BR122022021687B1 - Dispositivo termoelétrico - Google Patents

Dispositivo termoelétrico Download PDF

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Publication number
BR122022021687B1
BR122022021687B1 BR122022021687-0A BR122022021687A BR122022021687B1 BR 122022021687 B1 BR122022021687 B1 BR 122022021687B1 BR 122022021687 A BR122022021687 A BR 122022021687A BR 122022021687 B1 BR122022021687 B1 BR 122022021687B1
Authority
BR
Brazil
Prior art keywords
pellet
metal
thermoelectric
thermal
thermoelectric device
Prior art date
Application number
BR122022021687-0A
Other languages
English (en)
Portuguese (pt)
Inventor
Ronald Petkie
John B. Newman
Ion M. Basa
Original Assignee
Ats Ip, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ats Ip, Llc filed Critical Ats Ip, Llc
Publication of BR122022021687B1 publication Critical patent/BR122022021687B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Die Bonding (AREA)
  • Photovoltaic Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
BR122022021687-0A 2018-11-16 2019-11-16 Dispositivo termoelétrico BR122022021687B1 (pt)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201862768679P 2018-11-16 2018-11-16
US62/768,679 2018-11-16
BR112021009454-7A BR112021009454B1 (pt) 2018-11-16 2019-11-16 Método para produzir um dispositivo termoelétrico
PCT/US2019/061894 WO2020102785A1 (en) 2018-11-16 2019-11-16 Thermal lensing electrode in thermoelectric generators for improved performance

Publications (1)

Publication Number Publication Date
BR122022021687B1 true BR122022021687B1 (pt) 2023-10-10

Family

ID=70730616

Family Applications (2)

Application Number Title Priority Date Filing Date
BR122022021687-0A BR122022021687B1 (pt) 2018-11-16 2019-11-16 Dispositivo termoelétrico
BR112021009454-7A BR112021009454B1 (pt) 2018-11-16 2019-11-16 Método para produzir um dispositivo termoelétrico

Family Applications After (1)

Application Number Title Priority Date Filing Date
BR112021009454-7A BR112021009454B1 (pt) 2018-11-16 2019-11-16 Método para produzir um dispositivo termoelétrico

Country Status (11)

Country Link
US (3) US11552235B2 (https=)
EP (2) EP3881364B1 (https=)
JP (2) JP7453973B2 (https=)
KR (3) KR102582909B1 (https=)
CN (1) CN113272979B (https=)
AU (3) AU2019381834B2 (https=)
BR (2) BR122022021687B1 (https=)
CA (2) CA3119766A1 (https=)
MX (1) MX2021005722A (https=)
PH (1) PH12021551110A1 (https=)
WO (1) WO2020102785A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12035630B2 (en) * 2019-08-30 2024-07-09 Sumitomo Electric Industries, Ltd. Thermoelectric conversion material, thermoelectric conversion element, thermoelectric conversion module, and optical sensor
WO2023201062A1 (en) * 2022-04-15 2023-10-19 Ats Ip, Llc Unipolar thermoelectric generator with vertical interconnects and thermal focusing
EP4508954A1 (en) * 2022-04-15 2025-02-19 Ats Ip, Llc Unipolar thermoelectric generator with vertical interconnects and thermal focusing

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Also Published As

Publication number Publication date
AU2023274153B2 (en) 2025-10-09
KR20240010530A (ko) 2024-01-23
KR20210090679A (ko) 2021-07-20
AU2023274153A1 (en) 2023-12-21
KR20230142637A (ko) 2023-10-11
EP3881364A4 (en) 2022-08-10
AU2019381834A1 (en) 2021-06-03
BR112021009454A2 (pt) 2021-08-10
BR112021009454B1 (pt) 2023-09-26
JP7453973B2 (ja) 2024-03-21
WO2020102785A1 (en) 2020-05-22
BR112021009454A8 (pt) 2022-12-20
US12538705B2 (en) 2026-01-27
US11476401B2 (en) 2022-10-18
CN113272979B (zh) 2024-12-27
CA3220666A1 (en) 2020-05-22
PH12021551110A1 (en) 2021-12-13
KR102623260B1 (ko) 2024-01-10
JP2024060023A (ja) 2024-05-01
EP4733436A2 (en) 2026-04-29
US20210005803A1 (en) 2021-01-07
KR102582909B1 (ko) 2023-09-26
KR102755045B1 (ko) 2025-01-21
JP2022513060A (ja) 2022-02-07
MX2021005722A (es) 2021-09-23
AU2025283525A1 (en) 2026-01-15
US20230144491A1 (en) 2023-05-11
EP3881364B1 (en) 2026-04-15
US20200403135A1 (en) 2020-12-24
EP3881364A1 (en) 2021-09-22
CA3119766A1 (en) 2020-05-22
US11552235B2 (en) 2023-01-10
JP7702215B2 (ja) 2025-07-03
AU2019381834B2 (en) 2023-12-07
CN113272979A (zh) 2021-08-17

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 16/11/2019, OBSERVADAS AS CONDICOES LEGAIS