BR112022008047A2 - Aparelho de exibição - Google Patents

Aparelho de exibição

Info

Publication number
BR112022008047A2
BR112022008047A2 BR112022008047A BR112022008047A BR112022008047A2 BR 112022008047 A2 BR112022008047 A2 BR 112022008047A2 BR 112022008047 A BR112022008047 A BR 112022008047A BR 112022008047 A BR112022008047 A BR 112022008047A BR 112022008047 A2 BR112022008047 A2 BR 112022008047A2
Authority
BR
Brazil
Prior art keywords
led sub
assembly
emitting elements
light emitting
disposed
Prior art date
Application number
BR112022008047A
Other languages
English (en)
Portuguese (pt)
Inventor
Hoon Lee Chung
Sung Cho Dae
Original Assignee
Seoul Viosys Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seoul Viosys Co Ltd filed Critical Seoul Viosys Co Ltd
Publication of BR112022008047A2 publication Critical patent/BR112022008047A2/pt

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142Two-dimensional arrangements, e.g. asymmetric LED layout
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/813Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • H10H20/8314Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • H10H20/8316Multi-layer electrodes comprising at least one discontinuous layer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402Wafer tapes, e.g. grinding or dicing support tapes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/032Manufacture or treatment of electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/034Manufacture or treatment of coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0363Manufacture or treatment of packages of optical field-shaping means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0364Manufacture or treatment of packages of interconnections

Landscapes

  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
BR112022008047A 2019-10-29 2020-10-29 Aparelho de exibição BR112022008047A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962927196P 2019-10-29 2019-10-29
US17/082,018 US11489002B2 (en) 2019-10-29 2020-10-28 LED display apparatus
PCT/KR2020/014851 WO2021086026A1 (ko) 2019-10-29 2020-10-29 Led 디스플레이 장치

Publications (1)

Publication Number Publication Date
BR112022008047A2 true BR112022008047A2 (pt) 2022-07-12

Family

ID=75586119

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112022008047A BR112022008047A2 (pt) 2019-10-29 2020-10-29 Aparelho de exibição

Country Status (8)

Country Link
US (4) US11489002B2 (https=)
EP (1) EP4024453A4 (https=)
JP (1) JP7673061B2 (https=)
KR (1) KR102899779B1 (https=)
CN (2) CN114616674A (https=)
BR (1) BR112022008047A2 (https=)
MX (1) MX2022004907A (https=)
WO (1) WO2021086026A1 (https=)

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* Cited by examiner, † Cited by third party
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US11489002B2 (en) * 2019-10-29 2022-11-01 Seoul Viosys Co., Ltd. LED display apparatus
US11437353B2 (en) * 2019-11-15 2022-09-06 Seoul Viosys Co., Ltd. Light emitting device for display and display apparatus having the same
KR102906031B1 (ko) * 2019-11-15 2025-12-30 서울바이오시스 주식회사 디스플레이용 발광 소자를 가지는 디스플레이 패널
CN114078897A (zh) * 2020-08-19 2022-02-22 京东方科技集团股份有限公司 发光器件及其制备方法、显示面板、背光模组和显示装置
US11417703B2 (en) * 2020-08-31 2022-08-16 Hong Kong Beida Jade Bird Display Limited Double color micro LED display panel
US11476299B2 (en) * 2020-08-31 2022-10-18 Hong Kong Beida Jade Bird Display Limited Double color micro LED display panel
US11646300B2 (en) * 2020-09-01 2023-05-09 Jade Bird Display (shanghai) Limited Double color micro LED display panel
CN115117211B (zh) * 2021-03-18 2025-07-01 隆达电子股份有限公司 半导体晶片与发光装置
CN114664983B (zh) * 2022-03-22 2023-03-21 西湖大学 一种基于Micro LED的显示装置的制作方法以及显示装置
CN115394762B (zh) * 2022-05-17 2024-07-09 诺视科技(苏州)有限公司 一种具有透明衬底的像素级分立器件及其制作方法
JP2024092521A (ja) * 2022-12-26 2024-07-08 沖電気工業株式会社 発光装置
US20240322093A1 (en) * 2023-03-23 2024-09-26 Yenrich Technology Corporation Light-emitting module
US20240363820A1 (en) * 2023-04-28 2024-10-31 Seoul Viosys Co., Ltd. Light emitting module and display device having the same
JP7741522B2 (ja) * 2023-06-16 2025-09-18 シャープ株式会社 表示パネル
JP7741521B2 (ja) * 2023-06-16 2025-09-18 シャープ株式会社 表示パネル

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JPH0876697A (ja) * 1994-09-02 1996-03-22 Sharp Corp 発光表示装置
KR101100579B1 (ko) 2005-01-06 2012-01-13 엘지이노텍 주식회사 반도체 발광 다이오드 및 그의 제조 방법과 반도체 발광다이오드를 이용한 디스플레이의 제조 방법
TWI594661B (zh) * 2013-04-19 2017-08-01 隆達電子股份有限公司 發光二極體顯示器及其製造方法
JP5932087B2 (ja) 2015-03-23 2016-06-08 株式会社東芝 光半導体装置
CN105261710B (zh) * 2015-11-19 2017-05-10 深圳市华星光电技术有限公司 显示器及其有机发光二极管器件
KR102605973B1 (ko) * 2016-02-26 2023-11-27 엘지이노텍 주식회사 픽셀 모듈 및 이를 구비한 표시 장치
KR102566499B1 (ko) 2016-05-26 2023-08-11 엘지이노텍 주식회사 발광 소자
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CN111048656B (zh) * 2017-09-04 2024-06-14 首尔半导体株式会社 显示装置及该显示装置的制造方法
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US11901397B2 (en) * 2019-05-14 2024-02-13 Seoul Viosys Co., Ltd. LED chip having fan-out structure and manufacturing method of the same
US11855121B2 (en) * 2019-05-14 2023-12-26 Seoul Viosys Co., Ltd. LED chip and manufacturing method of the same
US11482566B2 (en) * 2019-08-20 2022-10-25 Seoul Viosys Co., Ltd. Light emitting device for display and display apparatus having the same
US11398462B2 (en) * 2019-09-18 2022-07-26 Seoul Viosys Co., Ltd. Light emitting device for display and light emitting package having the same
US11798974B2 (en) * 2019-09-27 2023-10-24 Seoul Viosys Co., Ltd. Light emitting device for display and display apparatus having the same
US10847083B1 (en) * 2019-10-14 2020-11-24 Shaoher Pan Integrated active-matrix light emitting pixel arrays based devices by laser-assisted bonding
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US11658275B2 (en) * 2019-10-28 2023-05-23 Seoul Viosys Co., Ltd. Light emitting device for display and LED display apparatus having the same
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US11489002B2 (en) * 2019-10-29 2022-11-01 Seoul Viosys Co., Ltd. LED display apparatus

Also Published As

Publication number Publication date
US20210126043A1 (en) 2021-04-29
KR102899779B1 (ko) 2025-12-18
US20230053740A1 (en) 2023-02-23
JP2023501923A (ja) 2023-01-20
EP4024453A1 (en) 2022-07-06
EP4024453A4 (en) 2023-10-25
KR20220091457A (ko) 2022-06-30
CN213782016U (zh) 2021-07-23
WO2021086026A1 (ko) 2021-05-06
US20250056953A1 (en) 2025-02-13
US11837625B2 (en) 2023-12-05
MX2022004907A (es) 2022-06-29
CN114616674A (zh) 2022-06-10
US20240120365A1 (en) 2024-04-11
JP7673061B2 (ja) 2025-05-08
US11489002B2 (en) 2022-11-01
US12199133B2 (en) 2025-01-14

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