BR7907098A - Composicao de revestimento para a producao de revestimentos fotocuraveis, processo para formar um revestimento de uma composicao fotopolimerizavel, e, processo para formar um modelo de solda sobre uma camada de um metal eletricamente condutor - Google Patents

Composicao de revestimento para a producao de revestimentos fotocuraveis, processo para formar um revestimento de uma composicao fotopolimerizavel, e, processo para formar um modelo de solda sobre uma camada de um metal eletricamente condutor

Info

Publication number
BR7907098A
BR7907098A BR7907098A BR7907098A BR7907098A BR 7907098 A BR7907098 A BR 7907098A BR 7907098 A BR7907098 A BR 7907098A BR 7907098 A BR7907098 A BR 7907098A BR 7907098 A BR7907098 A BR 7907098A
Authority
BR
Brazil
Prior art keywords
composition
coverage
production
metal layer
electrically conductive
Prior art date
Application number
BR7907098A
Other languages
English (en)
Portuguese (pt)
Inventor
S Parker
R Courtney
A Threadgold
Original Assignee
Coates Brothers & Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coates Brothers & Co filed Critical Coates Brothers & Co
Publication of BR7907098A publication Critical patent/BR7907098A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/026—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from the reaction products of polyepoxides and unsaturated monocarboxylic acids, their anhydrides, halogenides or esters with low molecular weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
BR7907098A 1978-11-01 1979-10-31 Composicao de revestimento para a producao de revestimentos fotocuraveis, processo para formar um revestimento de uma composicao fotopolimerizavel, e, processo para formar um modelo de solda sobre uma camada de um metal eletricamente condutor BR7907098A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7842748 1978-11-01

Publications (1)

Publication Number Publication Date
BR7907098A true BR7907098A (pt) 1980-10-07

Family

ID=10500726

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7907098A BR7907098A (pt) 1978-11-01 1979-10-31 Composicao de revestimento para a producao de revestimentos fotocuraveis, processo para formar um revestimento de uma composicao fotopolimerizavel, e, processo para formar um modelo de solda sobre uma camada de um metal eletricamente condutor

Country Status (10)

Country Link
JP (1) JPS6032360B2 (da)
BR (1) BR7907098A (da)
CH (1) CH645395A5 (da)
DE (1) DE2944097A1 (da)
DK (1) DK460579A (da)
FR (1) FR2440978B1 (da)
HK (1) HK75587A (da)
IT (1) IT1124219B (da)
NO (1) NO159729C (da)
SE (1) SE445647B (da)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR8103183A (pt) * 1980-05-27 1982-02-09 Du Pont Camada foto-sensivel fina;elemento foto-resistor;substrato com uma camada foto-sensivel fina laminada;e processo para aparacao de camada foto-sensivel e de um material polimerico fino
JPS62178542A (ja) * 1986-01-30 1987-08-05 Nippon Kayaku Co Ltd （メタ）アクリル酸エステル及びコ−テイング又は印刷インキ用反応性化合物
EP0281808B1 (de) * 1987-03-12 1994-07-20 Siemens Aktiengesellschaft Strahlungsvernetzbares Polymersystem zur Anwendung als Photoresist und Dielektrikum für Mikroverdrahtungen
CA2055833C (en) * 1990-11-20 2001-04-24 Katsue Nishikawa Preparation of unsaturated epoxy ester resin and carboxylated unsaturated epoxy ester resin and photosensitive composition comprising the same
WO2009110503A1 (ja) 2008-03-05 2009-09-11 株式会社日本触媒 重合体、硬化性樹脂組成物、硬化物、及び物品

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1549956A (da) * 1967-03-02 1968-12-13
US3661576A (en) * 1970-02-09 1972-05-09 Brady Co W H Photopolymerizable compositions and articles
US3876432A (en) * 1972-09-11 1975-04-08 Sun Chemical Corp Fatty ester modified epoxy resin photopolymerizable compositions
DE2326314C2 (de) * 1973-05-23 1983-10-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von Reliefstrukturen
JPS5017827A (da) * 1973-06-18 1975-02-25
FR2255629B1 (da) * 1973-12-20 1976-10-22 Ibm
US4072592A (en) * 1974-05-20 1978-02-07 Mobil Oil Corporation Radiation curable coating
US4003877A (en) * 1974-05-24 1977-01-18 Dynachem Corporation Photopolymerizable screen printing inks for permanent coatings prepared from aryloxyalkyl compositions
DE2534012C3 (de) * 1975-07-30 1981-05-14 Bayer Ag, 5090 Leverkusen Verfahren zur Herstellung von Bindemitteln
DE2702660C3 (de) * 1976-01-27 1980-07-10 Ppg Industries, Inc., Pittsburgh, Pa. (V.St.A.) Durch Strahlung härtbare Überzugsmasse und Verfahren zu ihrer Herstellung
JPS52117985A (en) * 1976-03-30 1977-10-03 Hitachi Chem Co Ltd Photosensitive polymer composition
CA1116919A (en) * 1976-10-27 1982-01-26 Joseph E. Gervay Flame retardant radiation sensitive element of photopolymerizable composition containing halogen and an acrylonitrile containing polymeric binder

Also Published As

Publication number Publication date
NO159729C (no) 1989-02-01
HK75587A (en) 1987-10-23
SE7909024L (sv) 1980-05-02
NO793475L (no) 1980-05-05
FR2440978B1 (fr) 1985-07-19
SE445647B (sv) 1986-07-07
JPS5562976A (en) 1980-05-12
JPS6032360B2 (ja) 1985-07-27
NO159729B (no) 1988-10-24
IT7912796A0 (it) 1979-10-31
DE2944097A1 (de) 1980-05-14
DK460579A (da) 1980-05-02
IT1124219B (it) 1986-05-07
DE2944097C2 (da) 1988-07-28
FR2440978A1 (fr) 1980-06-06
CH645395A5 (en) 1984-09-28

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Legal Events

Date Code Title Description
MK Patent expired

Effective date: 19941031

B15K Others concerning applications: alteration of classification

Ipc: C08F 299/02 (2006.01), G03F 7/038 (2006.0