WO2012001478A3 - 具有精密涂布之波长转换层之晶圆式发光装置 - Google Patents

具有精密涂布之波长转换层之晶圆式发光装置 Download PDF

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Publication number
WO2012001478A3
WO2012001478A3 PCT/IB2011/001463 IB2011001463W WO2012001478A3 WO 2012001478 A3 WO2012001478 A3 WO 2012001478A3 IB 2011001463 W IB2011001463 W IB 2011001463W WO 2012001478 A3 WO2012001478 A3 WO 2012001478A3
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
wafer
emitting device
type light
conversion layer
Prior art date
Application number
PCT/IB2011/001463
Other languages
English (en)
French (fr)
Other versions
WO2012001478A2 (zh
Inventor
刘文煌
张源孝
高弘任
邓仲哲
樊峰旭
朱振甫
Original Assignee
旭明光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旭明光电股份有限公司 filed Critical 旭明光电股份有限公司
Priority to KR1020127032211A priority Critical patent/KR20130007666A/ko
Priority to JP2013514797A priority patent/JP2013528954A/ja
Publication of WO2012001478A2 publication Critical patent/WO2012001478A2/zh
Publication of WO2012001478A3 publication Critical patent/WO2012001478A3/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

本发明系关于一种晶圆式发光装置，其包含：一基底；一或多个发光半导体，形成在该基底上；一或多个框架，配置在该发光半导体的上方；以及一或多层波长转换层，施加在借由该一或多个框架所局限的该发光半导体上，其中该晶圆式发光装置被切割成复数个分离的发光单元。
PCT/IB2011/001463 2010-06-29 2011-06-24 具有精密涂布之波长转换层之晶圆式发光装置 WO2012001478A2 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020127032211A KR20130007666A (ko) 2010-06-29 2011-06-24 정밀코팅된 파장변환층을 가지는 웨이퍼-타입 발광장치
JP2013514797A JP2013528954A (ja) 2010-06-29 2011-06-24 精密塗布の波長変換層を具えたウエハータイプ発光装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW99121311 2010-06-29
TW099121311A TW201201419A (en) 2010-06-29 2010-06-29 Wafer-type light emitting device having precisely coated wavelength-converting layer

Publications (2)

Publication Number Publication Date
WO2012001478A2 WO2012001478A2 (zh) 2012-01-05
WO2012001478A3 true WO2012001478A3 (zh) 2012-03-01

Family

ID=45351689

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2011/001463 WO2012001478A2 (zh) 2010-06-29 2011-06-24 具有精密涂布之波长转换层之晶圆式发光装置

Country Status (5)

Country Link
US (1) US8648370B2 (zh)
JP (1) JP2013528954A (zh)
KR (1) KR20130007666A (zh)
TW (1) TW201201419A (zh)
WO (1) WO2012001478A2 (zh)

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DE102012217521A1 (de) * 2012-09-27 2014-03-27 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US9748443B2 (en) 2013-03-18 2017-08-29 Epistar Corporation Light emitting device
US9196806B2 (en) * 2013-03-18 2015-11-24 Epistar Corporation Light emitting device
CN105378952B (zh) * 2013-05-13 2018-01-12 首尔半导体（株） 发光器件封装件及其制造方法以及包含该发光器件封装件的车灯和背光单元
TWM496848U (zh) * 2014-07-30 2015-03-01 Yu-Yu Gao 螢光複合樹脂基板白光發光二極體
TWI550901B (zh) * 2014-07-30 2016-09-21 Yu-Yu Gao Fluorescent composite resin substrate white light emitting diode device and manufacturing method thereof
KR102222580B1 (ko) 2014-07-30 2021-03-05 삼성전자주식회사 발광 소자 패키지 및 이를 포함하는 표시 장치
DE102014116080A1 (de) * 2014-11-04 2016-05-04 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
CN107210344B (zh) * 2014-11-18 2020-05-15 首尔半导体株式会社 发光装置及包括该发光装置的车辆用照明灯
DE102015107516A1 (de) * 2015-05-13 2016-11-17 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen einer Linse für eine optoelektronische Leuchtvorrichtung
WO2020182313A1 (en) * 2019-03-14 2020-09-17 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
JP7330755B2 (ja) 2019-05-16 2023-08-22 スタンレー電気株式会社 発光装置

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CN1665041A (zh) * 2001-01-24 2005-09-07 日亚化学工业株式会社 发光二极管及其制造方法
CN101088172A (zh) * 2004-11-03 2007-12-12 特里多尼克光电子有限公司 具有颜色转换材料的发光二极管排布
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Also Published As

Publication number Publication date
JP2013528954A (ja) 2013-07-11
KR20130007666A (ko) 2013-01-18
US8648370B2 (en) 2014-02-11
TW201201419A (en) 2012-01-01
WO2012001478A2 (zh) 2012-01-05
US20110316017A1 (en) 2011-12-29

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