BE892639A - Electrodeposition de cuivre brillant - Google Patents

Electrodeposition de cuivre brillant

Info

Publication number
BE892639A
BE892639A BE0/207672A BE207672A BE892639A BE 892639 A BE892639 A BE 892639A BE 0/207672 A BE0/207672 A BE 0/207672A BE 207672 A BE207672 A BE 207672A BE 892639 A BE892639 A BE 892639A
Authority
BE
Belgium
Prior art keywords
electrodeposition
brilliant copper
brilliant
copper
Prior art date
Application number
BE0/207672A
Other languages
English (en)
Inventor
L J Mayer
S C Barbieri
Original Assignee
Hooker Chemicals Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hooker Chemicals Plastics Corp filed Critical Hooker Chemicals Plastics Corp
Publication of BE892639A publication Critical patent/BE892639A/fr

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
BE0/207672A 1981-03-26 1982-03-25 Electrodeposition de cuivre brillant BE892639A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/247,577 US4336114A (en) 1981-03-26 1981-03-26 Electrodeposition of bright copper

Publications (1)

Publication Number Publication Date
BE892639A true BE892639A (fr) 1982-09-27

Family

ID=22935434

Family Applications (1)

Application Number Title Priority Date Filing Date
BE0/207672A BE892639A (fr) 1981-03-26 1982-03-25 Electrodeposition de cuivre brillant

Country Status (14)

Country Link
US (1) US4336114A (fr)
JP (1) JPS57188693A (fr)
AU (1) AU530827B2 (fr)
BE (1) BE892639A (fr)
BR (1) BR8201708A (fr)
CH (1) CH650278A5 (fr)
DE (1) DE3210286A1 (fr)
DK (1) DK137382A (fr)
ES (1) ES510803A0 (fr)
FR (1) FR2502648A1 (fr)
GB (1) GB2097020B (fr)
IT (1) IT1147927B (fr)
NL (1) NL8201279A (fr)
SE (1) SE8201310L (fr)

Families Citing this family (107)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3323476A1 (de) * 1982-07-01 1984-01-05 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen
AU559896B2 (en) * 1983-06-10 1987-03-26 Omi International Corp. Electrolytic copper depositing processes
AU554236B2 (en) * 1983-06-10 1986-08-14 Omi International Corp. Electrolyte composition and process for electrodepositing copper
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
DE3836521C2 (de) * 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades
EP0419845A3 (en) * 1989-09-05 1991-11-13 General Electric Company Method for preparing metallized polyimide composites
DE59700942D1 (de) * 1990-03-19 2000-02-10 Atotech Deutschland Gmbh Wässriges, saures Bad zur galvanischen Abscheidung von glänzenden und rissfreien Kupferüberzügen und Verwendung dieses Bades
US6375741B2 (en) 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
US5328589A (en) * 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
US6203582B1 (en) * 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
US6276072B1 (en) * 1997-07-10 2001-08-21 Applied Materials, Inc. Method and apparatus for heating and cooling substrates
US6936153B1 (en) 1997-09-30 2005-08-30 Semitool, Inc. Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face
US6454926B1 (en) 1997-09-30 2002-09-24 Semitool Inc. Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas
US7244677B2 (en) 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
WO1999040615A1 (fr) * 1998-02-04 1999-08-12 Semitool, Inc. Procede et appareil de recuit a basse temperature intervenant apres metallisation de microstructures destinees a un dispositif micro-electronique
US6632292B1 (en) * 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
US6416647B1 (en) 1998-04-21 2002-07-09 Applied Materials, Inc. Electro-chemical deposition cell for face-up processing of single semiconductor substrates
US6113771A (en) 1998-04-21 2000-09-05 Applied Materials, Inc. Electro deposition chemistry
EP0991795B1 (fr) 1998-04-21 2006-02-22 Applied Materials, Inc. Systeme de depot electrochimique et procede de galvanoplastie sur substrats
US6994776B2 (en) * 1998-06-01 2006-02-07 Semitool Inc. Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device
US6183622B1 (en) 1998-07-13 2001-02-06 Enthone-Omi, Inc. Ductility additives for electrorefining and electrowinning
US6228233B1 (en) 1998-11-30 2001-05-08 Applied Materials, Inc. Inflatable compliant bladder assembly
US6267853B1 (en) 1999-07-09 2001-07-31 Applied Materials, Inc. Electro-chemical deposition system
US6290865B1 (en) 1998-11-30 2001-09-18 Applied Materials, Inc. Spin-rinse-drying process for electroplated semiconductor wafers
US6258220B1 (en) 1998-11-30 2001-07-10 Applied Materials, Inc. Electro-chemical deposition system
US6254760B1 (en) 1999-03-05 2001-07-03 Applied Materials, Inc. Electro-chemical deposition system and method
US6379522B1 (en) 1999-01-11 2002-04-30 Applied Materials, Inc. Electrodeposition chemistry for filling of apertures with reflective metal
US6544399B1 (en) 1999-01-11 2003-04-08 Applied Materials, Inc. Electrodeposition chemistry for filling apertures with reflective metal
US7192494B2 (en) * 1999-03-05 2007-03-20 Applied Materials, Inc. Method and apparatus for annealing copper films
US6136163A (en) * 1999-03-05 2000-10-24 Applied Materials, Inc. Apparatus for electro-chemical deposition with thermal anneal chamber
US7109408B2 (en) * 1999-03-11 2006-09-19 Eneco, Inc. Solid state energy converter
US6571657B1 (en) 1999-04-08 2003-06-03 Applied Materials Inc. Multiple blade robot adjustment apparatus and associated method
US6585876B2 (en) 1999-04-08 2003-07-01 Applied Materials Inc. Flow diffuser to be used in electro-chemical plating system and method
US6582578B1 (en) 1999-04-08 2003-06-24 Applied Materials, Inc. Method and associated apparatus for tilting a substrate upon entry for metal deposition
US6551488B1 (en) * 1999-04-08 2003-04-22 Applied Materials, Inc. Segmenting of processing system into wet and dry areas
US6551484B2 (en) 1999-04-08 2003-04-22 Applied Materials, Inc. Reverse voltage bias for electro-chemical plating system and method
US6662673B1 (en) 1999-04-08 2003-12-16 Applied Materials, Inc. Linear motion apparatus and associated method
US6837978B1 (en) 1999-04-08 2005-01-04 Applied Materials, Inc. Deposition uniformity control for electroplating apparatus, and associated method
US6557237B1 (en) 1999-04-08 2003-05-06 Applied Materials, Inc. Removable modular cell for electro-chemical plating and method
US6444110B2 (en) * 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
US6516815B1 (en) 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
US20030213772A9 (en) * 1999-07-09 2003-11-20 Mok Yeuk-Fai Edwin Integrated semiconductor substrate bevel cleaning apparatus and method
US6406609B1 (en) 2000-02-25 2002-06-18 Agere Systems Guardian Corp. Method of fabricating an integrated circuit
US6913680B1 (en) 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition
US6808612B2 (en) 2000-05-23 2004-10-26 Applied Materials, Inc. Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
US20040079633A1 (en) * 2000-07-05 2004-04-29 Applied Materials, Inc. Apparatus for electro chemical deposition of copper metallization with the capability of in-situ thermal annealing
US6576110B2 (en) 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
US20020112964A1 (en) * 2000-07-12 2002-08-22 Applied Materials, Inc. Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths
US6436267B1 (en) 2000-08-29 2002-08-20 Applied Materials, Inc. Method for achieving copper fill of high aspect ratio interconnect features
WO2002033153A2 (fr) * 2000-10-19 2002-04-25 Atotech Deutschland Gmbh Bain de cuivre et procede de depot d'un revetement de cuivre mat
DE10058896C1 (de) * 2000-10-19 2002-06-13 Atotech Deutschland Gmbh Elektrolytisches Kupferbad, dessen Verwendung und Verfahren zur Abscheidung einer matten Kupferschicht
US6776893B1 (en) * 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
US6610189B2 (en) 2001-01-03 2003-08-26 Applied Materials, Inc. Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
US20040020780A1 (en) * 2001-01-18 2004-02-05 Hey H. Peter W. Immersion bias for use in electro-chemical plating system
US6478937B2 (en) 2001-01-19 2002-11-12 Applied Material, Inc. Substrate holder system with substrate extension apparatus and associated method
US6824612B2 (en) 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
US6770565B2 (en) 2002-01-08 2004-08-03 Applied Materials Inc. System for planarizing metal conductive layers
US20030146102A1 (en) * 2002-02-05 2003-08-07 Applied Materials, Inc. Method for forming copper interconnects
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
US7316772B2 (en) * 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
US6911136B2 (en) * 2002-04-29 2005-06-28 Applied Materials, Inc. Method for regulating the electrical power applied to a substrate during an immersion process
US7189313B2 (en) * 2002-05-09 2007-03-13 Applied Materials, Inc. Substrate support with fluid retention band
JP4115240B2 (ja) * 2002-10-21 2008-07-09 日鉱金属株式会社 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
EP1574599B1 (fr) * 2002-12-18 2010-07-07 Nippon Mining & Metals Co., Ltd. Solution electrolytique au cuivre et feuille electrolytique de cuivre ainsi produite
US7138039B2 (en) * 2003-01-21 2006-11-21 Applied Materials, Inc. Liquid isolation of contact rings
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
US7025861B2 (en) 2003-02-06 2006-04-11 Applied Materials Contact plating apparatus
US6851200B2 (en) * 2003-03-14 2005-02-08 Hopkins Manufacturing Corporation Reflecting lighted level
US20040200725A1 (en) * 2003-04-09 2004-10-14 Applied Materials Inc. Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process
US7205153B2 (en) 2003-04-11 2007-04-17 Applied Materials, Inc. Analytical reagent for acid copper sulfate solutions
US20040211657A1 (en) * 2003-04-11 2004-10-28 Ingelbrecht Hugo Gerard Eduard Method of purifying 2,6-xylenol and method of producing poly(arylene ether) therefrom
US20040206373A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Spin rinse dry cell
US7311810B2 (en) * 2003-04-18 2007-12-25 Applied Materials, Inc. Two position anneal chamber
US20040206628A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Electrical bias during wafer exit from electrolyte bath
US7128822B2 (en) * 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
US20050092602A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a membrane stack
US20050092601A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a diffusion member
US20050218000A1 (en) * 2004-04-06 2005-10-06 Applied Materials, Inc. Conditioning of contact leads for metal plating systems
US20050230262A1 (en) * 2004-04-20 2005-10-20 Semitool, Inc. Electrochemical methods for the formation of protective features on metallized features
US7285195B2 (en) * 2004-06-24 2007-10-23 Applied Materials, Inc. Electric field reducing thrust plate
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
TW200632147A (fr) * 2004-11-12 2006-09-16
US20060102467A1 (en) * 2004-11-15 2006-05-18 Harald Herchen Current collimation for thin seed and direct plating
US20060175201A1 (en) * 2005-02-07 2006-08-10 Hooman Hafezi Immersion process for electroplating applications
US20070014958A1 (en) * 2005-07-08 2007-01-18 Chaplin Ernest R Hanger labels, label assemblies and methods for forming the same
US7662981B2 (en) * 2005-07-16 2010-02-16 Rohm And Haas Electronic Materials Llc Leveler compounds
US7851222B2 (en) * 2005-07-26 2010-12-14 Applied Materials, Inc. System and methods for measuring chemical concentrations of a plating solution
GB0520793D0 (en) * 2005-10-13 2005-11-23 Avecia Inkjet Ltd Phthalocyanine inks and their use in ink-jet printing
US20070178697A1 (en) * 2006-02-02 2007-08-02 Enthone Inc. Copper electrodeposition in microelectronics
US7887693B2 (en) * 2007-06-22 2011-02-15 Maria Nikolova Acid copper electroplating bath composition
JP5442188B2 (ja) * 2007-08-10 2014-03-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 銅めっき液組成物
JP2009041097A (ja) * 2007-08-10 2009-02-26 Rohm & Haas Electronic Materials Llc 銅めっき方法
US7905994B2 (en) 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
WO2009116432A1 (fr) * 2008-03-17 2009-09-24 日鉱金属株式会社 Solution électrolytique pour production de feuille de cuivre électrolytique
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
EP2465976B1 (fr) 2010-12-15 2013-04-03 Rohm and Haas Electronic Materials LLC Procédé de dépôt électrique de couches de cuivre uniformes sur les coins et les parois des trous d'un substrat
CN103397354B (zh) * 2013-08-08 2016-10-26 上海新阳半导体材料股份有限公司 一种用于减少硅通孔技术镀铜退火后空洞的添加剂
EP2899411A1 (fr) 2013-12-06 2015-07-29 Ulrich Reif Système de liaison de composants, en particulier de deux composants d'une infrastructure, en particulier de couvertures de terrasse et de balcon
US10519557B2 (en) 2016-02-12 2019-12-31 Macdermid Enthone Inc. Leveler compositions for use in copper deposition in manufacture of microelectronics
CN114420633A (zh) 2016-09-22 2022-04-29 麦克德米德乐思公司 集成电路的晶圆级封装中的铜沉积
ES2761883T3 (es) 2017-06-16 2020-05-21 Atotech Deutschland Gmbh Baño de galvanoplastia de cobre ácido acuoso y método para depositar electrolíticamente un revestimiento de cobre
KR20200131909A (ko) 2018-04-09 2020-11-24 램 리써치 코포레이션 비-구리 라이너 층들 상의 구리 전기충진 (electrofill)
CN112390947B (zh) * 2019-08-16 2023-04-28 位速科技股份有限公司 电极界面层材料、两性离子聚合物和有机光伏元件
US11512406B2 (en) 2019-10-17 2022-11-29 Rohm And Haas Electronic Materials Llc Method of enhancing copper electroplating

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL291575A (fr) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
BE833384A (fr) * 1975-03-11 1976-03-12 Electrodeposition du cuivre
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper

Also Published As

Publication number Publication date
US4336114A (en) 1982-06-22
DE3210286A1 (de) 1982-12-09
GB2097020B (en) 1984-06-27
AU8130782A (en) 1982-11-04
IT8248069A0 (it) 1982-03-24
JPS57188693A (en) 1982-11-19
IT1147927B (it) 1986-11-26
AU530827B2 (en) 1983-07-28
ES8305852A1 (es) 1983-04-16
BR8201708A (pt) 1983-02-22
DK137382A (da) 1982-09-27
ES510803A0 (es) 1983-04-16
SE8201310L (sv) 1982-09-27
CH650278A5 (de) 1985-07-15
GB2097020A (en) 1982-10-27
FR2502648A1 (fr) 1982-10-01
NL8201279A (nl) 1982-10-18

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: HOOKER CHEMICALS & PLASTICS CORP.

Effective date: 19840325