BR9206095A - Laminado, adaptado para ser usado como uma placa de suporte para um circuito impresso, material revestido de cobre material adequado para formar uma camada ligação de suporte entre placas circuitizadas em painéis de fio impressos multicamada e processo de fabricação de um material base para painéis de fios impressos - Google Patents
Laminado, adaptado para ser usado como uma placa de suporte para um circuito impresso, material revestido de cobre material adequado para formar uma camada ligação de suporte entre placas circuitizadas em painéis de fio impressos multicamada e processo de fabricação de um material base para painéis de fios impressosInfo
- Publication number
- BR9206095A BR9206095A BR9206095A BR9206095A BR9206095A BR 9206095 A BR9206095 A BR 9206095A BR 9206095 A BR9206095 A BR 9206095A BR 9206095 A BR9206095 A BR 9206095A BR 9206095 A BR9206095 A BR 9206095A
- Authority
- BR
- Brazil
- Prior art keywords
- laminate
- printed
- layers
- wire panels
- pct
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/12—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by the relative arrangement of fibres or filaments of different layers, e.g. the fibres or filaments being parallel or perpendicular to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0236—Plating catalyst as filler in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0287—Unidirectional or parallel fibers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24058—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in respective layers or components in angular relation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24058—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in respective layers or components in angular relation
- Y10T428/24124—Fibers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
- Y10T442/654—Including a free metal or alloy constituent
- Y10T442/656—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the nonwoven fabric]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- Reinforced Plastic Materials (AREA)
- Press Drives And Press Lines (AREA)
- Combinations Of Printed Boards (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL9100957 | 1991-06-04 | ||
PCT/EP1992/001132 WO1992022191A1 (en) | 1991-06-04 | 1992-05-19 | Printed wire boards and method of making same |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9206095A true BR9206095A (pt) | 1994-08-02 |
Family
ID=19859320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9206095A BR9206095A (pt) | 1991-06-04 | 1992-05-19 | Laminado, adaptado para ser usado como uma placa de suporte para um circuito impresso, material revestido de cobre material adequado para formar uma camada ligação de suporte entre placas circuitizadas em painéis de fio impressos multicamada e processo de fabricação de um material base para painéis de fios impressos |
Country Status (14)
Country | Link |
---|---|
US (1) | US5496613A (pt) |
EP (1) | EP0587644B1 (pt) |
JP (1) | JPH06507758A (pt) |
KR (1) | KR940701633A (pt) |
AT (1) | ATE140580T1 (pt) |
AU (2) | AU662743B2 (pt) |
BR (1) | BR9206095A (pt) |
CA (1) | CA2110678A1 (pt) |
DE (1) | DE69212315T2 (pt) |
ES (1) | ES2090645T3 (pt) |
HK (1) | HK1004593A1 (pt) |
RU (1) | RU2125351C1 (pt) |
TW (1) | TW224561B (pt) |
WO (1) | WO1992022191A1 (pt) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2087815B1 (es) * | 1993-10-13 | 1997-02-16 | Mecanismos Aux Ind | Mejoras introducidas en la patente de invencion n- 9200325 por perfeccionamientos en los procesos de fabricacion de cajas de servicios y de sus partes. |
US5874152A (en) * | 1994-01-26 | 1999-02-23 | Amp-Akzo Linlam Vof | Method of making a composite laminate and a PWB substrate so made |
US6495244B1 (en) * | 2000-09-07 | 2002-12-17 | Oak-Mitsui, Inc. | Manufacturing fire retardant circuit boards without the use of fire retardant resin additives |
US20040076831A1 (en) * | 2002-10-02 | 2004-04-22 | L&L Products, Inc. | Synthetic material and methods of forming and applying same |
US6915701B1 (en) * | 2003-07-18 | 2005-07-12 | Cleveland Medical Devices Inc. | Composite material for a sensor for measuring shear forces |
US8263225B2 (en) * | 2004-06-01 | 2012-09-11 | Isola Usa Corp. | Laminate composition for producing reduced curl flat thin core laminate |
US7927216B2 (en) | 2005-09-15 | 2011-04-19 | Nintendo Co., Ltd. | Video game system with wireless modular handheld controller |
AU2007248437A1 (en) | 2006-05-05 | 2007-11-15 | International Paper Company | Paperboard material with expanded polymeric microspheres |
US8168292B2 (en) * | 2006-06-15 | 2012-05-01 | Innegra Technologies, Llc | Composite materials including amorphous thermoplastic fibers |
US20080188153A1 (en) * | 2007-02-06 | 2008-08-07 | Innegrity, Llc | Method of Forming a Low Dielectric Loss Composite Material |
US7648758B2 (en) | 2007-02-06 | 2010-01-19 | Innegrity, Llc | Low dielectric loss composite material |
US8088323B2 (en) | 2007-02-27 | 2012-01-03 | Ppg Industries Ohio, Inc. | Process of electrospinning organic-inorganic fibers |
WO2008126817A1 (ja) * | 2007-04-11 | 2008-10-23 | Hitachi Chemical Company, Ltd. | 金属箔張り積層板およびプリント配線板 |
US20150083473A1 (en) * | 2011-06-24 | 2015-03-26 | Cubic Tech Corporation | Flexible electronic fiber-reinforced composite materials |
BR112015012020A2 (pt) * | 2012-11-26 | 2017-07-11 | Cytec Ind Inc | processo de ligação de compósito |
RU2715188C2 (ru) * | 2018-08-20 | 2020-02-25 | Общество с ограниченной ответственностью "Малое инновационное предприятие "Байкальский научный центр прочности" | Способ получения слоистого пластика |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1660924A (en) * | 1923-11-03 | 1928-02-28 | Hopkinson Ernest | Sheet material |
FR1229208A (fr) * | 1958-07-01 | 1960-09-05 | Thomson Houston Comp Francaise | Méthode de fabrication de support de circuit imprimé, et support ainsi réalisé |
US3686048A (en) * | 1969-10-14 | 1972-08-22 | Air Logistics Corp | Fiber reinforced parallel resinous structure fabrication |
US4216856A (en) * | 1975-04-25 | 1980-08-12 | Dunlop Limited | Reinforcement for elastomeric articles |
FR2473567A1 (fr) * | 1979-12-21 | 1981-07-17 | Brochier & Fils | Materiau tisse complexe et articles stratifies realises a partir de ce materiau |
US4340630A (en) * | 1980-04-04 | 1982-07-20 | Doty Francis D | Low conductivity gas sealed building insulation |
US4420509A (en) * | 1981-08-11 | 1983-12-13 | Glasteel Tennessee, Inc. | Copper-clad polyester-glass fiber laminates |
US4622254A (en) * | 1981-08-31 | 1986-11-11 | Toray Industries, Inc. | Fiber material for reinforcing plastics |
JPS61129629A (ja) * | 1984-11-29 | 1986-06-17 | Canon Inc | 複合プラスチック遮光羽根 |
US4678821A (en) * | 1985-05-31 | 1987-07-07 | E. I. Du Pont De Nemours And Company | Composites |
DE3533413C2 (de) * | 1985-09-19 | 1995-06-22 | Held Kurt | Doppelbandpresse zur kontinuierlichen Herstellung kupferkaschierter Laminate |
IT1187392B (it) * | 1985-12-03 | 1987-12-23 | Reglass Spa | Struttura mulistrato per la realizzazione di elementi tubolari estremamente leggeri e resistenti,in particolare per la costruzione di canne da pesca |
US4943334A (en) * | 1986-09-15 | 1990-07-24 | Compositech Ltd. | Method for making reinforced plastic laminates for use in the production of circuit boards |
US5112667A (en) * | 1987-08-03 | 1992-05-12 | Allied-Signal Inc. | Impact resistant helmet |
US4875282A (en) * | 1987-09-18 | 1989-10-24 | Trw Inc. | Method of making multilayer printed circuit board |
US4814945A (en) * | 1987-09-18 | 1989-03-21 | Trw Inc. | Multilayer printed circuit board for ceramic chip carriers |
JPH0719937B2 (ja) * | 1987-09-24 | 1995-03-06 | 三井石油化学工業株式会社 | 高周波用積層板およびその製造方法 |
EP0309982A3 (en) * | 1987-09-30 | 1990-09-12 | E.I. Du Pont De Nemours And Company | Polymer-ceramic composite plies |
US4849281A (en) * | 1988-05-02 | 1989-07-18 | Owens-Corning Fiberglas Corporation | Glass mat comprising textile and wool fibers |
JPH01283996A (ja) * | 1988-05-11 | 1989-11-15 | Mitsubishi Electric Corp | 多層プリント配線板 |
US5039566A (en) * | 1988-06-27 | 1991-08-13 | Mcdonnell Douglas Corporation | Transparent composite material |
US4980217A (en) * | 1988-07-29 | 1990-12-25 | Grundfest Michael A | Printed circuit board fabrication |
FR2653599B1 (fr) * | 1989-10-23 | 1991-12-20 | Commissariat Energie Atomique | Materiau composite stratifie presentant des proprietes electromagnetiques absorbantes et son procede de fabrication. |
-
1992
- 1992-05-18 TW TW81103850A patent/TW224561B/zh active
- 1992-05-19 CA CA 2110678 patent/CA2110678A1/en not_active Abandoned
- 1992-05-19 DE DE69212315T patent/DE69212315T2/de not_active Expired - Fee Related
- 1992-05-19 BR BR9206095A patent/BR9206095A/pt not_active Application Discontinuation
- 1992-05-19 AU AU18845/92A patent/AU662743B2/en not_active Ceased
- 1992-05-19 JP JP4510424A patent/JPH06507758A/ja active Pending
- 1992-05-19 ES ES92911164T patent/ES2090645T3/es not_active Expired - Lifetime
- 1992-05-19 EP EP19920911164 patent/EP0587644B1/en not_active Expired - Lifetime
- 1992-05-19 AT AT92911164T patent/ATE140580T1/de active
- 1992-05-19 WO PCT/EP1992/001132 patent/WO1992022191A1/en active IP Right Grant
- 1992-05-19 KR KR1019930703766A patent/KR940701633A/ko not_active Application Discontinuation
- 1992-05-19 US US08/157,038 patent/US5496613A/en not_active Expired - Fee Related
- 1992-05-19 RU RU93058506A patent/RU2125351C1/ru active
-
1995
- 1995-12-13 AU AU40387/95A patent/AU686909B2/en not_active Ceased
-
1998
- 1998-04-29 HK HK98103677A patent/HK1004593A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW224561B (pt) | 1994-06-01 |
AU1884592A (en) | 1993-01-08 |
JPH06507758A (ja) | 1994-09-01 |
EP0587644B1 (en) | 1996-07-17 |
CA2110678A1 (en) | 1992-12-10 |
RU2125351C1 (ru) | 1999-01-20 |
KR940701633A (ko) | 1994-05-28 |
DE69212315T2 (de) | 1997-02-06 |
DE69212315D1 (de) | 1996-08-22 |
AU662743B2 (en) | 1995-09-14 |
ES2090645T3 (es) | 1996-10-16 |
AU4038795A (en) | 1996-04-04 |
EP0587644A1 (en) | 1994-03-23 |
HK1004593A1 (en) | 1998-11-27 |
ATE140580T1 (de) | 1996-08-15 |
WO1992022191A1 (en) | 1992-12-10 |
US5496613A (en) | 1996-03-05 |
AU686909B2 (en) | 1998-02-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EE | Request for examination | ||
HC | Change of name | ||
GB | Transfer | ||
FB36 | Technical and formal requirements: requirement - article 36 of industrial property law | ||
FF | Decision: intention to grant | ||
FA11 | Dismissal: dismissal - article 38, par. 2 of industrial property law |