BR8901962A - Solucao util para a deposicao nao eletrolitica do cobre;processo para a formacao de um deposito de cobre em um substrato;e processo para operacao de uma solucao de deposicao nao eletrolitica do cobre de modo a manter a qualidade do deposito e uma taxa de deposicao constante - Google Patents

Solucao util para a deposicao nao eletrolitica do cobre;processo para a formacao de um deposito de cobre em um substrato;e processo para operacao de uma solucao de deposicao nao eletrolitica do cobre de modo a manter a qualidade do deposito e uma taxa de deposicao constante

Info

Publication number
BR8901962A
BR8901962A BR898901962A BR8901962A BR8901962A BR 8901962 A BR8901962 A BR 8901962A BR 898901962 A BR898901962 A BR 898901962A BR 8901962 A BR8901962 A BR 8901962A BR 8901962 A BR8901962 A BR 8901962A
Authority
BR
Brazil
Prior art keywords
substrate
forming
useful solution
copper
deposit
Prior art date
Application number
BR898901962A
Other languages
English (en)
Portuguese (pt)
Inventor
Rowan Hughes
Milan Paunovic
Rudolph J Zeblisky
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of BR8901962A publication Critical patent/BR8901962A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
BR898901962A 1988-04-29 1989-04-26 Solucao util para a deposicao nao eletrolitica do cobre;processo para a formacao de um deposito de cobre em um substrato;e processo para operacao de uma solucao de deposicao nao eletrolitica do cobre de modo a manter a qualidade do deposito e uma taxa de deposicao constante BR8901962A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18782288A 1988-04-29 1988-04-29

Publications (1)

Publication Number Publication Date
BR8901962A true BR8901962A (pt) 1989-12-05

Family

ID=22690615

Family Applications (1)

Application Number Title Priority Date Filing Date
BR898901962A BR8901962A (pt) 1988-04-29 1989-04-26 Solucao util para a deposicao nao eletrolitica do cobre;processo para a formacao de um deposito de cobre em um substrato;e processo para operacao de uma solucao de deposicao nao eletrolitica do cobre de modo a manter a qualidade do deposito e uma taxa de deposicao constante

Country Status (8)

Country Link
EP (1) EP0340649B1 (fr)
JP (1) JPH07107193B2 (fr)
KR (1) KR890016207A (fr)
AU (1) AU3304389A (fr)
BR (1) BR8901962A (fr)
CA (1) CA1331420C (fr)
DE (1) DE3914180A1 (fr)
GB (2) GB2218714B (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
DE102011080745A1 (de) 2010-08-17 2012-02-23 Chemetall Gmbh Verfahren zur metallischen Beschichtung von metallischen Oberflächen durch stromloses Verkupfern

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux
FR1551275A (fr) * 1966-12-19 1968-12-27
ZA775495B (en) * 1976-11-22 1978-07-26 Kollmorgen Tech Corp Method and apparatus for control of electroless plating solutions
US4301196A (en) 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
CA1135903A (fr) * 1978-09-13 1982-11-23 John F. Mccormack Procede de cuivrage rapide, sans galvanisation sans electricite
JPS5627594A (en) * 1979-08-10 1981-03-17 Matsushita Electric Ind Co Ltd Remote controller
JPS6016517B2 (ja) * 1979-12-29 1985-04-25 上村工業株式会社 無電解めつき制御方法
JPS5927379A (ja) * 1982-08-09 1984-02-13 Hitachi Ltd パタ−ン映像信号処理方式
JPH0247550B2 (ja) * 1982-08-23 1990-10-22 Chusho Kigyo Jigyodan Mudenkaidometsukiekinokanrihoho
JPH0239596B2 (ja) * 1983-03-25 1990-09-06 Uemura Kogyo Kk Kagakudometsukinokontorooruhoho
KR920002710B1 (ko) * 1984-06-18 1992-03-31 가부시기가이샤 히다찌세이사꾸쇼 화학동도금방법
US4692346A (en) * 1986-04-21 1987-09-08 International Business Machines Corporation Method and apparatus for controlling the surface chemistry on objects plated in an electroless plating bath
US4814197A (en) * 1986-10-31 1989-03-21 Kollmorgen Corporation Control of electroless plating baths
EP0265895B1 (fr) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Procédé de dépôt chimique de cuivre de haute qualité

Also Published As

Publication number Publication date
DE3914180C2 (fr) 1991-04-18
GB2218714B (en) 1992-10-14
CA1331420C (fr) 1994-08-16
JPH07107193B2 (ja) 1995-11-15
DE3914180A1 (de) 1989-11-09
KR890016207A (ko) 1989-11-28
EP0340649B1 (fr) 1993-02-03
EP0340649A1 (fr) 1989-11-08
AU3304389A (en) 1989-11-02
JPH0270070A (ja) 1990-03-08
GB8909623D0 (en) 1989-06-14
GB2218714A (en) 1989-11-22
GB9220923D0 (en) 1992-11-18

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Legal Events

Date Code Title Description
EG Technical examination (opinion): publication of technical examination (opinion)
FC Decision: refusal