MX2022004907A - Dispositivo de visualizacion led. - Google Patents
Dispositivo de visualizacion led.Info
- Publication number
- MX2022004907A MX2022004907A MX2022004907A MX2022004907A MX2022004907A MX 2022004907 A MX2022004907 A MX 2022004907A MX 2022004907 A MX2022004907 A MX 2022004907A MX 2022004907 A MX2022004907 A MX 2022004907A MX 2022004907 A MX2022004907 A MX 2022004907A
- Authority
- MX
- Mexico
- Prior art keywords
- unit
- led sub
- light emitting
- emitting elements
- disposed
- Prior art date
Links
- 230000004888 barrier function Effects 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 108010001267 Protein Subunits Proteins 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0756—Stacked arrangements of devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/385—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending at least partially onto a side surface of the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/387—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Un dispositivo de visualización de acuerdo con una realización comprende: un sustrato de visualización; una pluralidad de elementos emisores de luz dispuestos en el sustrato de visualización; capas de barrera de luz dispuestas entre cada par de elementos emisores de luz; y una capa transparente que cubre los elementos emisores de luz y las capas de barrera de luz, en la que cada uno de los elementos emisores de luz comprende: una primera subunidad LED; una segunda subunidad LED dispuesta sobre la primera subunidad LED; y una tercera subunidad LED dispuesta sobre la segunda subunidad LED, estando la tercera subunidad LED dispuesta más cerca de la superficie superior del elemento emisor de luz que la primera subunidad LED.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962927196P | 2019-10-29 | 2019-10-29 | |
US17/082,018 US11489002B2 (en) | 2019-10-29 | 2020-10-28 | LED display apparatus |
PCT/KR2020/014851 WO2021086026A1 (ko) | 2019-10-29 | 2020-10-29 | Led 디스플레이 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2022004907A true MX2022004907A (es) | 2022-06-29 |
Family
ID=75586119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2022004907A MX2022004907A (es) | 2019-10-29 | 2020-10-29 | Dispositivo de visualizacion led. |
Country Status (8)
Country | Link |
---|---|
US (3) | US11489002B2 (es) |
EP (1) | EP4024453A4 (es) |
JP (1) | JP2023501923A (es) |
KR (1) | KR20220091457A (es) |
CN (2) | CN114616674A (es) |
BR (1) | BR112022008047A2 (es) |
MX (1) | MX2022004907A (es) |
WO (1) | WO2021086026A1 (es) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11489002B2 (en) * | 2019-10-29 | 2022-11-01 | Seoul Viosys Co., Ltd. | LED display apparatus |
US11437353B2 (en) * | 2019-11-15 | 2022-09-06 | Seoul Viosys Co., Ltd. | Light emitting device for display and display apparatus having the same |
KR20220100870A (ko) * | 2019-11-15 | 2022-07-18 | 서울바이오시스 주식회사 | 디스플레이용 발광 소자 및 그것을 가지는 디스플레이 장치 |
US11417703B2 (en) * | 2020-08-31 | 2022-08-16 | Hong Kong Beida Jade Bird Display Limited | Double color micro LED display panel |
US11476299B2 (en) * | 2020-08-31 | 2022-10-18 | Hong Kong Beida Jade Bird Display Limited | Double color micro LED display panel |
US11646300B2 (en) * | 2020-09-01 | 2023-05-09 | Jade Bird Display (shanghai) Limited | Double color micro LED display panel |
CN114664983B (zh) * | 2022-03-22 | 2023-03-21 | 西湖大学 | 一种基于Micro LED的显示装置的制作方法以及显示装置 |
CN115394762B (zh) * | 2022-05-17 | 2024-07-09 | 诺视科技(苏州)有限公司 | 一种具有透明衬底的像素级分立器件及其制作方法 |
JP2024092521A (ja) * | 2022-12-26 | 2024-07-08 | 沖電気工業株式会社 | 発光装置 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101100579B1 (ko) | 2005-01-06 | 2012-01-13 | 엘지이노텍 주식회사 | 반도체 발광 다이오드 및 그의 제조 방법과 반도체 발광다이오드를 이용한 디스플레이의 제조 방법 |
TWI594661B (zh) * | 2013-04-19 | 2017-08-01 | 隆達電子股份有限公司 | 發光二極體顯示器及其製造方法 |
KR102566499B1 (ko) | 2016-05-26 | 2023-08-11 | 엘지이노텍 주식회사 | 발광 소자 |
KR102503578B1 (ko) | 2017-06-30 | 2023-02-24 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 |
JP7260526B2 (ja) * | 2017-09-04 | 2023-04-18 | ソウル セミコンダクター カンパニー リミテッド | 表示装置及びその製造方法 |
KR102459573B1 (ko) | 2017-09-14 | 2022-10-27 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 |
JP7222993B2 (ja) * | 2017-11-08 | 2023-02-24 | ソウル バイオシス カンパニー リミテッド | 複数のピクセルを含むディスプレイ用発光ダイオードユニット及びそれを有する表示装置 |
US11527519B2 (en) * | 2017-11-27 | 2022-12-13 | Seoul Viosys Co., Ltd. | LED unit for display and display apparatus having the same |
US11282981B2 (en) * | 2017-11-27 | 2022-03-22 | Seoul Viosys Co., Ltd. | Passivation covered light emitting unit stack |
US10797027B2 (en) * | 2017-12-05 | 2020-10-06 | Seoul Semiconductor Co., Ltd. | Displaying apparatus having light emitting device, method of manufacturing the same and method of transferring light emitting device |
US10748881B2 (en) * | 2017-12-05 | 2020-08-18 | Seoul Viosys Co., Ltd. | Light emitting device with LED stack for display and display apparatus having the same |
US10964674B2 (en) * | 2018-02-06 | 2021-03-30 | Lumens Co., Ltd. | Micro-LED display panel |
KR20190098709A (ko) * | 2018-02-14 | 2019-08-22 | 에피스타 코포레이션 | 발광 장치, 그 제조 방법 및 디스플레이 모듈 |
US11482650B2 (en) * | 2018-11-07 | 2022-10-25 | Seoul Viosys Co., Ltd. | Light emitting device including light shielding layer |
US11476236B2 (en) * | 2018-11-07 | 2022-10-18 | Seoul Viosys Co., Ltd. | Display apparatus |
TWI671489B (zh) * | 2018-11-12 | 2019-09-11 | 台灣愛司帝科技股份有限公司 | 發光二極體顯示器 |
US10943532B2 (en) * | 2018-12-11 | 2021-03-09 | The Hong Kong University Of Science And Technology | Monolithic full-color light-emitting diode display panel |
US11508876B2 (en) * | 2018-12-31 | 2022-11-22 | Seoul Viosys Co., Ltd. | Light emitting device package and display device having the same |
US11211528B2 (en) * | 2019-03-13 | 2021-12-28 | Seoul Viosys Co., Ltd. | Light emitting device for display and display apparatus having the same |
US11587914B2 (en) * | 2019-05-14 | 2023-02-21 | Seoul Viosys Co., Ltd. | LED chip and manufacturing method of the same |
US11756980B2 (en) * | 2019-05-14 | 2023-09-12 | Seoul Viosys Co., Ltd. | LED chip package and manufacturing method of the same |
US11855121B2 (en) * | 2019-05-14 | 2023-12-26 | Seoul Viosys Co., Ltd. | LED chip and manufacturing method of the same |
US11901397B2 (en) * | 2019-05-14 | 2024-02-13 | Seoul Viosys Co., Ltd. | LED chip having fan-out structure and manufacturing method of the same |
US11482566B2 (en) * | 2019-08-20 | 2022-10-25 | Seoul Viosys Co., Ltd. | Light emitting device for display and display apparatus having the same |
US11398462B2 (en) * | 2019-09-18 | 2022-07-26 | Seoul Viosys Co., Ltd. | Light emitting device for display and light emitting package having the same |
US11798974B2 (en) * | 2019-09-27 | 2023-10-24 | Seoul Viosys Co., Ltd. | Light emitting device for display and display apparatus having the same |
US10847083B1 (en) * | 2019-10-14 | 2020-11-24 | Shaoher Pan | Integrated active-matrix light emitting pixel arrays based devices by laser-assisted bonding |
US11810944B2 (en) * | 2019-10-23 | 2023-11-07 | Seoul Viosys Co., Ltd. | LED display apparatus |
US11817435B2 (en) * | 2019-10-28 | 2023-11-14 | Seoul Viosys Co., Ltd. | Light emitting device for display and LED display apparatus having the same |
US11658275B2 (en) * | 2019-10-28 | 2023-05-23 | Seoul Viosys Co., Ltd. | Light emitting device for display and LED display apparatus having the same |
US11489002B2 (en) * | 2019-10-29 | 2022-11-01 | Seoul Viosys Co., Ltd. | LED display apparatus |
-
2020
- 2020-10-28 US US17/082,018 patent/US11489002B2/en active Active
- 2020-10-29 KR KR1020227004596A patent/KR20220091457A/ko active Search and Examination
- 2020-10-29 CN CN202080075517.0A patent/CN114616674A/zh active Pending
- 2020-10-29 JP JP2022524027A patent/JP2023501923A/ja active Pending
- 2020-10-29 BR BR112022008047A patent/BR112022008047A2/pt unknown
- 2020-10-29 MX MX2022004907A patent/MX2022004907A/es unknown
- 2020-10-29 CN CN202022457435.2U patent/CN213782016U/zh active Active
- 2020-10-29 EP EP20882978.8A patent/EP4024453A4/en active Pending
- 2020-10-29 WO PCT/KR2020/014851 patent/WO2021086026A1/ko unknown
-
2022
- 2022-10-30 US US17/976,864 patent/US11837625B2/en active Active
-
2023
- 2023-12-04 US US18/527,987 patent/US20240120365A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2021086026A1 (ko) | 2021-05-06 |
BR112022008047A2 (pt) | 2022-07-12 |
US20240120365A1 (en) | 2024-04-11 |
CN213782016U (zh) | 2021-07-23 |
US20230053740A1 (en) | 2023-02-23 |
KR20220091457A (ko) | 2022-06-30 |
CN114616674A (zh) | 2022-06-10 |
US11489002B2 (en) | 2022-11-01 |
JP2023501923A (ja) | 2023-01-20 |
US11837625B2 (en) | 2023-12-05 |
US20210126043A1 (en) | 2021-04-29 |
EP4024453A4 (en) | 2023-10-25 |
EP4024453A1 (en) | 2022-07-06 |
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