BR8201708A - Eletrolito acido aquoso e processo para eletrodepositar um revestimento de cobre bilhante nun substrato - Google Patents

Eletrolito acido aquoso e processo para eletrodepositar um revestimento de cobre bilhante nun substrato

Info

Publication number
BR8201708A
BR8201708A BR8201708A BR8201708A BR8201708A BR 8201708 A BR8201708 A BR 8201708A BR 8201708 A BR8201708 A BR 8201708A BR 8201708 A BR8201708 A BR 8201708A BR 8201708 A BR8201708 A BR 8201708A
Authority
BR
Brazil
Prior art keywords
billiant
electrolite
electrodeposit
substrate
aqueous acid
Prior art date
Application number
BR8201708A
Other languages
English (en)
Inventor
Linda Jean Mayer
Stephen Christopher Barbieri
Original Assignee
Hooker Chemicals Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hooker Chemicals Plastics Corp filed Critical Hooker Chemicals Plastics Corp
Publication of BR8201708A publication Critical patent/BR8201708A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
BR8201708A 1981-03-26 1982-03-25 Eletrolito acido aquoso e processo para eletrodepositar um revestimento de cobre bilhante nun substrato BR8201708A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/247,577 US4336114A (en) 1981-03-26 1981-03-26 Electrodeposition of bright copper

Publications (1)

Publication Number Publication Date
BR8201708A true BR8201708A (pt) 1983-02-22

Family

ID=22935434

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8201708A BR8201708A (pt) 1981-03-26 1982-03-25 Eletrolito acido aquoso e processo para eletrodepositar um revestimento de cobre bilhante nun substrato

Country Status (14)

Country Link
US (1) US4336114A (pt)
JP (1) JPS57188693A (pt)
AU (1) AU530827B2 (pt)
BE (1) BE892639A (pt)
BR (1) BR8201708A (pt)
CH (1) CH650278A5 (pt)
DE (1) DE3210286A1 (pt)
DK (1) DK137382A (pt)
ES (1) ES510803A0 (pt)
FR (1) FR2502648A1 (pt)
GB (1) GB2097020B (pt)
IT (1) IT1147927B (pt)
NL (1) NL8201279A (pt)
SE (1) SE8201310L (pt)

Families Citing this family (107)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3323476A1 (de) * 1982-07-01 1984-01-05 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen
AU559896B2 (en) * 1983-06-10 1987-03-26 Omi International Corp. Electrolytic copper depositing processes
AU554236B2 (en) * 1983-06-10 1986-08-14 Omi International Corp. Electrolyte composition and process for electrodepositing copper
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
DE3836521C2 (de) * 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades
EP0419845A3 (en) * 1989-09-05 1991-11-13 General Electric Company Method for preparing metallized polyimide composites
EP0785297B1 (de) * 1990-03-19 2000-01-05 ATOTECH Deutschland GmbH Wässriges, saures Bad zur galvanischen Abscheidung von glänzenden und rissfreien Kupferüberzügen und Verwendung dieses Bades
US6375741B2 (en) * 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
US5328589A (en) * 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
US6203582B1 (en) * 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
US6276072B1 (en) * 1997-07-10 2001-08-21 Applied Materials, Inc. Method and apparatus for heating and cooling substrates
US6936153B1 (en) 1997-09-30 2005-08-30 Semitool, Inc. Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face
US6454926B1 (en) * 1997-09-30 2002-09-24 Semitool Inc. Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas
US7244677B2 (en) 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
WO1999040615A1 (en) * 1998-02-04 1999-08-12 Semitool, Inc. Method and apparatus for low-temperature annealing of metallization micro-structures in the production of a microelectronic device
US6632292B1 (en) * 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
US6113771A (en) * 1998-04-21 2000-09-05 Applied Materials, Inc. Electro deposition chemistry
US6416647B1 (en) 1998-04-21 2002-07-09 Applied Materials, Inc. Electro-chemical deposition cell for face-up processing of single semiconductor substrates
WO1999054527A2 (en) 1998-04-21 1999-10-28 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
US6994776B2 (en) * 1998-06-01 2006-02-07 Semitool Inc. Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device
US6183622B1 (en) 1998-07-13 2001-02-06 Enthone-Omi, Inc. Ductility additives for electrorefining and electrowinning
US6267853B1 (en) 1999-07-09 2001-07-31 Applied Materials, Inc. Electro-chemical deposition system
US6228233B1 (en) 1998-11-30 2001-05-08 Applied Materials, Inc. Inflatable compliant bladder assembly
US6290865B1 (en) 1998-11-30 2001-09-18 Applied Materials, Inc. Spin-rinse-drying process for electroplated semiconductor wafers
US6258220B1 (en) 1998-11-30 2001-07-10 Applied Materials, Inc. Electro-chemical deposition system
US6254760B1 (en) 1999-03-05 2001-07-03 Applied Materials, Inc. Electro-chemical deposition system and method
US6544399B1 (en) 1999-01-11 2003-04-08 Applied Materials, Inc. Electrodeposition chemistry for filling apertures with reflective metal
US6379522B1 (en) 1999-01-11 2002-04-30 Applied Materials, Inc. Electrodeposition chemistry for filling of apertures with reflective metal
US7192494B2 (en) * 1999-03-05 2007-03-20 Applied Materials, Inc. Method and apparatus for annealing copper films
US6136163A (en) * 1999-03-05 2000-10-24 Applied Materials, Inc. Apparatus for electro-chemical deposition with thermal anneal chamber
US7109408B2 (en) * 1999-03-11 2006-09-19 Eneco, Inc. Solid state energy converter
US6551484B2 (en) 1999-04-08 2003-04-22 Applied Materials, Inc. Reverse voltage bias for electro-chemical plating system and method
US6585876B2 (en) 1999-04-08 2003-07-01 Applied Materials Inc. Flow diffuser to be used in electro-chemical plating system and method
US6571657B1 (en) 1999-04-08 2003-06-03 Applied Materials Inc. Multiple blade robot adjustment apparatus and associated method
US6551488B1 (en) * 1999-04-08 2003-04-22 Applied Materials, Inc. Segmenting of processing system into wet and dry areas
US6582578B1 (en) 1999-04-08 2003-06-24 Applied Materials, Inc. Method and associated apparatus for tilting a substrate upon entry for metal deposition
US6662673B1 (en) 1999-04-08 2003-12-16 Applied Materials, Inc. Linear motion apparatus and associated method
US6837978B1 (en) 1999-04-08 2005-01-04 Applied Materials, Inc. Deposition uniformity control for electroplating apparatus, and associated method
US6557237B1 (en) 1999-04-08 2003-05-06 Applied Materials, Inc. Removable modular cell for electro-chemical plating and method
US6444110B2 (en) * 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
US20030213772A9 (en) * 1999-07-09 2003-11-20 Mok Yeuk-Fai Edwin Integrated semiconductor substrate bevel cleaning apparatus and method
US6516815B1 (en) 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
US6406609B1 (en) * 2000-02-25 2002-06-18 Agere Systems Guardian Corp. Method of fabricating an integrated circuit
US6913680B1 (en) 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition
EP1337693A2 (en) 2000-05-23 2003-08-27 Applied Materials, Inc. Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
US20040079633A1 (en) * 2000-07-05 2004-04-29 Applied Materials, Inc. Apparatus for electro chemical deposition of copper metallization with the capability of in-situ thermal annealing
US6576110B2 (en) 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
US20020112964A1 (en) * 2000-07-12 2002-08-22 Applied Materials, Inc. Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths
US6436267B1 (en) 2000-08-29 2002-08-20 Applied Materials, Inc. Method for achieving copper fill of high aspect ratio interconnect features
AU2002215939A1 (en) * 2000-10-19 2002-04-29 Atotech Deutschland Gmbh Copper bath and method of depositing a matt copper coating
DE10058896C1 (de) * 2000-10-19 2002-06-13 Atotech Deutschland Gmbh Elektrolytisches Kupferbad, dessen Verwendung und Verfahren zur Abscheidung einer matten Kupferschicht
US6776893B1 (en) * 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
US6610189B2 (en) 2001-01-03 2003-08-26 Applied Materials, Inc. Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
US20040020780A1 (en) * 2001-01-18 2004-02-05 Hey H. Peter W. Immersion bias for use in electro-chemical plating system
US6478937B2 (en) 2001-01-19 2002-11-12 Applied Material, Inc. Substrate holder system with substrate extension apparatus and associated method
US6824612B2 (en) 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
US6770565B2 (en) 2002-01-08 2004-08-03 Applied Materials Inc. System for planarizing metal conductive layers
US20030146102A1 (en) * 2002-02-05 2003-08-07 Applied Materials, Inc. Method for forming copper interconnects
US7316772B2 (en) * 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
US6911136B2 (en) * 2002-04-29 2005-06-28 Applied Materials, Inc. Method for regulating the electrical power applied to a substrate during an immersion process
US7189313B2 (en) * 2002-05-09 2007-03-13 Applied Materials, Inc. Substrate support with fluid retention band
JP4115240B2 (ja) * 2002-10-21 2008-07-09 日鉱金属株式会社 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
CN100526515C (zh) 2002-12-18 2009-08-12 日矿金属株式会社 铜电解液和从该铜电解液制造出的电解铜箔
US7138039B2 (en) * 2003-01-21 2006-11-21 Applied Materials, Inc. Liquid isolation of contact rings
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
US7025861B2 (en) * 2003-02-06 2006-04-11 Applied Materials Contact plating apparatus
US6851200B2 (en) * 2003-03-14 2005-02-08 Hopkins Manufacturing Corporation Reflecting lighted level
US20040200725A1 (en) * 2003-04-09 2004-10-14 Applied Materials Inc. Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process
US20040211657A1 (en) * 2003-04-11 2004-10-28 Ingelbrecht Hugo Gerard Eduard Method of purifying 2,6-xylenol and method of producing poly(arylene ether) therefrom
US7205153B2 (en) 2003-04-11 2007-04-17 Applied Materials, Inc. Analytical reagent for acid copper sulfate solutions
US7311810B2 (en) * 2003-04-18 2007-12-25 Applied Materials, Inc. Two position anneal chamber
US20040206628A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Electrical bias during wafer exit from electrolyte bath
US20040206373A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Spin rinse dry cell
US7128822B2 (en) * 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
US20050092602A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a membrane stack
US20050092601A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a diffusion member
US20050218000A1 (en) * 2004-04-06 2005-10-06 Applied Materials, Inc. Conditioning of contact leads for metal plating systems
US20050230262A1 (en) * 2004-04-20 2005-10-20 Semitool, Inc. Electrochemical methods for the formation of protective features on metallized features
US7285195B2 (en) * 2004-06-24 2007-10-23 Applied Materials, Inc. Electric field reducing thrust plate
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
TW200632147A (pt) 2004-11-12 2006-09-16
US20060102467A1 (en) * 2004-11-15 2006-05-18 Harald Herchen Current collimation for thin seed and direct plating
US20060175201A1 (en) * 2005-02-07 2006-08-10 Hooman Hafezi Immersion process for electroplating applications
US20070014958A1 (en) * 2005-07-08 2007-01-18 Chaplin Ernest R Hanger labels, label assemblies and methods for forming the same
US7662981B2 (en) * 2005-07-16 2010-02-16 Rohm And Haas Electronic Materials Llc Leveler compounds
US7851222B2 (en) * 2005-07-26 2010-12-14 Applied Materials, Inc. System and methods for measuring chemical concentrations of a plating solution
GB0520793D0 (en) * 2005-10-13 2005-11-23 Avecia Inkjet Ltd Phthalocyanine inks and their use in ink-jet printing
US20070178697A1 (en) * 2006-02-02 2007-08-02 Enthone Inc. Copper electrodeposition in microelectronics
US7887693B2 (en) * 2007-06-22 2011-02-15 Maria Nikolova Acid copper electroplating bath composition
JP2009041097A (ja) * 2007-08-10 2009-02-26 Rohm & Haas Electronic Materials Llc 銅めっき方法
JP5442188B2 (ja) * 2007-08-10 2014-03-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 銅めっき液組成物
US7905994B2 (en) 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
JPWO2009116432A1 (ja) * 2008-03-17 2011-07-21 Jx日鉱日石金属株式会社 電解銅箔製造用の電解液
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
JP2012127003A (ja) 2010-12-15 2012-07-05 Rohm & Haas Electronic Materials Llc 銅層を均一にする電気めっき方法
CN103397354B (zh) * 2013-08-08 2016-10-26 上海新阳半导体材料股份有限公司 一种用于减少硅通孔技术镀铜退火后空洞的添加剂
DE202014105882U1 (de) 2013-12-06 2014-12-17 Ulrich Reif Anordnung zur Verbindung von Bauteilen, insbesondere von zwei Bauteilen einer Unterkonstruktion, insbesondere für Balkon- und Terrassenabdeckungen
US10519557B2 (en) 2016-02-12 2019-12-31 Macdermid Enthone Inc. Leveler compositions for use in copper deposition in manufacture of microelectronics
CN109996785B (zh) * 2016-09-22 2021-12-28 麦克德米德乐思公司 集成电路的晶圆级封装中的铜沉积
EP3415664B1 (en) * 2017-06-16 2019-09-18 ATOTECH Deutschland GmbH Aqueous acidic copper electroplating bath and method for electrolytically depositing of a copper coating
KR20200131909A (ko) 2018-04-09 2020-11-24 램 리써치 코포레이션 비-구리 라이너 층들 상의 구리 전기충진 (electrofill)
CN112390947B (zh) * 2019-08-16 2023-04-28 位速科技股份有限公司 电极界面层材料、两性离子聚合物和有机光伏元件
US11512406B2 (en) 2019-10-17 2022-11-29 Rohm And Haas Electronic Materials Llc Method of enhancing copper electroplating

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL291575A (pt) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
ES440918A1 (es) * 1975-03-11 1977-06-01 Oxy Metal Industries Corp Un metodo para la preparacion de una poli (sal de alcanol- amonio cuaternario).
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper

Also Published As

Publication number Publication date
JPS57188693A (en) 1982-11-19
DK137382A (da) 1982-09-27
AU530827B2 (en) 1983-07-28
SE8201310L (sv) 1982-09-27
NL8201279A (nl) 1982-10-18
BE892639A (fr) 1982-09-27
CH650278A5 (de) 1985-07-15
IT1147927B (it) 1986-11-26
AU8130782A (en) 1982-11-04
IT8248069A0 (it) 1982-03-24
FR2502648A1 (fr) 1982-10-01
US4336114A (en) 1982-06-22
ES8305852A1 (es) 1983-04-16
GB2097020A (en) 1982-10-27
DE3210286A1 (de) 1982-12-09
GB2097020B (en) 1984-06-27
ES510803A0 (es) 1983-04-16

Similar Documents

Publication Publication Date Title
BR8201708A (pt) Eletrolito acido aquoso e processo para eletrodepositar um revestimento de cobre bilhante nun substrato
BR8403905A (pt) Banho aquoso e processo para eletrodepositar zinco e ligas de zinco em um substrato condutor
BR8504760A (pt) Processo para preparar um xarope
BR8506237A (pt) Processo e aparelho para fabricar acido tereftalico
BR8504918A (pt) Processo de revestimento com ptfe
BR8404460A (pt) Processo para revestir um substrato
BR8107254A (pt) Eletrolito de cromo trivalente acido aquoso,processo para eletrogalvanizacao de um deposito de cromo sobre um substrato eletricamente condutor e processo para rejuvenescimento de um eletrolito de cromo trivalente acido aquoso
PT88295A (pt) Processo para a preparacao de revestimento resistente a corrosao e curado a baixa temperatura para electrodeposito catodico
BR8404652A (pt) Processo para inibira corrosao de uma superficie de metal em um sistema aquoso
BR7900283A (pt) Banho galvanico e processo para depositar um revestimento
BR8206256A (pt) Composicao acida aquosa aperfeicoada e processo aperfeicoado para formar um revestimento de conversao de fosfato de metal sobre uma superficie de metal
BR8401203A (pt) Substrato de metal revestido;artigo de metal revestido;processo para preparar substrato e artigo de metal revestido
BR8504846A (pt) Eletrolito acido aquoso e processo para eletrodepositar uma liga de zinco sobre um substrato condutor
BR7901944A (pt) Solucao acida aquosa para revestir a superficie de um metal;solucao acida aquosa,usada,para revestir a superficie de um metal;e processo para revestir a superficie de um metal
BR8301606A (pt) Banho de eletrodeposicao de niquel aquoso acido e processo para a producao de depositos de niquel
BR8502384A (pt) Eletrolito de zinco acido aquoso e processo para a eletrodeposicao de zinco sobre um substrato condutor
BR8106433A (pt) Composicao de revestimento e processo para revestir um substrato
BR8300436A (pt) Banho de eletrodeposicao acido aquoso, processo para a producao de um eletrodeposito de zinco - cobalto semibrilhante a brilhante sobre um substrato condutor, e artigo
BR8403535A (pt) Solucao acida aguosa isenta de peroxido para tratamento de substratos de metal receptivos e processo para tratamento de um substrato de metal receptivo
BR8402811A (pt) Eletrolito acido aquoso e processo para eletrodeposicao de um deposito de cobre nivelado,brilhante,sobre um substrato condutor
BR8900621A (pt) Processo para preparar acido n-fosfono-metil-imino-diacetico
BR8300091A (pt) Processo para eletrodeposicao de cromo sobre um substrato condutor e processo para rejuvenecer um eletrolito aquoso acido de cromo trivalente
BR8007548A (pt) Solucao aquosa acida de revestimento de zinco e processo de deposicao eletrolitica de revestimento de zinco
BR8600803A (pt) Processo para produzir condensadores
BR9000399A (pt) Processo para descolorir um acido alcanosulfonico ou arenosulfonico