas con un laser.
US6204469B1 (en) * 1999-03-04 2001-03-20 Honda Giken Kogyo Kabushiki Kaisha Laser welding system
US6720520B1 (en) * 1999-03-08 2004-04-13 Elpatronic Ag Method and device for welding sheets
WO2001094951A2 (en) * 2000-06-08 2001-12-13 Board Of Regents, The University Of Texas System Inhibitors of c-reactive protein induced inflammation
AU2001293605A1 (en) * 2000-10-25 2002-05-06 Elpatronic A.G. Method and device for closing the gap during the welding of tailored blanks
JP4056217B2 (ja) 2000-12-26 2008-03-05 ダイワ精工株式会社 魚釣用スピニングリール
JP3884360B2 (ja) * 2002-02-12 2007-02-21 菊池プレス工業株式会社 突き合わせ溶接装置及び突き合わせ溶接方法並びに突き合わせ溶接製品
CN1293984C (zh) * 2003-03-06 2007-01-10 陈佩芳 板金接合方法
KR20070030214A (ko) * 2004-06-01 2007-03-15 소우텍 소우드로닉 아게 경납땜 방법 및 장치
DE102004055083B4 (de) * 2004-11-15 2008-01-17 Trw Automotive Electronics & Components Gmbh & Co. Kg Schweißteil für das Verschweißen mittels einer Kehlnaht und elektrische Baueinheit
US7638731B2 (en) * 2005-10-18 2009-12-29 Electro Scientific Industries, Inc. Real time target topography tracking during laser processing
FR2906171B1 (fr) * 2006-09-22 2009-05-15 Vai Clecim Sa Dispositif de raboutage par soudure de bandes de toles
KR101297859B1 (ko) * 2008-07-11 2013-08-19 미쯔비시 히다찌 세이떼쯔 기까이 가부시끼가이샤 금속판의 접합 방법 및 접합 장치
EP2322308A4 (en) * 2008-07-11 2014-06-11 Mitsubishi Hitachi Metals METHOD AND EQUIPMENT FOR WELDING AND SCRATCHING
DE102009003655B4 (de) * 2009-03-23 2012-01-19 Thyssenkrupp Steel Europe Ag Verfahren zum Herstellen einer Blechplatine, sowie eine Blechplatine und das Umformwerkzeug zum Herstellen eines Bleches mit einem Dickenübergang an einer Verbindungskante
WO2014026297A1 (de) 2012-08-15 2014-02-20 Soutec Ag Verfahren zur überwachung der kantenposition von zwei platinen und eine anwendung des verfahrens
CN103394812A (zh) * 2013-05-14 2013-11-20 昆山宝锦激光拼焊有限公司 激光拼焊焊缝控制装置
WO2015162445A1 (fr) 2014-04-25 2015-10-29 Arcelormittal Investigación Y Desarrollo Sl Procede et dispositif de preparation de toles d'acier aluminiees destinees a etre soudees puis durcies sous presse; flan soude correspondant
CN107405733B (zh) * 2015-03-20 2019-11-26 本田技研工业株式会社 板材对接装置
CN105269167B (zh) * 2015-11-20 2017-06-23 辽宁忠旺特种车辆制造有限公司 全承载厢式车前厢板焊接工艺
JP7027122B2 (ja) * 2017-10-27 2022-03-01 シロキ工業株式会社 車両用ドアサッシュのシーム溶接方法
CN111215791B (zh) * 2018-11-26 2021-11-09 晟通科技集团有限公司 用于板材焊接的滚焊机
DE102019103734A1 (de) * 2019-02-14 2020-08-20 Precitec Gmbh & Co. Kg Laserbearbeitungssystem zur Bearbeitung eines Werkstücks mittels eines Laserstrahls und Verfahren zum Steuern eines Laserbearbeitungssystems
CN114473278A (zh) * 2022-01-29 2022-05-13 中建钢构工程有限公司 具有z向性能的钢材的焊接方法
CN116372323B (zh) * 2023-06-05 2023-08-18 四川吉埃智能科技有限公司 一种工业智能焊接机器人及驱控方法

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US4354090A (en) * 1979-10-23 1982-10-12 Sws Incorporated Z-bar guide apparatus and method of butt welding
JPS58163587A (ja) * 1982-03-23 1983-09-28 Toshiba Corp レ−ザ溶接用ノズル
DE3304717A1 (de) * 1983-02-11 1984-08-16 BIAS Forschungs- und Entwicklungs-Labor für angewandte Strahltechnik GmbH, 2820 Bremen Verfahren und vorrichtung zum schweissen plastisch verformbarer werkstoffe
JPS60106684A (ja) * 1983-11-15 1985-06-12 Agency Of Ind Science & Technol 薄板用レ−ザ溶接治具
JPS61202789A (ja) * 1985-03-05 1986-09-08 Kishimoto Akira 溶接缶胴の製造方法および装置
JPS61279383A (ja) * 1985-06-03 1986-12-10 Toyo Seikan Kaisha Ltd 溶接缶胴の製造方法と装置
JPS61279385A (ja) * 1985-06-05 1986-12-10 Mitsubishi Heavy Ind Ltd 薄板のレ−ザ溶接方法
DE3723611A1 (de) * 1987-07-17 1989-01-26 Thyssen Stahl Ag Vorrichtung zum kontinuierlichen verschweissen von baendern und/oder blechen
JPH01118389A (ja) * 1987-10-29 1989-05-10 Mazda Motor Corp レーザ溶接方法およびその装置
DE3909620A1 (de) * 1989-03-23 1990-09-27 Bernd Buedenbender Verfahren zum stumpfschweissen von blechen
ATE137151T1 (de) * 1992-04-12 1996-05-15 Elpatronic Ag Verfahren und vorrichtung zum schweissen von blechen zu platinen mittels laser

Also Published As

Publication number Publication date
CZ62593A3 (en) 1993-11-17
CA2093070C (en) 1999-02-02
SK31993A3 (en) 1993-11-10
ATE137151T1 (de) 1996-05-15
CN1066375C (zh) 2001-05-30
JPH0615469A (ja) 1994-01-25
KR930021312A (ko) 1993-11-22
US5977511A (en) 1999-11-02
AU3516393A (en) 1993-10-14
KR970010885B1 (ko) 1997-07-02
SK283381B6 (sk) 2003-06-03
BR9301501A (pt) 1993-10-19
CA2093070A1 (en) 1993-10-13
JP2857011B2 (ja) 1999-02-10
EP0565846A1 (de) 1993-10-20
CN1103823A (zh) 1995-06-21
EP0565846B1 (de) 1996-04-24
CZ290110B6 (cs) 2002-06-12
DE59302322D1 (de) 1996-05-30
US5550345A (en) 1996-08-27

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